EPM570F256C3 vs EPM570F256C3N Vergleich

Detaillierter Direktvergleich von EPM570F256C3 von Intel und EPM570F256C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPM570F256C3 EPM570F256C3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $14,85 $13,75
Family MAX II MAX II
Device Type CPLD (Complex Programmable Logic Device) —
Logic Elements / Macro Cells 440 Logic Elements (~570 macro cells equivalent) —
Maximum Operating Frequency 304 MHz 304 MHz
Propagation Delay (tPD) [DATA_NEEDED: tPD in ns] —
User I/O Count 80 (max for F256 package) [DATA_NEEDED: confirm exact user-IO count for F256 package]
User Flash Memory 8 Kbits —
Supply Voltage - Core 2.5 V / 3.3 V (MultiVolt core) —
Supply Voltage - I/O 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) —
Process Technology 0.18 µm 0.18 um, 6-layer-metal flash CMOS
Gehäuse 256-FBGA (FineLine BGA) 17 × 17 mm 256-ball FBGA (FineLine BGA)
Montageart Surface Mount Surface Mount
Programming Interface JTAG (IEEE 1149.1) - ISP JTAG (IEEE 1532 / IEEE 1149.1) + ISP
Configuration Memory Non-volatile on-chip flash —
Betriebstemperatur Commercial: 0 °C to +85 °C (C3 grade) —
RoHS-Status Compliant Compliant (per DigiKey listing)
Lead-Free Yes Yes (per suffix 'N' convention)
Design Software Quartus II / Quartus Prime (legacy support) —
Logic Elements (LEs) — 570
Equivalent Macrocells — 440
User Flash Memory (UFM) — 8 Kbits
Core Voltage — 2.5 V / 3.3 V
I/O Voltage Support (MultiVolt) — 1.5 V, 1.8 V, 2.5 V, 3.3 V
Operating Temperature (C3 grade) — 0 C to +85 C (commercial)
MSL-Level — [DATA_NEEDED: MSL level not stated in provided data]
Typical Macroscopic Functions — Glue logic, bus bridging, I/O expansion, power sequencing

Datenblätter & Ressourcen

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