EPM570F256C3 vs EPM570F256C3N Comparação
Comparação detalhada lado a lado de EPM570F256C3 por Intel e EPM570F256C3N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EPM570F256C3 | EPM570F256C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $14,85 | $13,75 |
| Family | MAX II | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements / Macro Cells | 440 Logic Elements (~570 macro cells equivalent) | — |
| Maximum Operating Frequency | 304 MHz | 304 MHz |
| Propagation Delay (tPD) | [DATA_NEEDED: tPD in ns] | — |
| User I/O Count | 80 (max for F256 package) | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| User Flash Memory | 8 Kbits | — |
| Supply Voltage - Core | 2.5 V / 3.3 V (MultiVolt core) | — |
| Supply Voltage - I/O | 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) | — |
| Process Technology | 0.18 µm | 0.18 um, 6-layer-metal flash CMOS |
| Encapsulamento | 256-FBGA (FineLine BGA) 17 × 17 mm | 256-ball FBGA (FineLine BGA) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1) - ISP | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| Configuration Memory | Non-volatile on-chip flash | — |
| Temperatura de operação | Commercial: 0 °C to +85 °C (C3 grade) | — |
| Status RoHS | Compliant | Compliant (per DigiKey listing) |
| Lead-Free | Yes | Yes (per suffix 'N' convention) |
| Design Software | Quartus II / Quartus Prime (legacy support) | — |
| Logic Elements (LEs) | — | 570 |
| Equivalent Macrocells | — | 440 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Core Voltage | — | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Operating Temperature (C3 grade) | — | 0 C to +85 C (commercial) |
| Nível MSL | — | [DATA_NEEDED: MSL level not stated in provided data] |
| Typical Macroscopic Functions | — | Glue logic, bus bridging, I/O expansion, power sequencing |