S9S08DZ60F1CLH vs MC9S08DN60ACLH Comparação

Comparação detalhada lado a lado de S9S08DZ60F1CLH por NXP Semiconductors e MC9S08DN60ACLH por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
S9S08DZ60F1CLH S9S08DZ60F1CLH - 8-bit 40MHz 60KB Flash MCU, 64-LQFP | NXP

S9S08DZ60F1CLH - 8-bit 40MHz 60KB Flash MCU, 64-LQFP | NXP

S9S08DZ60F1CLH Obsolete
NXP Semiconductors
MC9S08DN60ACLH MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH Nrnd

Comparação de especificações

Parâmetro S9S08DZ60F1CLH MC9S08DN60ACLH
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Obsolete NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $5,95 $5,21
Core Processor S08 —
Core Size 8-bit —
Frequência máxima de clock 40 MHz —
Program Memory Size 60 KB (60K x 8) Flash —
EEPROM Size 2 KB (2K x 8) —
RAM Size [DATA_NEEDED: RAM size] 2 KB (2K x 8)
Supply Voltage (Vdd) 2.7 V to 5.5 V —
Number of I/O Pins 53 —
Encapsulamento 64-LQFP (10x10 mm) —
Tipo de montagem Surface Mount Surface Mount
Connectivity CAN, I2C, LIN, SCI, SPI —
Peripherals LVD, POR, PWM, WDT —
ADC 8-channel 10-bit [DATA_NEEDED: confirmed channel count from datasheet] 16-channel, 12-bit, 2.5 us conversion
Temperatura de operação -40 C to +85 C (industrial) / -40 C to +125 C (automotive) -40C to +85C [DATA_NEEDED: confirm automotive grade range]
Mask Set M74K —
Status do ciclo de vida Obsolete (mask-only factory stock) —
Lead-Free / RoHS [DATA_NEEDED: explicit RoHS claim - LH suffix typically indicates lead-free] —
Core — HCS08 (S08 core)
Largura do barramento de dados — 8 bit
CPU Frequency — 40 MHz
Bus Frequency — 20 MHz
Program Memory (Flash) — 60 KB (60K x 8)
EEPROM — Embedded (size [DATA_NEEDED: EEPROM size])
Number of I/O — 53
Encapsulamento / Caixa — 64-LQFP (10x10 mm)
Communication Interfaces — CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C
Oscillator Type — External
Interrupt Sources — Up to 32
Packaging — Tray
Status RoHS — Compliant
Instruction Set — HC08 + BGND instruction
On-Chip Debug — BDM (Background Debug Mode)

Fichas técnicas e recursos

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