K3K8K80BM-JGCT vs K3LK8L80CM-MGCT Comparação

Comparação detalhada lado a lado de K3K8K80BM-JGCT por Samsung Electronics e K3LK8L80CM-MGCT por Samsung Electronics. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Samsung Electronics
K3K8K80BM-JGCT K3K8K80BM-JGCT - Samsung LPDDR DRAM Memory IC | Samsung Electronics

K3K8K80BM-JGCT - Samsung LPDDR DRAM Memory IC | Samsung Electronics

K3K8K80BM-JGCT ✓ Ativo
Samsung Electronics
K3LK8L80CM-MGCT K3LK8L80CM-MGCT - LPDDR5X 32Gbit DRAM FBGA-315 | Samsung

K3LK8L80CM-MGCT - LPDDR5X 32Gbit DRAM FBGA-315 | Samsung

K3LK8L80CM-MGCT ✓ Ativo

Comparação de especificações

Parâmetro K3K8K80BM-JGCT K3LK8L80CM-MGCT
Marca Samsung Electronics Samsung Electronics
Categoria Memory ICs Memory ICs
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $3,10 $0,00
Manufacturer Samsung Electronics —
Product Family K3K mobile DRAM (LPDDR) component series —
Tipo de memória Low Power DRAM (LPDDR) component LPDDR5X SDRAM
Density [DATA_NEEDED: die density in Gb] 32 Gbit (4 GB)
Organização da memória [DATA_NEEDED: x8/x16 organization] x32
Interface [DATA_NEEDED: LPDDR4X or LPDDR5] LPDDR5X (JEDEC low-power DDR)
Maximum Data Rate [DATA_NEEDED: Mbps] —
Supply Voltage (VDD) [DATA_NEEDED: core supply voltage] —
Supply Voltage (VDDQ) [DATA_NEEDED: I/O supply voltage] —
Package Type FBGA (Ball Grid Array) —
Ball Count [DATA_NEEDED: package ball count] —
Tipo de montagem Surface Mount Surface Mount (BGA)
Temperatura de operação [DATA_NEEDED: operating temperature range] -25C to +85C
Speed Grade Suffix J (per Samsung speed-grade coding) CM-MGCT
Packing Suffix CT (per Samsung packing-code convention) —
Status RoHS [DATA_NEEDED: RoHS compliance] Compliant (per JLCPCB listing)
Nível MSL [DATA_NEEDED: moisture sensitivity level] [DATA_NEEDED: MSL level]
Max Data Rate — 7500 Mbps
Supply Voltages — 0.5 V, 900 mV, 1.05 V, 1.8 V (multi-rail)
Encapsulamento — FBGA-315 (315-ball)
Power Efficiency — ~25% improvement vs LPDDR5
Application Class — Mobile, PC, automotive, on-device AI
Package Family — FBGA -> BGA -> surface mount
Typical End Products — Smartphones, tablets, edge AI devices
Refresh / Standby Modes — Self-refresh, deep power-down (per LPDDR5X protocol)

Fichas técnicas e recursos

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