MC33887DWBR2 vs MCZ33287EG Vergleich

Detaillierter Direktvergleich von MC33887DWBR2 von NXP Semiconductors und MCZ33287EG von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MCZ33287EG MCZ33287EG - Contact Monitor + Dual Low-Side Driver SOIC-20

MCZ33287EG - Contact Monitor + Dual Low-Side Driver SOIC-20

MCZ33287EG ✓ Aktiv

Spezifikationsvergleich

Parameter MC33887DWBR2 MCZ33287EG
Marke NXP Semiconductors NXP Semiconductors
Kategorie Motor Drivers Interface ICs
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $3,55 $3,15
Funktion H-Bridge Motor Driver with Load Current Feedback Contact Monitoring + Dual Low-Side Protected Driver
Ausgangskonfiguration Half-Bridge / Full-Bridge (H-Bridge) —
Supply Voltage (VDD) 5.0 V to 28 V —
Continuous Load Current 5.0 A —
Peak Load Current 5.0 A (FET protected at higher transients) —
RDS(ON) per MOSFET (typical) [DATA_NEEDED: RDS(ON) at 25C] —
PWM Frequency (max) 20 kHz —
Load Current Feedback Output Yes (analog voltage proportional to IA) —
Control Inputs IN1, IN2 (logic-level inputs) —
Sleep Mode Current [DATA_NEEDED: ISLEEP typ] —
Betriebstemperaturbereich -40C to +125C Automotive grade
Gehäuse / Bauform 54-SOIC (exposed pad, HSSOP) —
Montageart Surface Mount Surface Mount
Fault Protection Overcurrent, Overtemperature, Undervoltage Lockout (per datasheet) —
MSL-Level [DATA_NEEDED: MSL classification] —
RoHS-Status Compliant RoHS Compliant
Origin / Manufacturing Tier Automotive-grade (per distributor product family) —
Contact Sense Inputs — 8 (switch-to-battery or switch-to-ground)
Low-Side Driver Outputs — 2 (internal N-channel MOSFETs)
Supply Voltage Range — [DATA_NEEDED: VCC operating range]
Low-Side Output Current — [DATA_NEEDED: continuous output current per channel]
On-Resistance (Low-Side FET) — [DATA_NEEDED: RDS(on) per channel]
Temperature Grade — Automotive
Gehäuse — 20-SOIC (0.295 inch, 7.50 mm width)
Terminal Form — Gull Wing
Number of Terminals — 20
Package Code — SOP
Package Shape — Rectangular
Lead Free Status — Lead Free
Architecture — Buffer or inverter-based peripheral driver
Internal Protection — Thermal shutdown on low-side drivers

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern