10AS066H3F34I2LG - 660K Logic Elements Arria 10 SX FPGA
N.º da peça: 10AS066H3F34I2LG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4129.4481 | $4.129,45 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
10AS066H3F34I2LG Visão geral
A system-on-chip FPGA combines programmable logic with fixed processor subsystems and associated peripherals on one semiconductor device. Within the hierarchy, this product is an Arria 10 SX FPGA, a field-programmable gate array, a programmable logic device, and a system-on-chip. The FPGA fabric supports customized datapaths, interfaces, and parallel processing, while the ARM-based processor subsystem supports software execution, control, and protocol management.
The verified headline resources include 660,000 logic elements, a 1.5 GHz stated frequency, 492 I/O, 1152 package balls, and a 35 mm by 35 mm FCBGA body. The Arria 10 SX architecture is intended to bring processor-based control and FPGA-based acceleration into the same design. This can reduce the need for separate processing and logic devices while preserving hardware-level parallelism.
The processor subsystem is identified as dual ARM Cortex-A9 MPCore with CoreSight. The FPGA fabric provides configurable resources for custom accelerators, bridge logic, image or communications pipelines, and real-time control. Exact memory capacity, transceiver count, operating temperature range, core voltage details beyond the available 0.9 V snippet, and speed grade interpretation are not established by the supplied excerpts and therefore require manufacturer-documentation verification before detailed implementation.
Typical applications include industrial imaging and machine vision, communications infrastructure, test and measurement equipment, medical equipment, defense or aerospace signal processing, and high-performance embedded control. The 492 I/O listing makes the device relevant to systems requiring broad external connectivity, while FPGA logic can implement deterministic processing close to data sources.
A critical design consideration is package and signal-integrity planning for the 1152-ball FCBGA. Designers must use the complete manufacturer pinout, recommended power sequencing, decoupling network, PCB stack-up, and thermal solution rather than relying on distributor summaries. Firmware and FPGA configuration compatibility must also be checked against the exact ordering code before board bring-up.
This page combines verified manufacturer and distributor facts, transparent missing-data markers, application context, and drop-in-alternative screening. It does not infer undocumented pin, power, or performance details from similarly named Altera devices.
Alternativas drop-in para 10AS066H3F34I2LG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10AS066H3F34I2LG (mesmo formato e footprint) — diferindo em Package, Transceivers, Logic Elements, Mounting Type, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10AS066H3F34E2LG
✅ Drop-In✓ Em estoque
$2875 / unidade
Ver ficha técnica →10AS066H2F34I2LG
✅ Drop-In✓ Em estoque
$11050 / unidade
Ver ficha técnica →10AS066H3F34I2SG
✅ Drop-In✓ Em estoque
$3200 / unidade
Ver ficha técnica →10AS066H2F34I1HG
✅ Drop-In✓ Em estoque
$3500 / unidade
Ver ficha técnica →10AS066H1F34E1HG
✅ Drop-In✓ Em estoque
$3900 / unidade
Ver ficha técnica →10AS066H3F34I2LG Classificações máximas e características elétricas
| Product Type | System-on-chip FPGA |
| FPGA Family | Arria 10 SX |
| Logic Elements | 660000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Stated Frequency | 1.5 GHz |
| I/O Count | 492 I/O |
| Technology | 20 nm |
| Core Voltage Snippet | 0.9 V |
| Cell Count | 660000 cells |
| Package Pin Count | 1152 pins |
| Package Type | FCBGA |
| Package Dimensions | 35 mm x 35 mm |
| Terminal Form | Ball |
| Tipo de montagem | Surface Mount |
| Temperature Grade | Industrial |
Guia de Configuração de Pinos do 10AS066H3F34I2LG 35 mm x 35 mm
Configuração de pinos para 10AS066H3F34I2LG (pacote 35 mm x 35 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10AS066H3F34I2LG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10AS066H3F34I2LG é adequado para 6 aplicaçãos: Industrial machine vision, Communications infrastructure, Test and measurement equipment, Medical diagnostic equipment, Aerospace signal processing, High-performance embedded control.
Industrial machine vision
Altera 10AS066H3F34I2LG fits industrial machine-vision systems that combine sensor ingestion, deterministic image processing, and processor-based control in one device. Its verified 660,000 logic elements can support parallel pixel processing, frame buffering, filtering, and interface bridging, while the dual ARM Cortex-A9 MPCore subsystem can manage configuration, networking, diagnostics, and application software. The 492 I/O count is useful for cameras, memory interfaces, control signals, and factory networks. The 1152-ball FCBGA package requires controlled impedance, full ball-map review, and careful power integrity.
Recomendado
Communications infrastructure
10AS066H3F34I2LG is suitable for communications infrastructure requiring programmable datapaths alongside an ARM-based management and control subsystem. The FPGA fabric can implement protocol adaptation, packet processing, channelization, error handling, and timing functions, while the dual ARM Cortex-A9 MPCore processors can handle control-plane software, management tasks, and system monitoring. Its 660,000 logic elements and 492 I/O support substantial system integration, but exact transceiver capability, memory interface support, and timing margins are not available in the supplied excerpts. Verify those details before selecting the device for line-rate designs.
Recomendado
Test and measurement equipment
10AS066H3F34I2LG can serve in test and measurement equipment where acquisition, real-time signal processing, control, and analysis must operate together. The programmable fabric can process parallel data streams and implement instrument-specific algorithms, while the dual ARM Cortex-A9 MPCore subsystem can manage user interfaces, calibration, data transfer, and protocol stacks. The 1.5 GHz stated frequency provides a useful headline performance reference, but it is not a complete timing or throughput guarantee. Designers should confirm the exact speed grade, memory interface, I/O standards, power limits, and thermal design from the manufacturer documentation.
Recomendado
Medical diagnostic equipment
10AS066H3F34I2LG may be used in medical diagnostic equipment that requires high-speed data handling, deterministic hardware control, and processor-managed software. Its 660,000 logic elements can support signal conditioning, image reconstruction, filtering, or sensor-interface logic, while the dual ARM Cortex-A9 MPCore subsystem can manage communications, user interfaces, and data processing. The verified results identify industrial temperature grading but do not provide medical certification, RoHS, REACH, or reliability data. Medical designs require separate regulatory, safety, traceability, and lifecycle validation; the supplied information is not a medical qualification statement.
Recomendado
Aerospace signal processing
10AS066H3F34I2LG is relevant to aerospace signal-processing architectures that need hardware parallelism, configurable I/O, and an integrated processor subsystem. FPGA resources can implement real-time filters, sensor fusion, format conversion, and redundant control logic, while the ARM Cortex-A9 MPCore subsystem can run management software and communication stacks. The device’s 1152-ball FCBGA package and 35 mm by 35 mm body are suitable for complex high-density boards, but aerospace suitability depends on radiation data, reliability documentation, temperature range, and qualification records not present in the supplied data. Those requirements must be confirmed independently.
Recomendado
High-performance embedded control
10AS066H3F34I2LG fits high-performance embedded control systems that combine deterministic FPGA execution with an ARM-based operating environment. The programmable fabric can implement motor-control timing, sensor interfaces, safety interlocks, custom protocol bridges, and high-speed control loops, while the dual ARM Cortex-A9 MPCore processors can run supervisory software, networking, logging, and diagnostics. The 492 I/O listing supports broad system connectivity, but the final design must account for package escape routing, signal integrity, decoupling, sequencing, and thermal performance. Exact control-loop performance cannot be inferred from the 1.5 GHz headline value alone.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10AS066H3F34I2LG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10AS066H3F34E2LG | 10AS066H2F34I2LG | 10AS066H3F34I2SG | 10AS066H2F34I1HG | 10AS066H1F34E1HG |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1152-ball FCBGA, 35 mm x 35 mm | 1152-ball FCBGA | 1152-ball FCBGA | 1152-ball FCBGA | 1152-ball FCBGA | 1152-ball FCBGA |
| Product Type | SoC FPGA | SoC FPGA | SoC FPGA | SoC FPGA | SoC FPGA | SoC FPGA |
Principais diferenciais
- Integrated dual ARM Cortex-A9 MPCore processor subsystem (vs 10AS066H3F34E2LG)
- Verified 660,000-logic-element FPGA fabric (vs 10AS066H2F34I2LG)
- High-density 1152-ball FCBGA implementation (vs 10AS066H3F34I2SG)
Notas de projeto
Treat the 0.9 V value as a technology-related voltage snippet, not a complete power design specification. Before layout, obtain the manufacturer’s power-supply connection table, rail tolerances, sequencing requirements, current limits, and recommended decoupling network. Use worst-case FPGA and processor activity to estimate regulator load, transient response, and thermal dissipation. The 1152-ball FCBGA package concentrates many supply and ground connections, so validate plane continuity, via placement, and return paths against the complete package documentation.
The 35 mm by 35 mm FCBGA package requires a deliberate thermal strategy, but the supplied data does not provide thermal resistance, junction-temperature limits, or a reference heatsink design. Confirm those values in the manufacturer datasheet and use the selected PCB stack-up, copper density, airflow, and enclosure conditions for board-level calculations. Keep temperature sensors, power monitoring, and protective shutdown behavior within the validated operating envelope. Do not infer cooling requirements from the 1.5 GHz headline alone.
Use the complete 1152-ball manufacturer package diagram before escape routing. The verified package name and ball count are established, but the supplied excerpts do not contain numbered ball assignments, differential-pair rules, impedance requirements, or recommended layer stack-up. Confirm whether any package variant changes ball functions or voltage domains. Review the exact ordering code and package outline before schematic release, and use controlled-impedance routing, short high-speed paths, continuous reference planes, and adequate via transitions for the selected interface topology.
Do not treat a similar Arria 10 SX ordering code as a drop-in replacement based only on family name, package family, or logic-element count. The supplied cross-reference search did not verify complete pin, electrical, timing, configuration, or processor compatibility. Before substitution, compare the manufacturer ordering-code tables, package ball maps, speed and temperature grades, power rails, boot and configuration interfaces, and supported development tools. If a candidate requires different firmware, board routing, or signal voltage, classify it as a redesign rather than a drop-in alternative.
The 492 I/O listing indicates a broad interface capability, but it does not identify the supported I/O standards, transceiver count, or maximum data rates for the exact device option. Review the complete datasheet for LVDS, single-ended, memory, clock, and serial-interface limits. Define termination, impedance, skew, jitter, and timing budgets during schematic capture, and simulate the selected stack-up before fabrication. Keep clock and high-speed data return paths continuous, and separate noisy switching regions from sensitive processor and reference circuits.
Informações de conformidade
The verified results identify industrial temperature grading and describe a 20 nm FPGA, but do not provide RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. Do not infer those statuses from the manufacturer name or package type.
