MW7IC2040NR1 vs MD7IC2050NBR1 Comparação

Comparação detalhada lado a lado de MW7IC2040NR1 por NXP Semiconductors e MD7IC2050NBR1 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MW7IC2040NR1 MW7IC2040NR1 - 4W RF LDMOS Wideband PA | NXP | Cellular BTS

MW7IC2040NR1 - 4W RF LDMOS Wideband PA | NXP | Cellular BTS

MW7IC2040NR1 ✓ Ativo
NXP Semiconductors
MD7IC2050NBR1 MD7IC2050NBR1 - 10W W-CDMA RF Power Amplifier 1880-2100MHz | NXP

MD7IC2050NBR1 - 10W W-CDMA RF Power Amplifier 1880-2100MHz | NXP

MD7IC2050NBR1 ✓ Ativo

Comparação de especificações

Parâmetro MW7IC2040NR1 MD7IC2050NBR1
Marca NXP Semiconductors NXP Semiconductors
Categoria RF Amplifiers RF Amplifiers
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $24,20 $22,40
Manufacturer NXP Semiconductors (formerly Freescale / Motorola Semiconductor) —
Technology RF LDMOS (Laterally Diffused MOSFET) —
RF Type General Purpose / Wideband Integrated Power Amplifier W-CDMA
Função Two-stage integrated power amplifier with on-chip matching —
Frequency Range (Application) 1805 MHz to 1990 MHz (covers 1805-1880 MHz DCS/PCS and 1930-1990 MHz UMTS) —
Frequency Range (Characterization) 100 MHz to 1 GHz —
Supply Voltage (Vdd) 24 V to 32 V (nominal 28 V) —
Maximum Supply Voltage 32 V —
Quiescent Supply Current (Idq) 75 mA —
Small-Signal Gain 23.5 dB —
Output Power (avg, W-CDMA) 4 W (typical at rated operating conditions) —
Modulation Compatibility Single W-CDMA, GSM/EDGE, UMTS, LTE, all typical cellular BTS formats —
Encapsulamento / Caixa TO-270 WBL-16 (TO-270-16 Variant, Flat Leads), plastic over-mold surface-mount —
Contagem de pinos 16 —
Operating Mode Class-AB (multi-stage, externally biased) —
Lead Configuration Flat leads (surface-mount) —
Tipo de montagem Surface Mount (PCB solderable with bottom drain ground plane) Surface Mount (flanged lead)
Temperatura de operação -40 C to +85 C (industrial base-station operating ambient; per Freescale/NXP LDMOS module family) [DATA_NEEDED: operating temperature range]
Packaging Type Tape & Reel (per part suffix NR1 suffix convention) —
Status RoHS Compliant (per NXP product family) —
Frequency Range — 1.88 GHz to 2.1 GHz
Operating Bandwidth (broader usability) — 1750 MHz to 2050 MHz
Tensão de alimentação — 28 V
Supply Current (quiescent) — 230 mA
Gain — 30.5 dB
Output Power (P3dB class, datasheet) — [DATA_NEEDED: P3dB output power]
Average Output Power (W-CDMA) — 10 W average
Architecture — Multi-stage RF LDMOS integrated power amplifier
Input Matching — On-chip, 50 ohm, DC blocked
Output Matching — On-chip, >5 ohm nominal
Enable / Disable — Integrated (with quiescent current temperature compensation)
ESD Protection — Integrated
Encapsulamento — TO-272 WB-14 (CASE 1618-02, plastic overmold)
Maximum Junction / Package Temperature — 225 C capable plastic
RoHS Compliance — Compliant (per manufacturer datasheet)

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