MPC8358VRAGDGA vs MPC8358VRAGDDA Comparação

Comparação detalhada lado a lado de MPC8358VRAGDGA por NXP Semiconductors e MPC8358VRAGDDA por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC8358VRAGDGA MPC8358VRAGDGA - 400MHz PowerQUICC II Pro MPU | NXP

MPC8358VRAGDGA - 400MHz PowerQUICC II Pro MPU | NXP

MPC8358VRAGDGA ⚠ Última compra
NXP Semiconductors
MPC8358VRAGDDA MPC8358VRAGDDA - PowerQUICC II Pro MPU 400MHz 668-BGA | NXP

MPC8358VRAGDDA - PowerQUICC II Pro MPU 400MHz 668-BGA | NXP

MPC8358VRAGDDA ⚠ Última compra

Comparação de especificações

Parâmetro MPC8358VRAGDGA MPC8358VRAGDDA
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Última compra Última compra
Status do estoque In Stock In Stock
Preço unitário (USD) $65,00 $47,85
Processor Type PowerPC e300 Microprocessor IC MPC83xx —
Core Architecture Power Architecture (e300), 32-bit —
Core Clock Speed 400 MHz —
Number of Cores 1 —
Core Voltage 1.2 V —
I/O Voltage 1.8 V / 2.5 V / 3.3 V —
Encapsulamento / Caixa 668-PBGA-PGE (29x29) with exposed pad —
Tipo de montagem Surface Mount Surface Mount (BGA)
Temperatura de operação 0 C to +105 C 0 °C to +105 °C (commercial)
Memory Interface DDR1 / DDR2 SDRAM controller with ECC —
Ethernet 2x 10/100/1000 (one RGMII, one SGMII/GMII), 1 GbE MAC —
PCI Interface 32-bit PCI 2.3 32-bit PCI 2.2
USB USB 2.0 Full/Low Speed —
WAN Interfaces TDM (T1/E1/HSSI), ATM UTOPIA, 4 channels —
Security Engine AES, DES, 3DES, PKE Integrated (IPsec / Kasumi)
Process Technology 0.13 micrometer CMOS 0.13 µm CMOS
Family MPC83xx PowerQUICC II Pro —
Status RoHS Compliant Compliant (per DigiKey listing)
Lead Free Status Lead Free —
Packaging Tray —
Processor Family — PowerQUICC II Pro (MPC83xx)
Core — PowerPC e300, 1 Core, 32-Bit
Core Frequency — 400 MHz
Instruction Set Architecture — RISC, 32-Bit Power Architecture
Operating Voltage (Core) — 1.8 V
Operating Voltage (I/O) — 2.5 V / 3.3 V
Encapsulamento — 668-pin TBGA, 29 mm × 29 mm, 1.0 mm pitch
L1 Cache — 32 KB instruction + 32 KB data (per core)
Memory Controller — DDR1 / DDR2 SDRAM with ECC (32-bit)
Ethernet MAC — 10/100/1 Gbit Ethernet
USB Interface — USB 2.0 Full/Low Speed
Serial Interfaces — TDM, ATM, UART

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