MPXV5010DP vs MPXV5100DP Comparação
Comparação detalhada lado a lado de MPXV5010DP por NXP Semiconductors e MPXV5100DP por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MPXV5100DP - 100kPa Differential Pressure Sensor, 5V, 8-SOP | NXP
MPXV5100DP ✓ AtivoComparação de especificações
| Parâmetro | MPXV5010DP | MPXV5100DP |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Pressure Sensors | Pressure Sensors |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $8,10 | $9,10 |
| Pressure Type | Differential | Differential |
| Operating Pressure Range | 0 to 10 kPa (0 to 1.45 PSI) | 0 kPa to 100 kPa (0 PSI to 14.5 PSI) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload] | [DATA_NEEDED: maximum overload pressure] |
| Tipo de saída | Analog, Ratiometric | Analog, Ratiometric Voltage |
| Faixa de tensão de saída | 0.2 V to 4.7 V | 0.2 V to 4.7 V |
| Tensão de alimentação | 5 V nominal (4.75 V to 5.25 V) | 4.75 V to 5.25 V (nominal 5 V) |
| Accuracy | 5 % (over 0 C to 85 C) | — |
| Response Time | 1 ms typical | — |
| Temperatura de operação | -40 C to +125 C | [DATA_NEEDED: operating temperature range] |
| Compensated Temperature | 0 C to 85 C | — |
| Port Style | Male, 0.13 in (3.3 mm) tube, Dual, Same Side | Dual horizontal ports, same side |
| Encapsulamento | 8-BSOP (0.475 in / 12.06 mm width), Dual Ports | 8-BSOP (0.475 inch, 12.06 mm width), dual ports same side |
| Tipo de montagem | Surface Mount | Surface Mount |
| Technology | Piezoresistive, MEMS, On-chip Signal Conditioned | — |
| Status RoHS | Compliant | Compliant |
| Sensitivity | — | 45 mV/kPa (nominal) |
| Pressure Accuracy | — | +/- 5% (max, over compensated range) |
| Port Size | — | 0.13 inch (3.3 mm) tube |
| Sensor Technology | — | Piezoresistive (silicon MEMS) with on-chip signal conditioning |