IPP120N04S4-02 vs IRF3205STRLPBF Comparação

Comparação detalhada lado a lado de IPP120N04S4-02 por Infineon e IRF3205STRLPBF por Infineon. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Comparação de especificações

Parâmetro IPP120N04S4-02 IRF3205STRLPBF
Marca Infineon Infineon
Categoria MOSFETs MOSFETs
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $1,72 $1,02
Manufacturer Infineon Technologies —
Part Family OptiMOS-T2 —
FET Type N-Channel MOSFET, Enhancement Mode —
Drain-to-Source Voltage (V<sub>DSS</sub>) 40 V —
Continuous Drain Current (I<sub>D</sub>, T<sub>C</sub>=25 degC) 120 A —
Pulsed Drain Current (I<sub>DM</sub>) 480 A —
R<sub>DS(on)</sub> max @ V<sub>GS</sub>=10 V 1.9 mOhm (DigiKey listing); 1.8 mOhm (Infineon product page) —
Gate Threshold Voltage (V<sub>GS(th)</sub>) [DATA_NEEDED: typical V_GS(th) and V_GS range] —
Maximum Power Dissipation (P<sub>D</sub>, T<sub>C</sub>=25 degC) 158 W —
Temperatura de junção de operação -55 degC to +175 degC —
Package / Mounting Type PG-TO220-3-1 (TO-220-3, through-hole) —
AEC Qualification AEC qualified (automotive) —
MSL (Moisture Sensitivity Level) MSL1, 260 degC peak reflow —
Avalanche Rating 100% avalanche tested —
RoHS / Lead-Free RoHS compliant (Green Product), lead-free —
Contagem de pinos 3 (Gate, Drain, Source) —
Single Pulse Avalanche Energy (E<sub>AS</sub>) [DATA_NEEDED: E_AS] —
Thermal Resistance Junction-to-Case (R<sub>thJC</sub>) [DATA_NEEDED: R_thJC degC/W] —
Polarity — N-Channel
MOSFET Operating Mode — Enhancement
Drain-Source Voltage (Vdss) — 55 V
Continuous Drain Current (Id) @ Tc=25°C — 110 A
Pulsed Drain Current (Idm) — 390 A
Static Drain-Source On-Resistance (Rds(on)) — 8 mΩ max @ Vgs=10V
Gate-Source Threshold Voltage (Vgs(th)) — 2.0 V to 4.0 V
Total Gate Charge (Qg) — 97.3 nC typical
Power Dissipation (Pd) @ Tc=25°C — 200 W
Faixa de temperatura de operação — -55 °C to +175 °C (Tj)
Encapsulamento — TO-263-3 (D2PAK)
Tipo de montagem — Surface Mount
Lead-Free / RoHS Status — Lead-Free / RoHS Compliant (PBF suffix)
Technology — HEXFET (advanced process)
Packaging — Tape & Reel (STRL)

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