MPC8358VRAGDGA - 400MHz PowerQUICC II Pro MPU | NXP
N.º da peça: MPC8358VRAGDGA ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $100.64 | $100,64 |
| 10 | $95.5 | $955,00 |
| 100 | $85 | $8.500,00 |
| 500 | $75 | $37.500,00 |
| 1.000 | $65 | $65.000,00 |
MPC8358VRAGDGA Visão geral
Background. A microprocessor (MPU) is a single-chip CPU containing the arithmetic logic unit, control unit, and on-chip caches required to execute instructions and orchestrate peripherals. In communications infrastructure, integrated communications MPUs combine CPU cores with hardware protocol engines and memory/IO controllers on a single die, shrinking board area and bill-of-materials versus discrete CPU-plus-ass-controller designs. The MPC8358E belongs to the MPC83xx PowerQUICC II Pro family, which is a direct evolution of the earlier MPC82xx/MPC8xx QUICC families; the family hierarchy within NXP's catalog is microprocessor -> communications MPU -> PowerQUICC -> PowerQUICC II Pro.
Key features include the e300 core with MMU and instruction/data caches, 400 MHz core clock, dual 10/100/1000 Mbps Ethernet (one RGMII plus one SGMII-capable GMII), USB 2.0 (Full/Low Speed), DDR1/DDR2 SDRAM controller with ECC, 32-bit PCI 2.3 interface, four TDM channels (T1/E1/HSSI/UTOPIA), hardware QUICC Engine technology for protocol acceleration, and integrated security (AES, DES, 3DES, PKE). Operating voltages are 1.2V core, 1.8V/2.5V/3.3V IO, and the industrial temperature grade is 0C to 105C.
Architecture details. The MPC8360E family - to which the MPC8358E belongs - uses a 0.13 micrometer CMOS process and pairs the e300 core with a dedicated QUICC Engine communication controller that offloads bit-level protocol processing from the CPU. The device exposes DDR1/DDR2 memory interfaces for high-bandwidth packet buffering, a 32-bit PCI bus for expansion, and serial interfaces (USB, TDM, ATM UTOPIA) commonly used for WAN aggregation in DSLAMs and SME routers.
Typical applications include small-to-medium enterprise routers, low-end DSLAMs, IP private branch exchanges (PBX), industrial control gateways, and broadband access Customer Premises Equipment (CPE) such as SOHO gateways and integrated access devices where a single chip replaces a CPU plus peripheral ASIC.
When designing with the MPC8358VRAGDGA, ensure the four-layer-plus PCB has a continuous ground plane under the BGA and proper thermal vias under the exposed pad. Decouple the 1.2V core and 1.8V/2.5V/3.3V IO rails with bulk ceramic capacitors placed within 5 mm of each supply ball; missing decoupling can cause reset or jitter anomalies on the DDR interface.
This page synthesizes distributor pricing from DigiKey and Mouser, NXP hardware specifications, and a drop-in comparison with sibling PowerQUICC II Pro SKUs that is not found in the manufacturer datasheet itself.
Alternativas drop-in para MPC8358VRAGDGA — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8358VRAGDGA (mesmo formato e footprint) — diferindo em Operating Temperature, Core Architecture, Ethernet, Security Engine, USB.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8358EVRAGDDA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8358CVRAGDGA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8358EZQAGDDA
✅ Drop-In✓ Em estoque
$30.4 / unidade
Ver ficha técnica →MPC8358ZQAGDDA
✅ Drop-In✓ Em estoque
$32 / unidade
Ver ficha técnica →MPC8358VRAGDGA Classificações máximas e características elétricas
| Processor Type | PowerPC e300 Microprocessor IC MPC83xx |
| Core Architecture | Power Architecture (e300), 32-bit |
| Core Clock Speed | 400 MHz |
| Number of Cores | 1 |
| Core Voltage | 1.2 V |
| I/O Voltage | 1.8 V / 2.5 V / 3.3 V |
| Encapsulamento / Caixa | 668-PBGA-PGE (29x29) with exposed pad |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0 C to +105 C |
| Memory Interface | DDR1 / DDR2 SDRAM controller with ECC |
| Ethernet | 2x 10/100/1000 (one RGMII, one SGMII/GMII), 1 GbE MAC |
| PCI Interface | 32-bit PCI 2.3 |
| USB | USB 2.0 Full/Low Speed |
| WAN Interfaces | TDM (T1/E1/HSSI), ATM UTOPIA, 4 channels |
| Security Engine | AES, DES, 3DES, PKE |
| Process Technology | 0.13 micrometer CMOS |
| Family | MPC83xx PowerQUICC II Pro |
| Status RoHS | Compliant |
| Lead Free Status | Lead Free |
| Packaging | Tray |
Guia de Configuração de Pinos do MPC8358VRAGDGA 668-pbga-pge (29x29) with exposed pad
Configuração de pinos para MPC8358VRAGDGA (pacote 668-pbga-pge (29x29) with exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8358VRAGDGA.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8358VRAGDGA é adequado para 6 aplicaçãos: Small-to-Medium Enterprise (SME) Routers, Low-End DSLAM Line Cards, IP PBX and VoIP Gateways, Industrial Control and Energy Gateways, Customer Premises Equipment (CPE) and SOHO Gateways, Embedded Networking Reference Platform (Linux BSP).
Small-to-Medium Enterprise (SME) Routers
The MPC8358VRAGDGA fits SME router designs because its 400 MHz e300 core plus 1 GbE MAC plus integrated QUICC Engine handles small-office routing, NAT, firewall, and IPSec offload on a single chip. The dual Gigabit Ethernet (RGMII + SGMII) lets designers connect a WAN SFP and four or more LAN PHYs through a downstream switch without an external CPU. Hardware AES/3DES acceleration from the security engine delivers line-rate VPN throughput for 20-50 branch-office tunnels, replacing what used to require a separate crypto ASIC.
Recomendado
Low-End DSLAM Line Cards
The MPC8358VRAGDGA's integrated QUICC Engine and four-channel TDM (T1/E1) interface make it a cost-optimized controller for low-density DSLAM line cards aggregating subscriber traffic. Running at 400 MHz, the e300 core handles PPPoE termination and IGMP snooping while the offload engine processes ATM UTOPIA cell segmentation and reassembly without CPU intervention. The 32-bit PCI 2.3 interface connects to backplane uplink ASICs, eliminating the need for a dedicated aggregator CPU on each card.
Recomendado
IP PBX and VoIP Gateways
In IP-PBX and VoIP gateway designs, the MPC8358VRAGDGA delivers the deterministic real-time response needed for TDM-to-SIP transcoding and tone generation on the same SoC. Its hardware QUICC Engine offload handles H.248, MGCP, and SIP signaling up to hundreds of channels, while the DDR2 controller sustains codec buffers at full channel density. VoIP developers value the single-chip integration of PCI for daughter-card DSP modules plus TDM for legacy PBX trunks.
Recomendado
Industrial Control and Energy Gateways
The MPC8358VRAGDGA's extended 0C to 105C industrial temperature range and integrated protocols fit industrial gateway and substation communication roles. Its 400 MHz e300 runs Linux/RTOS control software, the dual GbE handles SCADA LAN and uplink, and the TDM and ATM interfaces connect to legacy serial SCADA equipment. Hardware AES/3DES accelerates IEC 62351 security for power-grid teleprotection messages, replacing external crypto chips.
Recomendado
Customer Premises Equipment (CPE) and SOHO Gateways
The MPC8358VRAGDGA is purpose-built for SOHO gateway and integrated access device designs where a single chip must terminate DSL/cable, route LAN traffic, run a residential firewall, and present Wi-Fi or VoIP services. The DDR1/DDR2 controller plus PCI 2.3 plus USB 2.0 host eliminates multiple companion chips on the BOM. Running at 400 MHz, the e300 core sustains 100+ Mbps of NAT throughput for typical residential broadband subscriptions.
Recomendado
Embedded Networking Reference Platform (Linux BSP)
Embedded Linux and VxWorks reference designs use the MPC8358VRAGDGA as a stable development platform because NXP and the open-source community have shipped mature BSPs for the e300 core, DDR2 controller, and integrated peripherals. Engineers prototyping secure routers, industrial gateways, or telecom line cards benefit from mainline U-Boot, kernel, and driver support. The 400 MHz core, 32-bit PCI, and USB 2.0 host make the device a credible target for evaluating next-gen Layerscape parts.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8358VRAGDGA — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8358EVRAGDDA | MPC8358CVRAGDGA | MPC8358EZQAGDDA | MPC8358ZQAGDDA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 668-PBGA-PGE (29x29) | 668-PBGA-PGE (29x29) - same | 668-PBGA-PGE (29x29) - same | 668-PBGA-PGE (29x29) - same | 668-PBGA-PGE (29x29) - same |
| Core Speed | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Operating Temperature | 0C to +105C (extended) | 0C to +105C (extended) | 0C to +85C (commercial) | 0C to +105C (extended) | 0C to +85C (commercial) |
| Security Engine (AES/DES/PKE) | Hardware engine (security mode dependent on SKU suffix) | Enabled (full security engine) | Same die as target, security mode dependent on suffix | Enabled (Z suffix) | Enabled (Z suffix) |
| Gigabit Ethernet Ports | 2 (1x RGMII, 1x SGMII/GMII) | 2 (1x RGMII, 1x SGMII/GMII) | 2 (1x RGMII, 1x SGMII/GMII) | 2 (1x RGMII, 1x SGMII/GMII) | 2 (1x RGMII, 1x SGMII/GMII) |
| PCI Interface | 32-bit PCI 2.3 | 32-bit PCI 2.3 | 32-bit PCI 2.3 | 32-bit PCI 2.3 | 32-bit PCI 2.3 |
| Lead-Free / RoHS | Lead Free, RoHS Compliant | Lead Free, RoHS Compliant | Lead Free, RoHS Compliant | Lead Free, RoHS Compliant | Lead Free, RoHS Compliant |
Principais diferenciais
- Drop-in compatible with the NXP-recommended E-suffix replacement, the MPC8358EVRAGDDA, with only a security-engine configuration change (vs MPC8358EVRAGDDA)
- Industrial 0C to 105C temperature grade versus the commercial-grade 'C' variant (vs MPC8358CVRAGDGA)
- Integration of DDR1/DDR2 controller, dual GbE, PCI, USB 2.0, TDM, and QUICC Engine protocol offload on a single die (vs MPC8358EZQAGDDA (encryption-enabled sibling))
Notas de projeto
Estimated: at 400 MHz core frequency with 1.2V core supply, the e300 core dissipates roughly 1.5-2.5 W, and total board-level power including DDR2, GbE, and PCI varies with traffic. Use the BGA exposed pad as the primary heat path, solder it directly to the PCB thermal land connected to a continuous ground plane with a via array (recommended 6x6 thermal vias on 1.0-1.2 mm pitch). For cabinet designs without airflow, derate the upper operating limit to 85C ambient to preserve long-term reliability of the 0C-to-105C industrial grade.
Decouple the 1.2V core rail with a 22 uF bulk ceramic within 5 mm of the core supply balls, plus 0.1 uF/10 nF pairs for high-frequency noise. The 1.8V/2.5V/3.3V IO rails each need their own bulk capacitor and decoupling network, especially the DDR supply which must hold within 5% tolerance under burst-refresh loading. Power sequencing requires the core rail to come up first and stabilize before IO rails power up; use a sequencer or supervisor IC such as the NPF3000 series to enforce order and avoid latch-up.
Route the DDR2 address, command, and clock nets on the top layer with matched lengths within +/-25 mils to satisfy the integrated DDR controller's timing margin. Place the BGA breakout vias on a staggered pattern (dog-bone or via-in-pad) with 0.5 mm pitch; four-layer stack-up with continuous ground plane on layer 2 and a power plane on layer 3 is recommended. Keep the GbE differential pairs (RGMII/SGMII) at 100-ohm differential impedance and isolate them from noisy clock and switching power traces.
Do not assume the MPC8358VRAGDGA and the MPC8358EVRAGDDA are software-compatible at the security API level: the GA part limits the security engine, while the E/DA part enables AES/3DES/PKE - check the hardware configuration word at boot. NXP recommends verifying the exact die revision (Rev 1 vs later) before swapping SKUs because internal errata may differ; the silicon hardware specification document lists known issues per silicon revision.
Informações de conformidade
Lead-free and RoHS compliant per NXP product page and DigiKey listing. NXP recommends the MPC8358EVRAGDDA as End-of-Life replacement. AEC-Q100 not applicable - this is an industrial communications MPU, not an automotive part.
