MPC8547EVTATGD vs MPC8543VTANGD Comparação

Comparação detalhada lado a lado de MPC8547EVTATGD por NXP Semiconductors e MPC8543VTANGD por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC8547EVTATGD MPC8547EVTATGD - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP

MPC8547EVTATGD - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP

MPC8547EVTATGD Obsolete
NXP Semiconductors
MPC8543VTANGD MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD ✓ Ativo

Comparação de especificações

Parâmetro MPC8547EVTATGD MPC8543VTANGD
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Obsolete Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $98,50 $152,00
Core Processor PowerPC e500 PowerPC e500
Number of Cores 1 1
Core Width 32-Bit —
Core Frequency 1.2 GHz —
Series MPC85xx (PowerQUICC III) PowerQUICC III
Co-Processors / DSP Signal Processing Engine (SPE); Security Engine (SEC 3.x) —
L1 Cache (I/D) 32 KB / 32 KB per core [DATA_NEEDED: per datasheet table] —
L2 Cache 256 KB [DATA_NEEDED: confirm from datasheet] 256 KB
RAM Controllers DDR, DDR2, SDRAM —
Graphics Acceleration No —
Display & Interface Controllers None integrated —
Ethernet 4 x 10/100/1000 Mbps (GigE) —
PCI / PCIe / SRIO PCI, PCI-X, 2 x PCIe, 2 x Serial RapidIO —
Other I/O Local bus, I2C, DUART, GPIO, USB 2.0, SPI —
Temperatura de operação 0C to +105C (industrial grade per -TGD suffix) 0 °C to +105 °C
Core Voltage 1.0 V (typ) [DATA_NEEDED: confirm from datasheet Vdd table] 1.0 V (typical)
I/O Voltages 1.8V / 2.5V / 3.3V 1.8 V / 2.5 V / 3.3 V
Operating Temperature Range per DigiKey -40C to +105C (DigiKey listing) [DATA_NEEDED: confirm] —
Encapsulamento / Caixa 783-BBGA, FCBGA (29 x 29 mm) —
Tipo de montagem Surface Mount Surface Mount (BGA)
Part Status Obsolete —
Process Technology 0.09 um CMOS 90 nm CMOS
Status RoHS Compliant [DATA_NEEDED: confirm via NXP product page] [DATA_NEEDED: RoHS status]
Manufacturer — NXP Semiconductors (Freescale)
Core Architecture — Power Architecture, 7-stage pipeline, dual-issue superscalar
Core Speed — 800 MHz
Bus Width — 32-bit
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
Memory Controller — DDR2 SDRAM with ECC, up to 533 MHz data rate
Ethernet MACs — 4x Gigabit (SGMII/RGMII)
PCI Express — 2x PCIe interfaces
Serial RapidIO — 2x SRIO endpoints
PCI/PCI-X — 1x 32-bit PCI/PCI-X interface
Package Type — FCBGA-783 (29x29 mm)

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