10AS066H2F34I1HG - Arria 10 SX SoC FPGA 660K LE | Intel
N.º da peça: 10AS066H2F34I1HG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4426.2 | $4.426,20 |
| 10 | $4200 | $42.000,00 |
| 100 | $3950 | $395.000,00 |
| 500 | $3700 | $1.850.000,00 |
| 1.000 | $3500 | $3.500.000,00 |
10AS066H2F34I1HG Visão geral
A System on Chip (SoC) FPGA is a single silicon device that fuses a general-purpose processor subsystem with configurable FPGA fabric, allowing hardware accelerators to interface with software stacks through standard bus protocols. Within the broader taxonomy, an SoC FPGA belongs to programmable logic devices, which sit alongside ASICs, ASSPs, and microcontrollers in the embedded computing hierarchy. The Arria 10 SX family specifically targets mid-range applications that need ARM Cortex-A9 software compatibility combined with mid-bandwidth FPGA acceleration.
Key features of the 10AS066H2F34I1HG include 660K logic elements, 492 user I/O pins, embedded transceivers supporting multi-gigabit serial protocols, on-chip memory blocks, and DSP blocks optimized for high-throughput signal processing. The HPS includes hardened peripherals such as USB, Gigabit Ethernet, UART, SPI, I2C, and SD/eMMC controllers, reducing external component count. Industrial temperature range (-40C to +100C) supports harsh-environment deployments.
The Arria 10 architecture uses adaptive logic modules (ALMs), variable-precision DSP blocks, and 20-Gbps transceivers. Hardened memory controllers and PCIe Gen2/Gen3 IP blocks reduce soft logic overhead. The integrated HPS connects to FPGA fabric via AXI buses, allowing tight coupling between software tasks running on Cortex-A9 and hardware accelerators in fabric.
Typical applications include 5G baseband processing, industrial motor control, software-defined radio (SDR), military radar and electronic warfare, broadcast video processing, medical imaging accelerators, and high-performance embedded computing platforms. The 1.5 GHz HPS frequency makes it suitable for protocol stack processing, while FPGA fabric handles DSP-intensive operations in parallel.
Design considerations for the 10AS066H2F34I1HG include proper power supply sequencing, JTAG configuration infrastructure, thermal management for the 35x35 mm BGA package, and PCB layout for high-speed transceiver channels. Quartus Prime software is required for synthesis, place-and-route, and HPS firmware development.
Alternativas drop-in para 10AS066H2F34I1HG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10AS066H2F34I1HG (mesmo formato e footprint) — diferindo em Package, Temperature Grade, Logic Elements, Mounting Type, Core Voltage.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10AS066H2F34E2SG
✅ Drop-In✓ Em estoque
$2400 / unidade
Ver ficha técnica →10AS066H2F34E2LG
✅ Drop-In✓ Em estoque
$3250 / unidade
Ver ficha técnica →10AS066H2F34E1HG
✅ Drop-In✓ Em estoque
$2980 / unidade
Ver ficha técnica →10AS066H1F34I1HG
✅ Drop-In✓ Em estoque
$3720 / unidade
Ver ficha técnica →10AS066H1F34E1HG
✅ Drop-In✓ Em estoque
$3900 / unidade
Ver ficha técnica →10AS066H2F34I1HG Classificações máximas e características elétricas
| Series | Arria 10 SX |
| Logic Elements | 660,000 |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Process Technology | 20 nm |
| User I/O Count | 492 |
| Encapsulamento | 1152-pin FC-FBGA (35x35 mm) |
| Tensão de alimentação | 0.9 V |
| Faixa de temperatura de operação | -40C to +100C (Industrial) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Configuration Method | SRAM-based, JTAG |
| On-chip Memory | Embedded memory blocks (M20K) |
| DSP Blocks | Variable-precision DSP |
| Transceivers | Multi-gigabit transceivers (up to 12.5 Gbps) |
| Hard Memory Controller | Yes (DDR3/DDR4/LPDDR3) |
| PCIe Hard IP | PCIe Gen2/Gen3 |
Guia de Configuração de Pinos do 10AS066H2F34I1HG 1152-pin fc-fbga (35x35 mm)
Configuração de pinos para 10AS066H2F34I1HG (pacote 1152-pin fc-fbga (35x35 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10AS066H2F34I1HG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10AS066H2F34I1HG é adequado para 6 aplicaçãos: 5G Baseband Processing, Software Defined Radio (SDR), Industrial Motor Control, Military Radar and Electronic Warfare, Broadcast Video Processing, Medical Imaging Accelerators.
5G Baseband Processing
The 10AS066H2F34I1HG fits 5G baseband processing because its 660K logic elements deliver the parallel DSP throughput needed for PHY-layer channel coding, FFT/IFFT, and MIMO processing. The dual-core ARM Cortex-A9 HPS running at 1.5 GHz handles MAC-layer scheduling and protocol stack execution without off-chip processor latency. Multi-gigabit transceivers supporting up to 12.5 Gbps enable fronthaul CPRI/eCPRI links between the baseband unit and remote radio heads. Hardened PCIe Gen3 IP simplifies backhaul connectivity to host processors, while DDR4 memory controllers sustain the data bandwidth for real-time baseband sample streams. Compared with pure-logic FPGAs, the integrated HPS eliminates an external CPU, reducing PCB footprint and BOM cost in compact small-cell deployments.
Recomendado
Software Defined Radio (SDR)
The 10AS066H2F34I1HG suits SDR platforms because its FPGA fabric accelerates wideband signal processing for waveforms such as LTE, Wi-Fi, and military radio standards, while the Cortex-A9 HPS runs real-time operating systems and waveform libraries. The 12.5 Gbps transceivers handle multi-band RF sampling and digital pre-distortion feedback loops. DSP blocks with variable precision support both fixed-point and floating-point arithmetic, enabling efficient implementation of FFTs, FIR filters, and modulation/demodulation chains. Industrial temperature range ensures operation in tactical and outdoor SDR installations. The integrated ARM cores allow single-chip implementation of waveforms that would otherwise require a separate DSP or CPU subsystem.
Recomendado
Industrial Motor Control
The 10AS066H2F34I1HG addresses industrial motor control by combining FPGA-based high-speed PWM generation and encoder feedback processing with an ARM Cortex-A9 HPS running real-time control loops. Variable-precision DSP blocks execute field-oriented control (FOC) algorithms with sub-microsecond latency. The 492 user I/O pins accommodate multiple motor channels, quadrature encoder interfaces, and industrial communication peripherals. Industrial temperature range (-40C to +100C) supports factory floor and outdoor equipment deployments. HPS peripherals such as CAN, UART, and SPI connect directly to industrial networks, while FPGA fabric implements custom safety logic and fast interrupt handlers required by IEC 61508 functional safety standards.
Recomendado
Military Radar and Electronic Warfare
The 10AS066H2F34I1HG supports military radar and electronic warfare (EW) applications because its 660K logic elements handle wideband digital beamforming, pulse compression, and adaptive jamming algorithms in parallel. The dual-core ARM Cortex-A9 HPS runs threat library databases and mission management software. High-speed transceivers at 12.5 Gbps process digitized antenna array data streams, while variable-precision DSP blocks implement fast Fourier transforms for radar signal processing. Industrial temperature range ensures operation in military vehicle and airborne environments. The FPGA-HPS shared memory architecture via AXI buses enables deterministic low-latency communication between hardware accelerators and mission software, critical for time-sensitive EW responses.
Recomendado
Broadcast Video Processing
The 10AS066H2F34I1HG serves broadcast video processing because its FPGA fabric handles real-time HEVC/H.264 encoding, color space conversion, and overlay compositing at 4K resolutions. The dual-core ARM Cortex-A9 HPS runs video transport protocols (SMPTE 2022, NDI, or MPEG-TS) and network management. Multi-gigabit transceivers support 12G-SDI and HDMI 2.0 interfaces for uncompressed video transport. DDR4 memory controllers sustain the bandwidth required for reference frame buffering at high resolutions. Industrial temperature grade suits outdoor broadcast equipment and mobile production units. The integrated SoC architecture reduces system latency by allowing direct fabric-to-HPS video frame transfer without external memory.
Recomendado
Medical Imaging Accelerators
The 10AS066H2F34I1HG accelerates medical imaging workloads such as CT reconstruction, MRI image processing, and ultrasound beamforming because its parallel fabric executes back-projection, Fourier transforms, and image filtering algorithms at line-rate. The dual-core Cortex-A9 HPS manages DICOM networking, user interface, and patient data handling. Hardened PCIe Gen3 IP enables connection to host workstations or capture cards, while on-chip DSP blocks implement floating-point reconstruction algorithms efficiently. Industrial temperature range supports operation in clinical and laboratory environments. The SoC integration reduces system size for portable imaging carts, and the FPGA-HPS shared memory model eliminates external frame-buffer transfers that would otherwise limit frame rate.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10AS066H2F34I1HG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10AS066H2F34E2SG | 10AS066H2F34E2LG | 10AS066H2F34E1HG | 10AS066H1F34I1HG | 10AS066H1F34E1HG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-pin FC-FBGA (35x35 mm) | 1152-pin FC-FBGA (35x35 mm) - same | 1152-pin FC-FBGA (35x35 mm) - same | 1152-pin FC-FBGA (35x35 mm) - same | 1152-pin FC-FBGA (35x35 mm) - same | 1152-pin FC-FBGA (35x35 mm) - same |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 (H1 family) | 660,000 (H1 family) |
| HPS Core | Dual ARM Cortex-A9 at 1.5 GHz | Dual ARM Cortex-A9 at 1.5 GHz | Dual ARM Cortex-A9 at 1.5 GHz | Dual ARM Cortex-A9 at 1.5 GHz | Dual ARM Cortex-A9 at 1.5 GHz | Dual ARM Cortex-A9 at 1.5 GHz |
| Speed Grade | -2 (H2) | -2 | -2 | -1 (slower) | -2 (H1 family) | -1 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Extended | Extended | Industrial (-40C to +100C) | Extended |
| User I/O Count | 492 | 492 | 492 | 492 | 492 | 492 |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Principais diferenciais
- Integrated dual-core ARM Cortex-A9 HPS at 1.5 GHz (vs 10AS066H1F34I1HG)
- Industrial temperature grade (-40C to +100C) (vs 10AS066H2F34E2SG)
- 660K logic elements in a single SoC device (vs 10AS066H1F34E1HG)
Notas de projeto
The 10AS066H2F34I1HG requires multiple power rails: 0.9 V core, 1.8 V/2.5 V/3.3 V I/O, and dedicated HPS rails (1.1 V, 1.5 V, DDR PHY). Use a sequenced power controller such as the LTC2978 or similar to enforce Intel-specified power-up and power-down sequencing. Decoupling: place 0.1 uF and 10 uF ceramic capacitors adjacent to every power pin, with bulk capacitance distributed across the board. Refer to Intel's 'Arria 10 Power Management User Guide' for the authoritative sequence and tolerance windows.
The 35x35 mm FC-FBGA package has limited heat dissipation through the PCB; in -2 speed grade industrial applications, worst-case power can exceed 25 W. Use a high-layer-count PCB (12+ layers) with dedicated inner power/ground planes, and attach a heatsink with thermal interface material rated for the junction-to-ambient resistance target. Maintain ambient temperature within the device's industrial range (-40C to +100C) by verifying chassis airflow or conduction-cooling capacity.
The 1152-ball FC-FBGA requires a high-density PCB with microvia stack-ups and 0.4-0.5 mm pitch escape routing. Use Intel's 'Arria 10 GX/SX FPGA Board Design Guidelines' for trace width, impedance targets (100 ohm differential for transceivers, 50 ohm single-ended), and layer stackup recommendations. Length-match high-speed interfaces (DDR4, PCIe, transceivers) per the Quartus Prime Fitter reports after place-and-route.
Route multi-gigabit transceiver channels on the top layers with a continuous reference ground plane beneath; avoid crossing reference plane splits. Decouple HPS clock inputs with high-Q crystals or oscillators meeting the jitter spec defined in the HPS clock controller section of the device datasheet. Place the JTAG header within 2 inches of the device for reliable programming, and add test points for PROG_N, CONFIG_DONE, and INIT_DONE signals for debugging.
A common pitfall is configuring the HPS boot source pins incorrectly, which can cause non-boot. Verify MSEL[4:0] and BOOTSEL pin straps against the intended boot source (QSPI, SD, NAND, or eMMC) before board bring-up. Another pitfall is omitting the external watchdog or reset supervisor on HPS reset, leading to boot hangs on power glitches. Always include a POR supervisor with appropriate reset pulse width.
Informações de conformidade
RoHS and REACH compliance per Intel Arria 10 product documentation. AEC-Q100 qualification is not applicable for FPGAs (this is an automotive IC qualification standard typically not pursued for high-density FPGAs). Conflict minerals compliance per Intel's published Conflict-Free Smelter Program disclosures.