Hitscan Hyperlight X brings lighter weight and 8K polling to wireless mice
The updated Hyperlight X targets lower click latency with SPDT switches, a 35–37 g weight, a PixArt PAW 3950 sensor and an 8K receiver.
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Robotiq 2FC Launch Adds Tactile Intelligence for Robotic Handling
Robotiq's production-ready 2FC combines tactile sensing, local AI and upgrade paths for existing 2F grippers, with shipping planned for the first quarter of 2027.
MasterGaN7 expands 650V GaN design options for power-conversion BOMs
STMicroelectronics added 650V, 6A MasterGaN7 devices with integrated drivers, higher switching capability and package compatibility for power-conversion designs.
Getac B360X refresh raises design-in questions for rugged notebook buyers
Getac launched the B360X and B360X Pro with AI processing, 14-inch displays and expanded connectivity, giving field-computing buyers a new rugged-platform option.
WD Fiscal Q1 2027 Results: Storage Capacity and Sourcing Implications
WD reported 55% revenue growth and higher margins for fiscal Q1 2027, signaling sustained storage demand that buyers should assess against capacity and lead-time plans. [S1]
Over-$500M Gears of War: E-Day budget report raises publisher risk questions
TechPowerUp relays an insider claim that Gears of War: E-Day cost over $500 million to produce, raising questions about revenue recovery and studio staffing.
SAMA S32 WOOD bundles bring compact cases and 650 W or 850 W ATX 3.1 PSUs to US buyers
SAMA is offering the S32 WOOD compact microATX case with 650 W or 850 W 80 Plus Gold power supplies through Amazon US and Newegg US.
NVIDIA books substrate, packaging and test capacity across Amkor, KYEC, SPIL and others: what it means for AI build-out lead times
NVIDIA pairs with seven partners to lift substrate output 2.5x, Amkor interposer wafer capacity over 300%, and double test capacity by 2027; ramps run into 2028.
Gainsborough APU leak points to Steam Deck 2: 50% CPU core bump and 24 GB LPDDR5 at 9600 MT/s
A leaked OpenBenchmarking entry for an AMD Gainsborough engineering sample shows 6 cores, 24 GB LPDDR5 at 9600 MT/s, and Furmark parity with today's Steam Deck at lower resolution.
Colorful X870E Ultra-S V14 lands in CN at $284: what it means for AM5 overclocking boards
Colorful's E-ATX X870E Ultra-S V14 AM5 board ships in China at 1,899 CNY with 16+2+1 80 A VRMs, five M.2 slots and Wi-Fi 7.
EDA revenue hits $5.71B in Q2 2026 with double-digit SIP, APAC growth: design-tool sourcing implications
ESD Alliance Q2 2026 EDMD shows EDA revenue up 12.2% YoY to $5.71B, with Semiconductor IP and APAC leading, and PCB/MCM still contracting.
AMD Ryzen AI 7 HX 455 leak signals a cut-back HX 470 with Z2 Extreme-class Radeon 890M iGPU
A Weibo leak surfaces an 8-core Ryzen AI 7 HX 455 APU with 16 CU Radeon graphics matching the Radeon 890M and 24 MB of L3 cache, pointing at a thinner HX 470 sibling.
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