M1AFS250-1FGG256I vs M1AFS600-1FGG256 비교

다음의 상세 나란히 비교: M1AFS250-1FGG256I 제조: Microchip Technology 및 M1AFS600-1FGG256 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

Microchip Technology
M1AFS250-1FGG256I M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I ✓ 활성
Microchip Technology
M1AFS600-1FGG256 M1AFS600-1FGG256 - Fusion FPGA, Cortex-M1, 600K Gates | Microchip

M1AFS600-1FGG256 - Fusion FPGA, Cortex-M1, 600K Gates | Microchip

M1AFS600-1FGG256 ✓ 활성

사양 비교

파라미터 M1AFS250-1FGG256I M1AFS600-1FGG256
브랜드 Microchip Technology Microchip Technology
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 활성 활성
재고 상태 In Stock In Stock
단가 (USD) $0.00 $191.10
Series M1AFS250 (Fusion) —
System Gates 250,000 gates 600000
Logic Cells 6144 —
Total SRAM/Flip-Flop Bits (DigiKey listing) 36864 —
Number of I/O 114 —
Maximum System Frequency 350 MHz —
Processor Core ARM Cortex-M1 (optional ARM support, M1 variant) ARM Cortex-M1 (hard core)
Technology 130-nm, 7-layer metal, flash-based CMOS —
Configuration Memory Nonvolatile flash (Live at Power-Up, LAPU) Flash (non-volatile, live at power-up)
Security 128-bit flash-based lock, AES decryption —
동작 공급 전압 1.5 V —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
패키지 / 케이스 256-LBGA (FBGA), 1.00 mm ball pitch —
장착 스타일 SMD/SMT —
Packaging Tray Tray
Mixed-Signal Features Configurable analog, flash memory blocks, clock generation and management —
RoHS 상태 [DATA_NEEDED: RoHS status] Compliant
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
Family — Fusion Mixed-Signal FPGA
Configurable Logic Blocks (CLBs) — 13824
Flip-Flops — 110592
User I/O — 119
Core Supply Voltage — 1.5 V
Process Technology — 130 nm CMOS, flash-based
동작 온도 — 0C to +85C
패키지 — 256-ball LBGA (FGG256), 17x17x1.7 mm
실장 유형 — Surface Mount
Analog Features — Configurable analog blocks, clock generation and management

데이터시트 & 자료

모든 제품 보기 BOM 생성 견적 요청