MC33887DWBR2 vs MCZ33287EG Comparação

Comparação detalhada lado a lado de MC33887DWBR2 por NXP Semiconductors e MCZ33287EG por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MCZ33287EG MCZ33287EG - Contact Monitor + Dual Low-Side Driver SOIC-20

MCZ33287EG - Contact Monitor + Dual Low-Side Driver SOIC-20

MCZ33287EG ✓ Ativo

Comparação de especificações

Parâmetro MC33887DWBR2 MCZ33287EG
Marca NXP Semiconductors NXP Semiconductors
Categoria Motor Drivers Interface ICs
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $3,55 $3,15
Função H-Bridge Motor Driver with Load Current Feedback Contact Monitoring + Dual Low-Side Protected Driver
Configuração de saída Half-Bridge / Full-Bridge (H-Bridge) —
Supply Voltage (VDD) 5.0 V to 28 V —
Continuous Load Current 5.0 A —
Peak Load Current 5.0 A (FET protected at higher transients) —
RDS(ON) per MOSFET (typical) [DATA_NEEDED: RDS(ON) at 25C] —
PWM Frequency (max) 20 kHz —
Load Current Feedback Output Yes (analog voltage proportional to IA) —
Control Inputs IN1, IN2 (logic-level inputs) —
Sleep Mode Current [DATA_NEEDED: ISLEEP typ] —
Faixa de temperatura de operação -40C to +125C Automotive grade
Encapsulamento / Caixa 54-SOIC (exposed pad, HSSOP) —
Tipo de montagem Surface Mount Surface Mount
Fault Protection Overcurrent, Overtemperature, Undervoltage Lockout (per datasheet) —
Nível MSL [DATA_NEEDED: MSL classification] —
Status RoHS Compliant RoHS Compliant
Origin / Manufacturing Tier Automotive-grade (per distributor product family) —
Contact Sense Inputs — 8 (switch-to-battery or switch-to-ground)
Low-Side Driver Outputs — 2 (internal N-channel MOSFETs)
Supply Voltage Range — [DATA_NEEDED: VCC operating range]
Low-Side Output Current — [DATA_NEEDED: continuous output current per channel]
On-Resistance (Low-Side FET) — [DATA_NEEDED: RDS(on) per channel]
Temperature Grade — Automotive
Encapsulamento — 20-SOIC (0.295 inch, 7.50 mm width)
Terminal Form — Gull Wing
Number of Terminals — 20
Package Code — SOP
Package Shape — Rectangular
Lead Free Status — Lead Free
Architecture — Buffer or inverter-based peripheral driver
Internal Protection — Thermal shutdown on low-side drivers

Fichas técnicas e recursos

Ver todos os produtos Criar BOM Solicitar cotação