MPC8349ECVVAJFB vs MPC8349EVVAJDB Comparação
Comparação detalhada lado a lado de MPC8349ECVVAJFB por NXP Semiconductors e MPC8349EVVAJDB por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MPC8349ECVVAJFB - PowerQUICC II Pro 533MHz SoC | NXP | Industrial
MPC8349ECVVAJFB ⚠ Última compraComparação de especificações
| Parâmetro | MPC8349ECVVAJFB | MPC8349EVVAJDB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Última compra | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $52,40 | $33,40 |
| Core Architecture | Power Architecture (e300) | PowerPC e300 (32-bit) |
| Core Count | 1 | — |
| Largura do barramento de dados | 32-bit | — |
| Maximum Clock Speed | 533 MHz | — |
| Memory Controller | DDR1/DDR2 SDRAM with ECC | DDR1/DDR2, 32-bit, up to 266 MHz |
| PCI Interfaces | 2 x PCI 2.2 (one 64-bit capable) | 2x PCI 32-bit/33 MHz |
| Ethernet | 1 x 10/100/1000 Mbps MAC | 10/100/1000 Mb/s (1x GMII/TBI/RGMII) |
| USB | USB 2.0 Full/Low Speed | USB 2.0 Full-Speed (Device/Host) |
| Security Engine (SEC) | Yes - DES/3DES/AES/SHA/MD5/RNG | — |
| Additional Interfaces | DUART, I2C, SPI, GPIO | — |
| I/O Voltage | 1.8V / 2.5V / 3.3V | 1.8 V / 2.5 V / 3.3 V |
| Core Voltage | 1.2V (typ) | — |
| Temperatura de operação | -40C to +105C | 0 C to +105 C (Tj) |
| Encapsulamento | 672-LBGA (35x35 mm) | 672-LBGA (35x35 mm) |
| Tipo de montagem | Surface Mount | Surface Mount (BGA) |
| Silicon Revision | Rev 2 | — |
| Status RoHS | Compliant (Pb-free TBGA) | [DATA_NEEDED: RoHS compliance] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Family | — | PowerQUICC II Pro (MPC8349E) |
| Core Frequency | — | 533 MHz |
| Terminal Form | — | BALL |
| Number of Terminals | — | 672 |
| Security Engine | — | SEC 2.0+ (AES, 3DES, SHA, MD5, RSA, Kasumi) |
| Process Technology | — | 0.13 micron CMOS |
| L1 Cache | — | 32 KB instruction + 32 KB data |