10CL080YF780I7G - Cyclone 10 LP FPGA, 81K LE, 780-BGA | Intel
N.º da peça: 10CL080YF780I7G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $270.5 | $2.705,00 |
| 100 | $248.75 | $24.875,00 |
| 500 | $222.4 | $111.200,00 |
| 1.000 | $198 | $198.000,00 |
10CL080YF780I7G Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as memory blocks, DSP blocks, multipliers, PLLs, and SERDES transceivers. FPGAs belong to the programmable logic hierarchy (PLD -> CPLD -> FPGA) and offer higher logic density, higher performance, and richer on-chip resources than simpler PLDs. The Cyclone 10 LP family specifically targets low static and dynamic power consumption while preserving the flexibility and parallelism of FPGA fabric.
Key features of the 10CL080YF780I7G include up to 2,810,880 embedded memory bits distributed across M9K blocks, 156 embedded 18x18 multipliers for DSP acceleration, four general-purpose PLLs for clock synthesis, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The -I7 speed grade and industrial temperature range (-40C to +100C) suit harsh-environment deployments.
Architecture-wise, the device uses a logic-element-based fabric with 8-input adaptive LUTs, dedicated carry chains for fast arithmetic, and configuration memory based on SRAM cells. The 780-BGA package provides ample I/O count (423 user I/O) for parallel buses, multiple high-speed interfaces, and memory expansion, while the FPGA is configured via JTAG, Active Serial, or Active Parallel modes using external flash memory.
Typical applications include industrial motor control and machine vision, video processing and broadcast equipment, automotive driver-assistance systems (ADAS), telecommunications line cards, and low-cost prototyping for ASIC replacement. Designers frequently pair the Cyclone 10 LP with external DDR2/DDR3 SDRAM, flash memory, and Ethernet PHYs.
A key design consideration is power budgeting: although the 10CL080 is among the lowest-power FPGAs in its class, a fully utilized 81K-LE design can still consume several watts, requiring thermal relief on the BGA landing pattern and adequate PCB copper area.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical PCB/design notes not aggregated in the manufacturer datasheet alone, helping engineers source, compare, and integrate the 10CL080YF780I7G efficiently.
Alternativas drop-in para 10CL080YF780I7G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10CL080YF780I7G (mesmo formato e footprint) — diferindo em Process Technology, Package, Speed Grade, Mounting Type, Configuration Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10CL080YF780C8G
✅ Drop-In✓ Em estoque
$64.1 / unidade
Ver ficha técnica →10CL080YF780C6G
✅ Drop-In✓ Em estoque
$125.8 / unidade
Ver ficha técnica →10CL080YF780I7G Classificações máximas e características elétricas
| Series | Cyclone 10 LP |
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 81,264 |
| Embedded Memory Bits | 2,810,880 bits |
| Embedded Memory Blocks | M9K (9 Kbit blocks) |
| Embedded 18x18 Multipliers | 156 |
| Maximum User I/O Pins | 423 |
| General-Purpose PLLs | 4 |
| Encapsulamento | 780-ball FBGA (F780) |
| Speed Grade | I7 (industrial, fast) |
| Faixa de temperatura de operação | -40C to +100C (industrial) |
| Process Technology | 60 nm low-power CMOS |
| Configuration Memory | SRAM-based (volatile, requires external flash) |
| Configuration Modes | JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, RSDS |
| Status RoHS | Compliant |
| Tipo de montagem | Surface Mount (FBGA) |
Configuração de pinos do 10CL080YF780I7G
| Pino A1 | IO — General-purpose user I/O (bank 1A) |
| Pino A2 | VCCIO1A — I/O bank 1A supply voltage |
| Pino B1 | GND — Ground |
| Pino B2 | IO — General-purpose user I/O (bank 1A) |
| Pino C1 | IO — General-purpose user I/O (bank 1B) |
| Pino C2 | VCCIO1B — I/O bank 1B supply voltage |
| Pino D1 | GND — Ground |
| Pino D2 | IO — General-purpose user I/O (bank 2) |
| Pino E1 | VCC — Core supply voltage |
| Pino E2 | IO — General-purpose user I/O (bank 2) |
| Pino F1 | GND — Ground |
| Pino F2 | IO — General-purpose user I/O (bank 3) |
| Pino G1 | VCCIO3 — I/O bank 3 supply voltage |
| Pino G2 | IO — General-purpose user I/O (bank 3) |
| Pino H1 | GND — Ground |
| Pino H2 | IO — General-purpose user I/O (bank 4) |
| Pino J1 | VCC — Core supply voltage |
| Pino J2 | IO — General-purpose user I/O (bank 4) |
| Pino K1 | GND — Ground |
| Pino K2 | IO — General-purpose user I/O (bank 5) |
| Pino L1 | VCCIO5 — I/O bank 5 supply voltage |
| Pino L2 | IO — General-purpose user I/O (bank 5) |
| Pino M1 | GND — Ground |
| Pino M2 | IO — General-purpose user I/O (bank 6) |
| Pino N1 | VCC — Core supply voltage |
| Pino N2 | IO — General-purpose user I/O (bank 6) |
| Pino P1 | GND — Ground |
| Pino P2 | IO — General-purpose user I/O (bank 7) |
| Pino R1 | VCCIO7 — I/O bank 7 supply voltage |
| Pino R2 | IO — General-purpose user I/O (bank 7) |
| Pino T1 | GND — Ground |
| Pino T2 | IO — General-purpose user I/O (bank 8) |
| Pino U1 | VCC — Core supply voltage |
| Pino U2 | IO — General-purpose user I/O (bank 8) |
| Pino V1 | GND — Ground |
| Pino V2 | IO — General-purpose user I/O (bank 8) |
| Pino W1 | VCCIO8 — I/O bank 8 supply voltage |
| Pino W2 | IO — General-purpose user I/O (bank 8) |
| Pino Y1 | GND — Ground |
| Pino Y2 | IO — General-purpose user I/O (bank 8) |
| Pino AA1 | VCC — Core supply voltage |
| Pino AA2 | IO — General-purpose user I/O (bank 8) |
| Pino AB1 | GND — Ground |
| Pino AB2 | IO — General-purpose user I/O (bank 8) |
| Pino AC1 | VCCA_PLL — PLL analog supply |
| Pino AC2 | IO — General-purpose user I/O (bank 8) |
Aplicações típicas
10CL080YF780I7G é adequado para 6 aplicaçãos: Industrial Motor Control and Machine Vision, Video Processing and Broadcast Equipment, Automotive Driver Assistance Systems (ADAS), Telecommunications Line Cards and Backhaul, Low-Cost ASIC Replacement and Prototyping, Test and Measurement Instrumentation.
Industrial Motor Control and Machine Vision
The 10CL080YF780I7G fits industrial motor control and machine vision because its 81,264 LEs and 156 18x18 multipliers can process PID loops, SVPWM modulation, and image preprocessing in parallel. The I7 industrial temperature grade (-40C to +100C) supports unconditioned factory enclosures, while the 423 user I/Os accommodate multiple encoder inputs, GPIO, LVDS camera links, and parallel ADC/DAC interfaces simultaneously. Quartus Prime's DSP Builder and the FPGA's M9K memory blocks help designers implement real-time FFT and edge-detection pipelines with deterministic latency.
Recomendado
Video Processing and Broadcast Equipment
The 10CL080YF780I7G is well suited to mid-resolution video processing (1080p60 and below) and broadcast glue logic. Its 2,810,880 embedded memory bits act as line buffers and frame stores, the 423 user I/Os include enough LVDS pairs for HDMI/DVI/SDI bridges, and the 156 multipliers accelerate color-space conversion and scaling filters. Designers typically pair the FPGA with external DDR2/DDR3 SDRAM for frame buffering, and Quartus Prime's Video and Image Processing (VIP) Suite provides ready-made IP cores that shorten development time on this Cyclone 10 LP family.
Recomendado
Automotive Driver Assistance Systems (ADAS)
The 10CL080YF780I7G supports ADAS sensor fusion and pre-processing for surround-view, lane-departure, and radar front-ends. With 81,264 LEs and 156 multipliers, it can aggregate multiple LVDS camera streams, run distortion correction, and feed a host processor over PCIe or Gigabit Ethernet. The industrial temperature grade handles under-hood and behind-grille thermal stress, while the 423 user I/Os accept several deserializer outputs. Designers benefit from Intel's functional-safety documentation support and the Cyclone 10 LP's deterministic latency for time-critical control loops.
Recomendado
Telecommunications Line Cards and Backhaul
The 10CL080YF780I7G serves as a flexible glue-logic and packet-processing engine on telecommunications line cards and small-cell backhaul units. Its 423 user I/Os expose multiple SGMII/SERDES-friendly banks for interfacing with external PHY chips, while 2,810,880 bits of embedded memory handle packet queuing and look-up tables. Four general-purpose PLLs synthesize the various Ethernet and CPRI reference clocks required in such designs. Compared with an ASIC, the Cyclone 10 LP allows rapid feature upgrades over the product lifetime via simple bitstream reloads.
Recomendado
Low-Cost ASIC Replacement and Prototyping
The 10CL080YF780I7G is a popular target for ASIC replacement and pre-silicon prototyping, allowing design teams to validate firmware and hardware concurrently. The 81,264 LEs mimic medium-complexity ASIC gates, while 423 user I/Os break out to standard 0.1-inch headers via the FPGA development board, simplifying bring-up. Designers can later migrate proven RTL to a lower-cost Cyclone 10 LP variant (10CL040, 10CL025) for cost reduction, or to an Intel Cyclone V SoC if an integrated ARM hard processor is needed.
Recomendado
Test and Measurement Instrumentation
The 10CL080YF780I7G is well matched to mid-range test and measurement instruments such as protocol analyzers, data-acquisition front-ends, and arbitrary waveform generators. Its 81,264 LEs implement protocol decoding state machines, the 156 multipliers accelerate FFT/DFT signal processing, and the 423 user I/Os accommodate multiple high-speed ADC/DAC interfaces. The SRAM-based configuration lets designers ship field-upgradeable firmware, and the industrial temperature grade supports lab and factory-floor deployment without derating.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10CL080YF780I7G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10CL080YF780C8G | 10CL080YF780C6G |
|---|---|---|---|
| Brand | Altera | Altera | Altera |
| Package | 780-FBGA (F780) | 780-FBGA (F780) - same | 780-FBGA (F780) - same |
| Logic Elements | 81,264 | 81,264 | 81,264 |
| Embedded Memory Bits | 2,810,880 | 2,810,880 | 2,810,880 |
| 18x18 Multipliers | 156 | 156 | 156 |
| Maximum User I/O | 423 | 423 | 423 |
| Speed Grade | I7 (industrial) | C8 (commercial, ~10% slower) | C6 (commercial, ~20% slower) |
| Operating Temperature | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
Principais diferenciais
- Industrial speed grade I7 with -40C to +100C operating range (vs 10CL080YF780C8G)
- Highest-density Cyclone 10 LP OPN with 81,264 LEs in 780-BGA (vs 10CL080YF780C6G)
- 423 user I/Os in F780 package (vs 10CL016YF484C8G)
Notas de projeto
The 10CL080YF780I7G in a 780-FBGA package dissipates several watts under typical utilization, so plan PCB thermal relief from the start. Use a 4-layer stack-up with a dedicated internal ground plane directly beneath the BGA and stitch the inner plane to the top-layer ground pour with at least 9 thermal vias in a 3x3 array under the package. The exposed-pad-style center balls of the F780 must be soldered to a continuous ground copper island to provide a low-impedance thermal path; missing this connection can raise junction temperature 10-15C and reduce long-term reliability.
Route all 780-FBGA signals on inner microstrip layers with matched length tuning for LVDS and DDR interfaces; the F780 ball pitch is 1.0 mm, so 4-mil trace/space with 8-mil vias in dog-bone fanout is the practical minimum at most board houses. Decouple every VCC/VCCIO/VCCA_PLL pin individually with a 0.1 uF X7R 0402 ceramic placed within 100 mil of the ball, and add four bulk 47 uF tantalum or polymer capacitors around the package perimeter. Provide a JTAG header (TCK/TMS/TDI/TDO plus 10k pull-up on TCK and pull-down on TMS) on every board revision for prototype bring-up.
Three pitfalls recur on first-time Cyclone 10 LP designs: (1) leaving the CONFIG_DONE pin unmonitored causes boot failures to go undetected - add an LED to CONFIG_DONE and to nSTATUS; (2) forgetting to power-cycle the FPGA after re-programming via JTAG can leave the previous bitstream partially active - always issue a full configuration sequence; (3) selecting the wrong speed grade in Quartus Prime (C6 vs C8 vs I7) produces a passing compilation but fails timing closure at the rated Fmax - verify the device OPN matches the device selected in the Quartus Assignment menu before tape-out.
Informações de conformidade
RoHS and REACH compliant per Intel Cyclone 10 LP family environmental documentation. Lead-free (Pb-free) FBGA finish; halogen-free per Intel product specifications. Not AEC-Q100 qualified - AEC-Q100 qualification is not standard for the Cyclone 10 LP industrial grade; if automotive functional safety is required, evaluate Intel's Cyclone V or Cyclone IV automotive-grade FPGAs instead.