XC7A35T-2FTG256C vs XC7A35T-2FTG256I Comparação
Comparação detalhada lado a lado de XC7A35T-2FTG256C por AMD e XC7A35T-2FTG256I por AMD. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | XC7A35T-2FTG256C | XC7A35T-2FTG256I |
|---|---|---|
| Marca | AMD | AMD |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Device Type | Artix-7 Field Programmable Gate Array (FPGA) | — |
| Logic Cells | 33,280 cells | 33,280 |
| Number of I/Os | 170 I/Os (DigiKey and Octopart listings) | — |
| Alternate I/O Count Listing | 100 I/Os (Newark listing) | — |
| Process Technology | 28 nm | — |
| Speed Grade | -2 | -2 |
| Package Type | FTG256, 256-ball low-profile BGA (256-LBGA) | — |
| Device Family | Artix-7 | — |
| Architecture | 28 nm FPGA | — |
| Product Classification | IC FPGA 170 I/O 256FTBGA | — |
| Programming Technology | Reconfigurable FPGA logic | — |
| Surface-Mount Form | Surface Mount | — |
| Lead-Free Packaging Availability | Available in Pb-free package options | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Faixa de temperatura de operação | [DATA_NEEDED: operating temperature range] | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | 1,843,200 bits (50 x 36 Kb blocks) |
| DSP Slices | [DATA_NEEDED: DSP slice count] | — |
| Frequência máxima de clock | [DATA_NEEDED: maximum clock frequency] | — |
| I/O Standard Support | [DATA_NEEDED: supported I/O standards] | — |
| Family | — | Artix-7 |
| Slices | — | 5,200 |
| DSP48E1 Slices | — | 90 |
| User I/Os (max in FTBGA-256) | — | 170 |
| Clock Management Tiles (CMTs) | — | 4 (1 MMCM + 2 PLLs each) |
| GTP Transceivers | — | 4 (up to 6.6 Gb/s) |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Process Node | — | 28 nm HKMG |
| Encapsulamento | — | 256-ball FTBGA (FTG256) |
| Tipo de montagem | — | Surface Mount (BGA) |
| Nível MSL | — | [DATA_NEEDED: MSL level] |
| Lead-free | — | Yes |