M7AFS600-FG484 vs M7AFS600-1FG484I Comparação
Comparação detalhada lado a lado de M7AFS600-FG484 por Microchip Technology e M7AFS600-1FG484I por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
M7AFS600-FG484 - Fusion FPGA 600K Gates, ARM CoreMP7 | Microchip
M7AFS600-FG484 ✓ AtivoMicrochip Technology
M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip
M7AFS600-1FG484I ✓ AtivoComparação de especificações
| Parâmetro | M7AFS600-FG484 | M7AFS600-1FG484I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $236,00 | $198,00 |
| Manufacturer Part Number | M7AFS600-FG484 | — |
| Series | M7AFS600 (Fusion) | — |
| System Gates | 600K | 600000 |
| Logic Elements (VersaTiles) | 110592 | — |
| Number of I/Os | 172 | — |
| Embedded Processor | ARM CoreMP7 | — |
| Tensão de alimentação de operação | 1.5 V | — |
| Technology | 130 nm Flash | — |
| Maximum Operating Frequency | 1098.9 MHz | — |
| Encapsulamento / Caixa | 484-ball FBGA (FG484) | — |
| Package Dimensions | 23 x 23 x 2.44 mm | — |
| Minimum Operating Temperature | 0 C | — |
| Maximum Operating Temperature | +70 C | — |
| Estilo de montagem | SMD/SMT | — |
| Packaging | Tray | — |
| RoHS Compliant | Yes | — |
| Programmability Type | In-System Programmable (flash-based, non-volatile) | — |
| Programmable Logic Tiles | — | 110592 |
| User I/O | — | 172 |
| Family | — | Fusion (Flash FPGA with optional ARM CoreMP7 support) |
| Process Technology | — | 130 nm, 7-layer metal, Flash-based CMOS |
| Configuration Memory | — | Nonvolatile Flash, retains program when powered off |
| Power-Up Feature | — | Live at Power-Up (LAPU) |
| Supply Voltage (Core) | — | 1.5 V |
| Logic Family | — | CMOS |
| Speed Grade | — | 1 |
| Encapsulamento | — | 484-ball FBGA (FG484), 23 x 23 x 2.44 mm |
| Ball Pitch | — | 1.0 mm |
| Temperatura de operação | — | Industrial, -40C to +85C |
| Tipo de montagem | — | Surface Mount |
| Embedded Processor Support | — | ARM CoreMP7 |
| Status RoHS | — | Compliant |