M1AFS250-1FGG256I vs M1AFS600-1FGG256 Comparação
Comparação detalhada lado a lado de M1AFS250-1FGG256I por Microchip Technology e M1AFS600-1FGG256 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ AtivoMicrochip Technology
M1AFS600-1FGG256 - Fusion FPGA, Cortex-M1, 600K Gates | Microchip
M1AFS600-1FGG256 ✓ AtivoComparação de especificações
| Parâmetro | M1AFS250-1FGG256I | M1AFS600-1FGG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $0,00 | $191,10 |
| Series | M1AFS250 (Fusion) | — |
| System Gates | 250,000 gates | 600000 |
| Logic Cells | 6144 | — |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | 36864 | — |
| Number of I/O | 114 | — |
| Maximum System Frequency | 350 MHz | — |
| Processor Core | ARM Cortex-M1 (optional ARM support, M1 variant) | ARM Cortex-M1 (hard core) |
| Technology | 130-nm, 7-layer metal, flash-based CMOS | — |
| Configuration Memory | Nonvolatile flash (Live at Power-Up, LAPU) | Flash (non-volatile, live at power-up) |
| Security | 128-bit flash-based lock, AES decryption | — |
| Tensão de alimentação de operação | 1.5 V | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Encapsulamento / Caixa | 256-LBGA (FBGA), 1.00 mm ball pitch | — |
| Estilo de montagem | SMD/SMT | — |
| Packaging | Tray | Tray |
| Mixed-Signal Features | Configurable analog, flash memory blocks, clock generation and management | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Family | — | Fusion Mixed-Signal FPGA |
| Configurable Logic Blocks (CLBs) | — | 13824 |
| Flip-Flops | — | 110592 |
| User I/O | — | 119 |
| Core Supply Voltage | — | 1.5 V |
| Process Technology | — | 130 nm CMOS, flash-based |
| Temperatura de operação | — | 0C to +85C |
| Encapsulamento | — | 256-ball LBGA (FGG256), 17x17x1.7 mm |
| Tipo de montagem | — | Surface Mount |
| Analog Features | — | Configurable analog blocks, clock generation and management |