10CL025YU256C8G - Cyclone 10 LP FPGA, 25K LE, 256-BGA | Intel
N.º da peça: 10CL025YU256C8G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $50.89 | $50,89 |
| 10 | $45.8 | $458,00 |
| 100 | $40.71 | $4.071,00 |
| 500 | $36.62 | $18.310,00 |
| 1.000 | $32.54 | $32.540,00 |
10CL025YU256C8G Visão geral
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware resources such as block RAM, DSP blocks, and high-speed transceivers. Within the broader taxonomy of digital logic devices, an FPGA sits between fixed-function Application Specific Integrated Circuits (ASICs) and microcontrollers, offering hardware-level parallelism with software-style reconfigurability. FPGAs belong to the broader category of programmable logic devices (PLDs) and are widely used for I/O expansion, chip-to-chip bridging, and acceleration of parallel compute tasks.
Key features of the 10CL025YU256C8G include 24,624 logic elements, 594 Kbits of embedded memory (M9K blocks), 66 embedded 18x18 multipliers, and 4 general-purpose PLLs per device. The Cyclone 10 LP family is built on a low-power process that delivers static power as low as 25 mW, making it suitable for thermally constrained designs without active cooling. Configuration is supported via an industry-standard serial or parallel configuration scheme.
The Cyclone 10 LP architecture combines an efficient logic fabric with hard IP blocks for memory interfaces (DDR3/LPDDR2 controllers), PCIe Gen2, and high-speed LVDS I/O. Designers can implement custom peripherals, state machines, and signal processing pipelines in parallel hardware, achieving deterministic latency that microcontrollers cannot match. The U256 package variant provides a 14x14 mm footprint with 0.8 mm ball pitch, supporting PCB designs that balance routing density with assembly yield.
Typical applications include industrial I/O expansion modules, motor control front-ends, sensor fusion hubs, video bridging and format adaptation, low-cost PCIe endpoint cards, and general-purpose logic replacement for discrete glue logic. The low static and dynamic power also makes the part attractive for battery-powered or fanless embedded systems.
When designing with the 10CL025YU256C8G, ensure the Quartus Prime design suite is used for synthesis, place-and-route, and timing closure. Verify all I/O assignments against the U256 pinout, and provide adequate decoupling on each power rail (1.2V core, 2.5V analog, 3.3V I/O). For high-speed LVDS or DDR3 interfaces, follow the recommended PCB stackup and impedance control guidelines.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Engineers evaluating the Cyclone 10 LP family for a new design will find parametric comparisons, alternative part numbers, and application notes consolidated in one place.
Alternativas drop-in para 10CL025YU256C8G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10CL025YU256C8G (mesmo formato e footprint) — diferindo em Package, Speed Grade, Logic Elements (LE), Operating Temperature, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10CL025YU256C6G
✅ Drop-In✓ Em estoque
$25.6 / unidade
Ver ficha técnica →10CL025YU256A7G
✅ Drop-In✓ Em estoque
$24.1 / unidade
Ver ficha técnica →10CL016YU256C8G
✅ Drop-In✓ Em estoque
$10.87 / unidade
Ver ficha técnica →10CL016YU256C6G
✅ Drop-In✓ Em estoque
$23.75 / unidade
Ver ficha técnica →10CL016YU256A7G
✅ Drop-In✓ Em estoque
$24.9 / unidade
Ver ficha técnica →10CL025YU256C8G Classificações máximas e características elétricas
| Family | Cyclone® 10 LP |
| Series | 10CL025 |
| Logic Elements | 24,624 |
| Total RAM Bits | 608,256 |
| User I/O Count | 150 |
| Encapsulamento | 256-LFBGA / UFBGA (U256) |
| Package Dimensions | 14 mm x 14 mm |
| Ball Pitch | 0.8 mm |
| Core Voltage | 1.2 V |
| Temperatura de operação | 0C to +85C (Commercial) |
| Tipo de montagem | Surface Mount |
| Lead Shape | Ball |
| Contagem de pinos | 256 |
| Configuration | Serial / Parallel |
| Embedded Multipliers | 66 (18x18) |
| PLLs | 4 |
| Static Power | 25 mW (typical) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do 10CL025YU256C8G 14 mm x 14 mm
Configuração de pinos para 10CL025YU256C8G (pacote 14 mm x 14 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10CL025YU256C8G.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10CL025YU256C8G é adequado para 7 aplicaçãos: Industrial I/O Expansion, Motor Control Front-End, Video Bridging and Format Adaptation, Sensor Fusion Hub, Low-Cost PCIe Endpoint Card, Discrete Glue Logic Replacement, Communication Protocol Bridge.
Industrial I/O Expansion
The 10CL025YU256C8G is well suited for industrial I/O expansion modules where 24,624 logic elements can implement multiple communication protocols (Modbus, RS-485, CAN, SPI, I2C) and 150 user I/O pins deliver enough headroom for opto-isolated inputs, relay outputs, and fieldbus transceivers. The 1.2V core voltage reduces thermal dissipation compared to legacy FPGAs, enabling fanless DIN-rail enclosure designs. Pair with the MAX1300 ADC for analog front-end monitoring.
Recomendado
Motor Control Front-End
The 10CL025YU256C8G provides deterministic hardware parallelism ideal for Field-Oriented Control (FOC) and stepper motor commutation loops. Its 66 embedded 18x18 multipliers accelerate Park/Clarke transforms and PID loops at sub-microsecond latency, while the 4 general-purpose PLLs synthesize the precise PWM switching frequencies required by IGBT/MOSFET gate drivers. The 150 I/O count supports multi-axis encoder feedback and resolver excitation simultaneously.
Recomendado
Video Bridging and Format Adaptation
The 10CL025YU256C8G can implement real-time video bridging between MIPI CSI-2, LVDS, parallel RGB, and HDMI interfaces, leveraging its hardware parallelism for pixel-rate processing without software bottlenecks. The 608 Kbits of embedded RAM supports line buffers and frame synchronization FIFOs, while 150 I/O lanes accommodate multi-channel parallel video buses. This makes the part suitable for industrial cameras, medical imaging, and HMI display controllers.
Recomendado
Sensor Fusion Hub
In sensor fusion applications, the 10CL025YU256C8G aggregates IMU, magnetometer, barometric, and GNSS data streams, running Kalman filter algorithms in hardware that would overwhelm a microcontroller. The 24,624 logic elements accommodate full sensor interfaces, while the 66 multipliers accelerate matrix operations required for 9-DoF fusion. Low static power of 25 mW enables battery-powered IoT and wearable designs with always-on sensor processing.
Recomendado
Low-Cost PCIe Endpoint Card
The Cyclone 10 LP architecture supports a hard PCIe Gen2 IP core that the 10CL025YU256C8G can implement as a single-lane endpoint, making it ideal for low-cost PCIe add-in cards such as protocol analyzers, data loggers, and custom accelerators. The 24K logic elements fit a Gen2 x1 endpoint plus DMA engine and device-side state machine. Its 1.2V core reduces auxiliary board power compared to larger FPGAs, which is critical for slot-powered cards.
Recomendado
Discrete Glue Logic Replacement
For designers consolidating TTL/CMOS glue logic - counters, address decoding, custom state machines, bus arbitration - the 10CL025YU256C8G replaces dozens of discrete packages with a single programmable device. The 24,624 logic elements and 150 I/O count exceed typical glue-logic demands, leaving significant headroom for design evolution. PCB real estate is reclaimed and BOM count drops, while the 1.2V core keeps thermal dissipation low.
Recomendado
Communication Protocol Bridge
The 10CL025YU256C8G implements multi-protocol bridging between UART, SPI, I2C, CAN, Ethernet MAC, and PCIe endpoints in a single device. Its 608 Kbits embedded RAM supports packet buffering, while 150 I/O pins accommodate multiple transceiver interfaces simultaneously. The 4 PLLs generate independent clocks for each protocol domain, eliminating external clock buffers and reducing BOM complexity.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10CL025YU256C8G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10CL025YU256C6G | 10CL025YU256A7G | 10CL016YU256C8G | 10CL016YU256C6G | 10CL016YU256A7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LFBGA (U256) | 256-LFBGA (U256) - same | 256-LFBGA (U256) - same | 256-LFBGA (U256) - same | 256-LFBGA (U256) - same | 256-LFBGA (U256) - same |
| Logic Elements | 24,624 | 24,624 | 24,624 | 15,408 | 15,408 | 15,408 |
| Total RAM Bits | 608,256 | 608,256 | 608,256 | 303,744 | 303,744 | 303,744 |
| User I/O Count | 150 | 150 | 150 | 150 | 150 | 150 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | C8 (speed grade 8) | C6 (speed grade 6) | A7 (grade 7) | C8 (speed grade 8) | C6 (speed grade 6) | A7 (grade 7) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
Principais diferenciais
- 25K logic element density at low power (vs 10CL016YU256C8G)
- Speed grade 8 (C8) timing margin (vs 10CL025YU256C6G)
- Drop-in compatibility with full Cyclone 10 LP U256 family (vs 10CL016YU256C8G)
Notas de projeto
Estimated: At 1.2V core voltage and typical 25 mW static power plus dynamic power (varies with utilization and toggle rate), the 10CL025YU256C8G in a U256 BGA package typically dissipates 1-3W in real designs. The U256 BGA thermal pad must be soldered to a continuous ground plane with thermal vias for proper heat dissipation; without this, junction temperature can exceed 125C in enclosed industrial enclosures. Add 4-9 thermal vias (0.3 mm drill, 1 oz copper) directly under the package thermal pad.
Use microvia-in-pad technology (laser-drilled, 0.1 mm capture pad) on the 0.8 mm BGA balls to ensure reliable assembly yield on standard 6-layer FR-4 stackup. Route all signal escapes on the top layer with dog-bone fanout, and dedicate inner layers to ground/power planes. Decouple each power rail with 100nF X7R capacitors placed within 2 mm of the BGA balls, plus 10uF bulk capacitors on each supply island (1.2V VCCINT, 2.5V VCCA, 3.3V VCCIO).
Do not mix Cyclone 10 LP pin assignments between U256 (256-ball BGA) and E144 (144-pin EQFP) packages - I/O bank assignments and pin names differ entirely. Always re-run Quartus Prime Pin Planner for the U256 package when porting designs from other Cyclone 10 LP packages. Confirm MSL3 moisture sensitivity handling per J-STD-033 before reflow assembly - U256 BGA requires pre-bake if floor life exposure exceeds 168 hours.
Informações de conformidade
RoHS and lead-free compliance per Intel/Altera product page. Commercial temperature grade (0C to +85C); industrial/automotive variants available in I7G and A7G suffixes.
