MC9S12XEG128MAA vs MC9S12XDP512MPV-FR Comparação
Comparação detalhada lado a lado de MC9S12XEG128MAA por NXP Semiconductors e MC9S12XDP512MPV-FR por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC9S12XDP512MPV-FR - HCS12X 16-Bit MCU 80MHz 512KB Flash | NXP
MC9S12XDP512MPV-FR ✓ AtivoComparação de especificações
| Parâmetro | MC9S12XEG128MAA | MC9S12XDP512MPV-FR |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $8,90 | $17,20 |
| Core Architecture | HCS12X (S12X CPU + XGATE co-processor) | 16-bit |
| CPU Type | 16-bit CISC | — |
| Maximum Bus Frequency | 50 MHz | — |
| Flash Memory | 128 KB (128K x 8) | — |
| RAM Memory | 12 KB | — |
| EEPROM (emulated) | 2 KB | — |
| Operating Voltage | 1.8V / 2.8V / 5V (single supply 5V) | — |
| ADC | 12-bit, 16 channels, 3 us conversion time | 10-bit, 16 channels |
| Timers | Enhanced Capture Timer (ECT), PIT, RTI | ECT 8-channel, PIT, RTI |
| Communication Interfaces | CAN 2.0A/B, SCI, SPI, IIC | — |
| GPIO Count | 59 | — |
| PWM Channels | 8/16-bit PWM | — |
| Temperatura de operação | -40C to +85C (MAA suffix) | — |
| Encapsulamento | 80-pin LQFP (14x14 mm) | 112-LQFP (20 x 20 mm) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Nível MSL | 3 (168 hours) | — |
| Status RoHS | Compliant | — |
| Core | — | HCS12X (S12XD sub-family) |
| Co-Processor | — | XGATE RISC DMA engine |
| Maximum CPU Frequency | — | 80 MHz |
| Program Flash | — | 512 KB (512K x 8) |
| RAM | — | 32 KB |
| EEPROM | — | [DATA_NEEDED: EEPROM size] |
| Faixa de temperatura de operação | — | -40C to +125C |
| Tensão de alimentação | — | [DATA_NEEDED: VDD range] |
| CAN Modules | — | 4 (CAN 2.0A/B) |
| External Bus Interface | — | Yes (full EBI exposed in 112-LQFP) |
| Debug Interface | — | BDM (Background Debug Mode) |
| Lead-Free / RoHS | — | [DATA_NEEDED: lead-free status] |
| Packaging | — | Tape and Reel (FR suffix) |