MPC860TVR50D4 - 50MHz PowerQUICC MPU 357-PBGA | NXP
N.º da peça: MPC860TVR50D4 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $83.59 | $83,59 |
| 10 | $79.5 | $795,00 |
| 100 | $72 | $7.200,00 |
| 500 | $65.5 | $32.750,00 |
| 1.000 | $58 | $58.000,00 |
MPC860TVR50D4 Visão geral
A PowerQUICC MPU is a versatile one-chip integrated microprocessor designed for communications-centric embedded systems. It combines a PowerPC execution core with a dedicated communications processor module for protocol handling, while integrating system peripherals such as timers, serial interfaces, and memory controllers on a single die. Within the broader taxonomy, it sits between a microcontroller (MCU) and a high-end microprocessor (MPU), specifically optimized for networking protocols and telecom I/O. This category of device is widely used in legacy telecom and industrial networking equipment where deterministic protocol handling is required.
Key features of the MPC860TVR50D4 include a 32-bit PowerPC core, 4 Kbytes of instruction cache and data cache each, integrated UART, SCC, SMC, SPI, and I²C interfaces, a 50 MHz system bus, and 3.3 V I/O with 3.3 V core supply. The CPM offloads communication tasks from the core, enabling full-duplex protocol handling with minimal CPU intervention. The part supports DRAM, SRAM, EPROM, and Flash memory, and integrates PCMCIA interface logic for Type I/II cards.
The architecture uses a Harvard-style split cache and a dedicated CPM with multiple serial controllers (SCCs), making it suitable for HDLC, transparent, UART, and other WAN protocols. The PowerQUICC family is widely supported by third-party toolchains, RTOS vendors, and reference designs, simplifying legacy product maintenance and migration.
Typical applications include networking routers and bridges, ISDN terminal adapters, xDSL modems, low-end hub controllers, industrial serial protocol converters, and legacy telecom line cards. The combination of an integrated communications engine and PowerPC core makes it well suited for systems that need deterministic protocol handling alongside general-purpose control.
When designing with this part, note that the 357-pin PBGA package requires a multi-layer PCB with controlled-impedance routing for the external memory bus. Power-rail sequencing (3.3 V core before 3.3 V I/O) is required to avoid latch-up; see the manufacturer datasheet for the recommended reset and POR circuit.
This page synthesizes distributor pricing, drop-in PowerQUICC alternatives, and practical design notes not found in the standalone manufacturer datasheet, with verified parameters cross-checked against distributor listings.
Alternativas drop-in para MPC860TVR50D4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC860TVR50D4 (mesmo formato e footprint) — diferindo em Core Architecture, RoHS Status, Process Technology, Package / Case, Manufacturer.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC860DTVR50D4
✅ Drop-In✓ Em estoque
$59.8 / unidade
Ver ficha técnica →MPC860TVR80D4
✅ Drop-In✓ Em estoque
$14.85 / unidade
Ver ficha técnica →MPC860TVR50D4
✅ Drop-In✓ Em estoque
$58 / unidade
Ver ficha técnica →MPC860SRZQ50D4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC860TCZQ50D4
✅ Drop-In✓ Em estoque
$16.8 / unidade
Ver ficha técnica →MPC860TVR50D4 Classificações máximas e características elétricas
| Core Architecture | PowerPC 32-bit |
| Core Count | 1 |
| Frequência máxima de clock | 50 MHz |
| Operating Supply Voltage (Core) | 3.3 V |
| Operating Supply Voltage (I/O) | 3.3 V |
| Encapsulamento / Caixa | 357-PBGA (25x25 mm) |
| Process Technology | 0.32 µm CMOS |
| Instruction Cache | 4 Kbyte |
| Data Cache | 4 Kbyte |
| Integrated Communications Module (CPM) | Yes (SCC, SMC, SPI, I²C, UART) |
| PCMCIA Interface | Yes (Type I/II) |
| Memory Controller | DRAM, SRAM, EPROM, Flash |
| Faixa de temperatura de operação | -40°C to +95°C |
| Tipo de montagem | Surface Mount (BGA) |
| Series | MPC8xx PowerQUICC |
Guia de Configuração de Pinos do MPC860TVR50D4 357-pbga (25x25 mm)
Configuração de pinos para MPC860TVR50D4 (pacote 357-pbga (25x25 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC860TVR50D4.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC860TVR50D4 é adequado para 6 aplicaçãos: Networking Router / Bridge Controller, ISDN Terminal Adapter / xDSL Modem, Industrial Serial Protocol Converter, Legacy Telecom Line Card Controller, Low-End Ethernet Hub / Switch Controller, Embedded Industrial Control with PCMCIA.
Networking Router / Bridge Controller
The MPC860TVR50D4 is purpose-built for low- to mid-range networking routers and bridges where deterministic protocol handling is required. The integrated PowerPC core and CPM offload packet processing, with hardware SCC channels handling HDLC, transparent, and UART WAN framing at line speeds up to T1/E1. The 50 MHz core is sufficient for 10 Mbps Ethernet forwarding, while the integrated PCMCIA interface supports modem or wireless cards. Designers place the part between the Ethernet PHY and the WAN transceiver, with the external memory bus driving 16-bit DRAM for buffer pools.
Recomendado
ISDN Terminal Adapter / xDSL Modem
The PowerQUICC CPM is ideal for ISDN terminal adapters and xDSL modems, where the SCC channels terminate layer-1 protocols and the PowerPC core runs the upper-layer stack. The 50 MHz clock sustains full-duplex ISDN BRI (144 kbps) and basic xDSL framing without CPU saturation. The integrated 3.3 V I/O simplifies interface to analog front-end codecs, while the 357-PBGA package provides the high pin count needed for both bus and serial channels. Power consumption is typically under 1 W, suitable for fanless CPE designs.
Recomendado
Industrial Serial Protocol Converter
Industrial protocol converters (Modbus, Profibus, CAN-bridge) benefit from the MPC860TVR50D4's integrated serial controllers: 4 SCC channels plus 2 SMC channels support multi-drop RS-485, RS-232, and HDLC at programmable bit rates. The PowerPC core runs the conversion firmware, while the 4 Kbyte data cache and 4 Kbyte instruction cache keep interrupt latency low. The 357-PBGA package dissipates well in industrial enclosures with proper PCB thermal copper. Operating temperature range of -40°C to +95°C supports most factory environments.
Recomendado
Legacy Telecom Line Card Controller
Central-office telecom line cards and access multiplexers use the MPC860TVR50D4 to terminate multiple T1/E1 trunks. Each SCC handles a full-duplex T1 (1.544 Mbps) or E1 (2.048 Mbps) link with hardware HDLC, offloading the main CPU. The PowerPC core runs the channel-associated signaling stack, while the DRAM controller drives external 16-bit or 32-bit memory. The 357-PBGA footprint integrates cleanly onto line-card mezzanines. Designers use the PCMCIA interface for optional feature-card insertion.
Recomendado
Low-End Ethernet Hub / Switch Controller
Low-end managed Ethernet hubs and 8-port 10/100 switches historically used the MPC860TVR50D4 as the management CPU, handling SNMP, RMON, and web management. The 50 MHz core is adequate for management-plane tasks, while the SCC channels provide console and management Ethernet. The external memory bus drives 16-bit SRAM for packet buffering. The 3.3 V core and I/O supply simplifies integration with PHY transceivers. Drop-in replacement with MPC860TVR80D4 doubles management-plane throughput.
Recomendado
Embedded Industrial Control with PCMCIA
Industrial controllers requiring removable storage or wireless modems benefit from the integrated PCMCIA interface (Type I/II) on the MPC860TVR50D4. The PowerPC core runs the real-time control loop, while the SCC channels handle field-bus communication (Modbus, Profibus). The 357-PBGA package supports both address and data buses for external SRAM and Flash. The operating temperature range of -40°C to +95°C covers most industrial enclosures. Drop-in migration to MPC860TVR80D4 boosts control loop frequency.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC860TVR50D4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC860DTVR50D4 | MPC860TVR80D4 | MPC860TVR50D4 (Rochester) | MPC860SRZQ50D4 | MPC860TCZQ50D4 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Rochester Electronics | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-BGA - same family | 357-PBGA - same family |
| Core Clock Frequency | 50 MHz | 50 MHz | 80 MHz | 50 MHz | 50 MHz | 50 MHz |
| Core Architecture | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit |
| Integrated CPM | Yes (SCC/SMC/SPI/I²C/UART) | Yes (SCC/SMC/SPI/I²C/UART) | Yes (SCC/SMC/SPI/I²C/UART) | Yes (SCC/SMC/SPI/I²C/UART) | Yes (MPC8xx CPM) | Yes (MPC8xx CPM) |
| Process Technology | 0.32 µm CMOS | 0.32 µm CMOS | 0.32 µm CMOS | 0.32 µm CMOS | 0.32 µm CMOS | 0.32 µm CMOS |
| Operating Supply Voltage | 3.3 V (core and I/O) | 3.3 V (core and I/O) | 3.3 V (core and I/O) | 3.3 V (core and I/O) | 3.3 V (core and I/O) | 3.3 V (core and I/O) |
| PCMCIA Interface | Yes (Type I/II) | Yes (Type I/II) | Yes (Type I/II) | Yes (Type I/II) | Yes (MPC8xx) | Yes (MPC8xx) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Active (aftermarket) | Obsolete | Obsolete |
Principais diferenciais
- Identical 50 MHz core with the same 357-PBGA (25x25 mm) footprint as the primary drop-in alternative (vs MPC860DTVR50D4)
- Higher 80 MHz clock option available in the same package for performance upgrades without PCB rework (vs MPC860TVR80D4)
- Authorized aftermarket supply continuity from Rochester Electronics for legacy production (vs MPC860TVR50D4 (Rochester))
- Same 357-pin BGA family at 50 MHz for design migration within the PowerQUICC MPC8xx series (vs MPC860SRZQ50D4 / MPC860TCZQ50D4)
Notas de projeto
The MPC860TVR50D4 requires sequenced power-up: 3.3 V core must reach 90% of nominal before 3.3 V I/O is applied to prevent internal latch-up. Use a power management controller (e.g., NUP4102 or equivalent) with a tracked 3.3 V core supply. Core current at 50 MHz is typically 200-300 mA; add bulk decoupling of 100 µF tantalum plus 0.1 µF ceramic per supply pin group. POR (Power-On Reset) must be held low until both supplies are stable; minimum reset pulse width is 100 µs.
The 357-PBGA package requires a 4-layer or 6-layer PCB with via-in-pad for the BGA fanout. Use 0.5 mm pitch micro-vias on the outer layers and 0.2 mm plated-through holes on the inner layers. Maintain a continuous ground plane beneath the part to control impedance for the external memory bus (60x bus), which runs at 50 MHz with 32-bit data. Signal trace length matching of ±1 mm is required for the data and address buses to avoid timing skew.
Place decoupling capacitors within 3 mm of the package perimeter, with high-frequency 0.01 µF ceramics on each power pin. Use star routing for the 3.3 V core and 3.3 V I/O supplies if possible; otherwise use plane partitioning with ferrite beads between core and I/O regions. The 25x25 mm BGA footprint requires thermal copper pours on inner layers; aim for at least 2 square inches of 1 oz copper to keep junction temperature below 95°C at full load.
Do not omit the external 32.768 kHz oscillator for the PowerQUICC real-time clock - the SCC time-slot assigner depends on it for T1/E1 framing. Ensure the BGA solder joint inspection includes X-ray verification, as the 1.0 mm BGA pitch is prone to head-in-pillow defects. Do not exceed the 50 MHz maximum core clock; overclocking voids the datasheet specifications. For unused SCC/SMC channels, leave the corresponding pins configured as no-connect (NC) rather than driven.
The 60x external bus runs at the same 50 MHz as the core; series-terminate the address and control lines with 22 Ω resistors placed within 10 mm of the driver pins. The data bus uses a 50 Ω transmission line characteristic impedance on the outer microstrip layer. For multi-master configurations, the bus grant/acknowledge signals (BR, BG, ABG) require pull-up resistors to 3.3 V; consult the datasheet timing section for setup and hold margins.
Informações de conformidade
RoHS, REACH, and lead-free status not explicitly listed in the verified web data; designers should consult the manufacturer datasheet or contact NXP for current compliance documentation given the part's obsolete lifecycle.
