MC33887DWBR2 vs MCZ33287EG 对比
详细并排对比 MC33887DWBR2 出自 NXP Semiconductors 和 MCZ33287EG 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MC33887DWBR2 - 5A H-Bridge Motor Driver with Load Current Feedback | NXP
MC33887DWBR2 ✓ 量产中
规格对比
| 参数 | MC33887DWBR2 | MCZ33287EG |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Motor Drivers | Interface ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3.55 | $3.15 |
| 功能 | H-Bridge Motor Driver with Load Current Feedback | Contact Monitoring + Dual Low-Side Protected Driver |
| 输出配置 | Half-Bridge / Full-Bridge (H-Bridge) | — |
| Supply Voltage (VDD) | 5.0 V to 28 V | — |
| Continuous Load Current | 5.0 A | — |
| Peak Load Current | 5.0 A (FET protected at higher transients) | — |
| RDS(ON) per MOSFET (typical) | [DATA_NEEDED: RDS(ON) at 25C] | — |
| PWM Frequency (max) | 20 kHz | — |
| Load Current Feedback Output | Yes (analog voltage proportional to IA) | — |
| Control Inputs | IN1, IN2 (logic-level inputs) | — |
| Sleep Mode Current | [DATA_NEEDED: ISLEEP typ] | — |
| 工作温度范围 | -40C to +125C | Automotive grade |
| 封装 / 外壳 | 54-SOIC (exposed pad, HSSOP) | — |
| 安装类型 | Surface Mount | Surface Mount |
| Fault Protection | Overcurrent, Overtemperature, Undervoltage Lockout (per datasheet) | — |
| MSL 等级 | [DATA_NEEDED: MSL classification] | — |
| RoHS 状态 | Compliant | RoHS Compliant |
| Origin / Manufacturing Tier | Automotive-grade (per distributor product family) | — |
| Contact Sense Inputs | — | 8 (switch-to-battery or switch-to-ground) |
| Low-Side Driver Outputs | — | 2 (internal N-channel MOSFETs) |
| Supply Voltage Range | — | [DATA_NEEDED: VCC operating range] |
| Low-Side Output Current | — | [DATA_NEEDED: continuous output current per channel] |
| On-Resistance (Low-Side FET) | — | [DATA_NEEDED: RDS(on) per channel] |
| Temperature Grade | — | Automotive |
| 封装 | — | 20-SOIC (0.295 inch, 7.50 mm width) |
| Terminal Form | — | Gull Wing |
| Number of Terminals | — | 20 |
| Package Code | — | SOP |
| Package Shape | — | Rectangular |
| Lead Free Status | — | Lead Free |
| Architecture | — | Buffer or inverter-based peripheral driver |
| Internal Protection | — | Thermal shutdown on low-side drivers |