S9S08DZ60F1CLH vs MC9S08DN60ACLH Vergleich

Detaillierter Direktvergleich von S9S08DZ60F1CLH von NXP Semiconductors und MC9S08DN60ACLH von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
S9S08DZ60F1CLH S9S08DZ60F1CLH - 8-bit 40MHz 60KB Flash MCU, 64-LQFP | NXP

S9S08DZ60F1CLH - 8-bit 40MHz 60KB Flash MCU, 64-LQFP | NXP

S9S08DZ60F1CLH Obsolete
NXP Semiconductors
MC9S08DN60ACLH MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH Nrnd

Spezifikationsvergleich

Parameter S9S08DZ60F1CLH MC9S08DN60ACLH
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $5,95 $5,21
Core Processor S08 —
Core Size 8-bit —
Maximale Taktfrequenz 40 MHz —
Program Memory Size 60 KB (60K x 8) Flash —
EEPROM Size 2 KB (2K x 8) —
RAM Size [DATA_NEEDED: RAM size] 2 KB (2K x 8)
Supply Voltage (Vdd) 2.7 V to 5.5 V —
Number of I/O Pins 53 —
Gehäuse 64-LQFP (10x10 mm) —
Montageart Surface Mount Surface Mount
Connectivity CAN, I2C, LIN, SCI, SPI —
Peripherals LVD, POR, PWM, WDT —
ADC 8-channel 10-bit [DATA_NEEDED: confirmed channel count from datasheet] 16-channel, 12-bit, 2.5 us conversion
Betriebstemperatur -40 C to +85 C (industrial) / -40 C to +125 C (automotive) -40C to +85C [DATA_NEEDED: confirm automotive grade range]
Mask Set M74K —
Lebenszyklusstatus Obsolete (mask-only factory stock) —
Lead-Free / RoHS [DATA_NEEDED: explicit RoHS claim - LH suffix typically indicates lead-free] —
Core — HCS08 (S08 core)
Datenbusbreite — 8 bit
CPU Frequency — 40 MHz
Bus Frequency — 20 MHz
Program Memory (Flash) — 60 KB (60K x 8)
EEPROM — Embedded (size [DATA_NEEDED: EEPROM size])
Number of I/O — 53
Gehäuse / Bauform — 64-LQFP (10x10 mm)
Communication Interfaces — CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C
Oscillator Type — External
Interrupt Sources — Up to 32
Packaging — Tray
RoHS-Status — Compliant
Instruction Set — HC08 + BGND instruction
On-Chip Debug — BDM (Background Debug Mode)

Datenblätter & Ressourcen

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