10AS066H3F34I2LG - 660K Logic Elements Arria 10 SX FPGA
MPN: 10AS066H3F34I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4129.4481 | $4,129.45 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for 10AS066H3F34I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS066H3F34E2LG
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View Datasheet →10AS066H2F34I2LG
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View Datasheet →10AS066H3F34I2SG
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View Datasheet →10AS066H2F34I1HG
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View Datasheet →10AS066H1F34E1HG
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View Datasheet →10AS066H3F34I2LG Maximum Ratings & Electrical Characteristics
| Product Type | System-on-chip FPGA |
| FPGA Family | Arria 10 SX |
| Logic Elements | 660000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Stated Frequency | 1.5 GHz |
| I/O Count | 492 I/O |
| Technology | 20 nm |
| Core Voltage Snippet | 0.9 V |
| Cell Count | 660000 cells |
| Package Pin Count | 1152 pins |
| Package Type | FCBGA |
| Package Dimensions | 35 mm x 35 mm |
| Terminal Form | Ball |
| Mounting Type | Surface Mount |
| Temperature Grade | Industrial |
10AS066H3F34I2LG 35 mm x 35 mm Pin Configuration Guide
Complete pinout information for 10AS066H3F34I2LG (35 mm x 35 mm package) with 1152 pins pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS066H3F34I2LG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1152 pins pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS066H3F34I2LG is suitable for 6 applications: Industrial machine vision, Communications infrastructure, Test and measurement equipment, Medical diagnostic equipment, Aerospace signal processing, High-performance embedded control.
Industrial machine vision
Altera 10AS066H3F34I2LG fits industrial machine-vision systems that combine sensor ingestion, deterministic image processing, and processor-based control in one device. Its verified 660,000 logic elements can support parallel pixel processing, frame buffering, filtering, and interface bridging, while the dual ARM Cortex-A9 MPCore subsystem can manage configuration, networking, diagnostics, and application software. The 492 I/O count is useful for cameras, memory interfaces, control signals, and factory networks. The 1152-ball FCBGA package requires controlled impedance, full ball-map review, and careful power integrity.
Recommended
Communications infrastructure
10AS066H3F34I2LG is suitable for communications infrastructure requiring programmable datapaths alongside an ARM-based management and control subsystem. The FPGA fabric can implement protocol adaptation, packet processing, channelization, error handling, and timing functions, while the dual ARM Cortex-A9 MPCore processors can handle control-plane software, management tasks, and system monitoring. Its 660,000 logic elements and 492 I/O support substantial system integration, but exact transceiver capability, memory interface support, and timing margins are not available in the supplied excerpts. Verify those details before selecting the device for line-rate designs.
Recommended
Test and measurement equipment
10AS066H3F34I2LG can serve in test and measurement equipment where acquisition, real-time signal processing, control, and analysis must operate together. The programmable fabric can process parallel data streams and implement instrument-specific algorithms, while the dual ARM Cortex-A9 MPCore subsystem can manage user interfaces, calibration, data transfer, and protocol stacks. The 1.5 GHz stated frequency provides a useful headline performance reference, but it is not a complete timing or throughput guarantee. Designers should confirm the exact speed grade, memory interface, I/O standards, power limits, and thermal design from the manufacturer documentation.
Recommended
Medical diagnostic equipment
10AS066H3F34I2LG may be used in medical diagnostic equipment that requires high-speed data handling, deterministic hardware control, and processor-managed software. Its 660,000 logic elements can support signal conditioning, image reconstruction, filtering, or sensor-interface logic, while the dual ARM Cortex-A9 MPCore subsystem can manage communications, user interfaces, and data processing. The verified results identify industrial temperature grading but do not provide medical certification, RoHS, REACH, or reliability data. Medical designs require separate regulatory, safety, traceability, and lifecycle validation; the supplied information is not a medical qualification statement.
Recommended
Aerospace signal processing
10AS066H3F34I2LG is relevant to aerospace signal-processing architectures that need hardware parallelism, configurable I/O, and an integrated processor subsystem. FPGA resources can implement real-time filters, sensor fusion, format conversion, and redundant control logic, while the ARM Cortex-A9 MPCore subsystem can run management software and communication stacks. The device’s 1152-ball FCBGA package and 35 mm by 35 mm body are suitable for complex high-density boards, but aerospace suitability depends on radiation data, reliability documentation, temperature range, and qualification records not present in the supplied data. Those requirements must be confirmed independently.
Recommended
High-performance embedded control
10AS066H3F34I2LG fits high-performance embedded control systems that combine deterministic FPGA execution with an ARM-based operating environment. The programmable fabric can implement motor-control timing, sensor interfaces, safety interlocks, custom protocol bridges, and high-speed control loops, while the dual ARM Cortex-A9 MPCore processors can run supervisory software, networking, logging, and diagnostics. The 492 I/O listing supports broad system connectivity, but the final design must account for package escape routing, signal integrity, decoupling, sequencing, and thermal performance. Exact control-loop performance cannot be inferred from the 1.5 GHz headline value alone.
Recommended
Recommended Products Summary
Engineering reference data for 10AS066H3F34I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS066H3F34E2LG | 10AS066H2F34I2LG | 10AS066H3F34I2SG | 10AS066H2F34I1HG | 10AS066H1F34E1HG |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1152-ball FCBGA, 35 mm x 35 mm | 1152-ball FCBGA | 1152-ball FCBGA | 1152-ball FCBGA | 1152-ball FCBGA | 1152-ball FCBGA |
| Product Type | SoC FPGA | SoC FPGA | SoC FPGA | SoC FPGA | SoC FPGA | SoC FPGA |
| Logic Elements | 660000 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Stated Frequency | 1.5 GHz | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| I/O Count | 492 I/O | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Technology | 20 nm | 20 nm [DATA_NEEDED: exact option confirmation] | 20 nm [DATA_NEEDED: exact option confirmation] | 20 nm [DATA_NEEDED: exact option confirmation] | 20 nm [DATA_NEEDED: exact option confirmation] | 20 nm [DATA_NEEDED: exact option confirmation] |
Key Differentiators
- Integrated dual ARM Cortex-A9 MPCore processor subsystem (vs 10AS066H3F34E2LG)
- Verified 660,000-logic-element FPGA fabric (vs 10AS066H2F34I2LG)
- High-density 1152-ball FCBGA implementation (vs 10AS066H3F34I2SG)
Design Notes
Treat the 0.9 V value as a technology-related voltage snippet, not a complete power design specification. Before layout, obtain the manufacturer’s power-supply connection table, rail tolerances, sequencing requirements, current limits, and recommended decoupling network. Use worst-case FPGA and processor activity to estimate regulator load, transient response, and thermal dissipation. The 1152-ball FCBGA package concentrates many supply and ground connections, so validate plane continuity, via placement, and return paths against the complete package documentation.
The 35 mm by 35 mm FCBGA package requires a deliberate thermal strategy, but the supplied data does not provide thermal resistance, junction-temperature limits, or a reference heatsink design. Confirm those values in the manufacturer datasheet and use the selected PCB stack-up, copper density, airflow, and enclosure conditions for board-level calculations. Keep temperature sensors, power monitoring, and protective shutdown behavior within the validated operating envelope. Do not infer cooling requirements from the 1.5 GHz headline alone.
Use the complete 1152-ball manufacturer package diagram before escape routing. The verified package name and ball count are established, but the supplied excerpts do not contain numbered ball assignments, differential-pair rules, impedance requirements, or recommended layer stack-up. Confirm whether any package variant changes ball functions or voltage domains. Review the exact ordering code and package outline before schematic release, and use controlled-impedance routing, short high-speed paths, continuous reference planes, and adequate via transitions for the selected interface topology.
Do not treat a similar Arria 10 SX ordering code as a drop-in replacement based only on family name, package family, or logic-element count. The supplied cross-reference search did not verify complete pin, electrical, timing, configuration, or processor compatibility. Before substitution, compare the manufacturer ordering-code tables, package ball maps, speed and temperature grades, power rails, boot and configuration interfaces, and supported development tools. If a candidate requires different firmware, board routing, or signal voltage, classify it as a redesign rather than a drop-in alternative.
The 492 I/O listing indicates a broad interface capability, but it does not identify the supported I/O standards, transceiver count, or maximum data rates for the exact device option. Review the complete datasheet for LVDS, single-ended, memory, clock, and serial-interface limits. Define termination, impedance, skew, jitter, and timing budgets during schematic capture, and simulate the selected stack-up before fabrication. Keep clock and high-speed data return paths continuous, and separate noisy switching regions from sensitive processor and reference circuits.
Compliance Information
The verified results identify industrial temperature grading and describe a 20 nm FPGA, but do not provide RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. Do not infer those statuses from the manufacturer name or package type.
