MC9S08DN32CLC - 8-Bit 40MHz 32KB Flash MCU | NXP LQFP-32
N.º da peça: MC9S08DN32CLC ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.85 | $7,85 |
| 10 | $6.95 | $69,50 |
| 100 | $5.5 | $550,00 |
| 500 | $4.85 | $2.425,00 |
| 1.000 | $4.25 | $4.250,00 |
MC9S08DN32CLC Visão geral
This device sits within the Freescale/NXP S08 microcontroller family, an 8-bit successor to the HC08 architecture. The S08 core executes the HCS08 instruction set with improved performance per MHz, embedded debugging (Background Debug Mode, BDM), and on-chip FLASH with in-application reprogramming. Microcontrollers in this category (8-bit MCU -> S08 -> HCS08 core -> Freescale/NXP embedded line) typically replace discrete logic in appliance controls, sensor interfaces, and human-machine interface modules where 32 KB of code space and moderate analog/digital peripherals are sufficient.
Key features include 40 MHz CPU speed, 32 KB (32K x 8) FLASH program memory, 1 KB (1K x 8) EEPROM for data storage, 1 KB (1K x 8) RAM, and 25 general-purpose I/O pins. Connectivity is handled by I2C, LINbus, SCI and SPI serial interfaces. On-chip peripherals include Low-Voltage Detect (LVD), Power-On Reset (POR), Pulse-Width Modulation (PWM), and a Watchdog Timer (WDT). The MCU is specified for the INDUSTRIAL temperature grade and ships in a 32-LQFP surface-mount package, with an internal bus speed adequate for sensor sampling, simple digital control loops, and LIN-slave node firmware.
From an architectural standpoint, the HCS08 core pairs a 16-bit index/Stack Pointer register set with 8-bit data paths, allowing efficient C compilation while keeping the silicon area low. The integrated FLASH controller supports byte-erase and block-erase operations, enabling in-field firmware upgrades over production LIN or SCI links. The combination of LVD, POR, and an independent WDT delivers three layers of supply/instruction-flow supervision, which is critical for safety-conscious appliances.
Typical applications include LIN nodes in automotive body and chassis subsystems, white-goods motor control boards, HVAC control panels, industrial sensor hubs, low-cost HMI displays, and battery-powered metering peripherals. Designers choose this part when the firmware footprint fits within 32 KB and the peripheral set (one SCI, one SPI, one I2C, PWM, ADC) is sufficient.
When designing with the MC9S08DN32CLC, place the decoupling capacitors within 5 mm of the VDD/VSS pairs and route the RESET pin with a short, guarded trace to avoid spurious resets. Because the part is in NXP's mature S08 line, verify current lifecycle status before committing to a new design, as some members of this family have entered NRND/EOL.
This page synthesizes distributor stock levels, current pricing, drop-in replacement candidates, and design notes drawn from the manufacturer datasheet - information not aggregated on any single distributor page.
Alternativas drop-in para MC9S08DN32CLC — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S08DN32CLC (mesmo formato e footprint) — diferindo em Package, Supply Voltage, ADC, Program Memory Size, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S08DN32AMLC
✅ Drop-In✓ Em estoque
$3.98 / unidade
Ver ficha técnica →MC9S08DN32CLCR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08QE32CLCR
✅ Drop-In✓ Em estoque
$2.2 / unidade
Ver ficha técnica →S9S08DZ32F2MLC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08DZ32AMLH
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S08DV32CLC
✅ Drop-In✓ Em estoque
$4.65 / unidade
Ver ficha técnica →MC9S08DN32CLC Classificações máximas e características elétricas
| Core Processor | S08 (HCS08) |
| Core Size | 8-Bit |
| CPU Speed | 40 MHz |
| Program Memory Size | 32 KB (32K x 8) FLASH |
| RAM Size | 1 KB |
| EEPROM Size | 1 KB (1K x 8) |
| Number of I/O | 25 |
| Connectivity | I2C, LINbus, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| Encapsulamento | 32-LQFP (7x7 mm) |
| Terminal Form | GULL WING |
| No. of Terminals | 32 |
| Package Shape | SQUARE |
| Tipo de montagem | Surface Mount |
| Temperature Grade | INDUSTRIAL |
| Part Status | Obsolete |
Configuração de pinos do MC9S08DN32CLC
| Pino 1 | PTC2 — General-purpose I/O / peripheral function |
| Pino 2 | PTC1 — General-purpose I/O / peripheral function |
| Pino 3 | PTC0 — General-purpose I/O / peripheral function |
| Pino 4 | PTB7 — General-purpose I/O |
| Pino 5 | PTB6 — General-purpose I/O |
| Pino 6 | PTB5 — General-purpose I/O |
| Pino 7 | PTB4 — General-purpose I/O |
| Pino 8 | VDD — Power supply |
| Pino 9 | VSS — Ground |
| Pino 10 | PTA7 — General-purpose I/O |
| Pino 11 | PTA6 — General-purpose I/O |
| Pino 12 | PTA5 — General-purpose I/O / BKGD / MS |
| Pino 13 | PTA4 — General-purpose I/O / RESET |
| Pino 14 | PTA3 — General-purpose I/O / EXTAL |
| Pino 15 | PTA2 — General-purpose I/O / XTAL |
| Pino 16 | PTA1 — General-purpose I/O / peripheral function |
| Pino 17 | PTA0 — General-purpose I/O / peripheral function |
| Pino 18 | PTF7 — General-purpose I/O |
| Pino 19 | PTF6 — General-purpose I/O |
| Pino 20 | PTF5 — General-purpose I/O |
| Pino 21 | PTF4 — General-purpose I/O |
| Pino 22 | PTF3 — General-purpose I/O |
| Pino 23 | PTF2 — General-purpose I/O |
| Pino 24 | PTF1 — General-purpose I/O |
| Pino 25 | PTF0 — General-purpose I/O |
| Pino 26 | PTE7 — General-purpose I/O |
| Pino 27 | PTE6 — General-purpose I/O |
| Pino 28 | PTE5 — General-purpose I/O |
| Pino 29 | PTE4 — General-purpose I/O |
| Pino 30 | VSS — Ground |
| Pino 31 | VDD — Power supply |
| Pino 32 | PTE3 — General-purpose I/O |
Aplicações típicas
MC9S08DN32CLC é adequado para 6 aplicaçãos: LIN Automotive Body Modules, White-Goods Motor Control Boards, HVAC Control Panels, Industrial Sensor Hubs, Low-Cost HMI Displays, Battery-Powered Metering Peripherals.
LIN Automotive Body Modules
The MC9S08DN32CLC's integrated LINbus peripheral and 32 KB FLASH make it a strong fit for LIN slave nodes in automotive body electronics such as mirror controllers, seat switch panels, and interior lighting drivers. The 40 MHz HCS08 core executes the LIN protocol stack and switch-debounce logic without headroom issues, while the 1 KB EEPROM retains node configuration across power cycles. Unlike higher-end automotive MCUs it adds no CAN burden, reducing cost per node. Place the part between the LIN transceiver and the load-driver transistors to keep the firmware update path routed through the SCI bootloader.
Recomendado
White-Goods Motor Control Boards
In washing-machine, dishwasher, and refrigerator boards, the MC9S08DN32CLC drives small BLDC and brushed-DC motors through its PWM peripheral while the I2C bus talks to sensor and user-interface chips. The 40 MHz speed and 25 GPIO pins handle keypad scanning, LED feedback, and triac-style phase control within the same firmware loop. Compared with a discrete 8051 design, the integrated FLASH/EEPROM/RAM cuts board area by roughly 30% and lets field firmware be updated via SPI from a service tool.
Recomendado
HVAC Control Panels
The MC9S08DN32CLC is well matched to HVAC wall-thermostat and control-panel designs that need a 32 KB firmware budget, multi-segment LCD or LED drive, and LIN/SCI connectivity to indoor and outdoor units. Its 25 GPIO lines accommodate keypad matrix, temperature-sensor I2C bus, and fan-triac control without external expanders. The industrial temperature grade supports installations in unconditioned spaces, and the LVD/POR ensures clean resets through brown-out events caused by HVAC relay switching.
Recomendado
Industrial Sensor Hubs
For industrial sensor-hub PCBs the MC9S08DN32CLC aggregates measurements from SPI ADC, I2C environmental sensors, and a 4-20 mA front end through its 25 GPIO and serial interfaces. The 32 KB FLASH easily holds a Modbus- or IO-Link-style protocol stack, while the 1 KB EEPROM stores calibration constants per channel. The 40 MHz CPU executes 100 Hz sampling loops with <10% CPU load, leaving headroom for diagnostics. Engineers favor the S08 family for sensor hubs because the BDM debug port permits in-system FLASH patching without removing the board from service.
Recomendado
Low-Cost HMI Displays
Cost-sensitive human-machine interfaces - small appliance keypads, building-access keypads, and vending-machine front panels - use the MC9S08DN32CLC to drive multiplexed LED or low-segment LCD displays while scanning up to 4x5 keypad matrices through the 25 GPIOs. The SCI port supports 9-bit addressing for legacy host protocols, and the WDT ensures the panel recovers gracefully from firmware lockups. Compared with a CPLD-based design the S08 single-chip solution cuts BOM cost by ~40% while improving firmware updateability over SPI.
Recomendado
Battery-Powered Metering Peripherals
Battery-powered water, gas, and electricity meters leverage the MC9S08DN32CLC's low-power HCS08 modes, 1 KB EEPROM for accumulating usage logs, and LIN or SCI for AMR (automatic meter reading) links. The 40 MHz core processes metrology calculations while the on-chip LVD protects the lithium battery stack from over-discharge. Its small LQFP-32 package and 25 GPIOs fit four-quadrant metering frontend circuits, and the same die is available in an automotive-grade variant for fleet EV chargers. Compared with ASIC metrology solutions it offers in-field reprogrammability to support new billing protocols.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S08DN32CLC — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S08DN32AMLC | MC9S08QE32CLCR | S9S08DZ32F2MLC | MC9S08DZ32AMLH | MC9S08DV32CLC |
|---|---|---|---|---|---|---|
| Package | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Processor | HCS08 (S08) | HCS08 (S08) | HCS08 (S08) | HCS08 (S08) | HCS08 (S08) | HCS08 (S08) |
| CPU Speed | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Program Flash | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB (DV family has larger option) |
| RAM Size | 1 KB | 1 KB | 1 KB | 2 KB | 2 KB | 1-2 KB family option |
| EEPROM | 1 KB | 1 KB | 1 KB | 1 KB + CAN | 1 KB | 1 KB |
| Number of I/O | 25 | 25 | 25 | 25 | 25 | 25 |
| Connectivity | I2C, LINbus, SCI, SPI | I2C, LINbus, SCI, SPI | I2C, SCI, SPI (no LIN) | I2C, SCI, SPI, CAN | I2C, SCI, SPI, CAN | I2C, SCI, SPI (no LIN) |
| Automotive Grade | Industrial | Automotive (AEC-Q100) | Industrial | Automotive (AEC-Q100) | Automotive (AEC-Q100) | Automotive (AEC-Q100) |
Principais diferenciais
- Industrial temperature grade in a 7x7 mm LQFP-32 footprint (vs MC9S08QE32CLCR)
- Integrated LINbus interface for automotive body modules (vs S9S08DZ32F2MLC)
- 32 KB FLASH + 1 KB EEPROM + 1 KB RAM in a single 32-LQFP die (vs MC9S08DN32AMLC)
Notas de projeto
Place a 100 nF X7R decoupling capacitor within 5 mm of each VDD/VSS pin pair on the 32-LQFP. Add a bulk 4.7 uF tantalum or ceramic capacitor near the IC to sustain LVD/POR operations through relay-driven supply dips. The S08 LVD threshold is factory-trimmed; designers should not rely solely on internal POR - verify brown-out behavior with the actual load profile.
Route the RESET line as a short trace with a 10 kohm pull-up to VDD and a 1 nF cap to ground for noise immunity. Keep the BDM (Background Debug Mode) pin accessible on the production board by exposing it as a test pad or header - field firmware upgrades typically depend on BDM access for failed-boot recovery.
Do not exceed the maximum I/O sink/source current of 10 mA per pin. The HCS08 watchdog timer must be refreshed within its timeout window or the part will reset; in low-power modes enable the periodic interrupt to wake the core and refresh the WDT. The internal oscillator must be calibrated by trimming for SCI baud-rate accuracy - factory trim is held in a non-volatile location that should not be erased during FLASH programming.
Informações de conformidade
RoHS compliance inferred from lead-free LQFP package and NXP product family standards. AEC-Q100 not qualified for the CLC variant; the AMLC variant carries AEC-Q100 qualification. REACH, halogen-free, and conflict-mineral statement not present in the verified web data.