Altera

10CL080YF780I7G - Cyclone 10 LP FPGA, 81K LE, 780-BGA | Intel

MPN: 10CL080YF780I7G βœ“ Active
In Stock Ships in 1-3 business days
LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, RSDS Rds(on) 780-ball FBGA (F780) Package I7 (industrial, fast) Speed 2,810,880 bits Memory
From $198 USD / Unit
MOQ: 1 |
Price updated: 2026-09-05
Volume Pricing
Qty Unit Price Extended
1 $285 $285.00
10 $270.5 $2,705.00
100 $248.75 $24,875.00
500 $222.4 $111,200.00
1,000 $198 $198,000.00
ℹ️ All prices are in USD

Drop-in alternatives for 10CL080YF780I7G β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

10CL080YF780C8G

βœ… Drop-In
Intel
πŸ“¦ 780-FBGA (F780)
Cyclone 10 LP Β· 81,264 Β· 2,810,880 Β· M9K Β· 423 Β· 423 Β· 4 Β· 20

βœ“ In Stock

$64.1 / Unit

View Datasheet β†’

10CL080YF780C6G

βœ… Drop-In
Intel
πŸ“¦ 780-FBGA (F780)
Cyclone 10 LP Β· 10CL080 Β· 81,264 (81264) Β· 2,810,880 (2810880) Β· 423 Β· 780-ball FineLine BGA (F780) Β· F780 Β· C6

βœ“ In Stock

$125.8 / Unit

View Datasheet β†’

10CL080YF780I7G Maximum Ratings & Electrical Characteristics

Series Cyclone 10 LP
Family Cyclone 10 LP
Logic Elements (LE) 81,264
Embedded Memory Bits 2,810,880 bits
Embedded Memory Blocks M9K (9 Kbit blocks)
Embedded 18x18 Multipliers 156
Maximum User I/O Pins 423
General-Purpose PLLs 4
Package 780-ball FBGA (F780)
Speed Grade I7 (industrial, fast)
Operating Temperature Range -40C to +100C (industrial)
Process Technology 60 nm low-power CMOS
Configuration Memory SRAM-based (volatile, requires external flash)
Configuration Modes JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS)
Supported I/O Standards LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, RSDS
RoHS Status Compliant
Mounting Type Surface Mount (FBGA)

10CL080YF780I7G Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 IO β€” General-purpose user I/O (bank 1A)
Pin A2 VCCIO1A β€” I/O bank 1A supply voltage
Pin B1 GND β€” Ground
Pin B2 IO β€” General-purpose user I/O (bank 1A)
Pin C1 IO β€” General-purpose user I/O (bank 1B)
Pin C2 VCCIO1B β€” I/O bank 1B supply voltage
Pin D1 GND β€” Ground
Pin D2 IO β€” General-purpose user I/O (bank 2)
Pin E1 VCC β€” Core supply voltage
Pin E2 IO β€” General-purpose user I/O (bank 2)
Pin F1 GND β€” Ground
Pin F2 IO β€” General-purpose user I/O (bank 3)
Pin G1 VCCIO3 β€” I/O bank 3 supply voltage
Pin G2 IO β€” General-purpose user I/O (bank 3)
Pin H1 GND β€” Ground
Pin H2 IO β€” General-purpose user I/O (bank 4)
Pin J1 VCC β€” Core supply voltage
Pin J2 IO β€” General-purpose user I/O (bank 4)
Pin K1 GND β€” Ground
Pin K2 IO β€” General-purpose user I/O (bank 5)
Pin L1 VCCIO5 β€” I/O bank 5 supply voltage
Pin L2 IO β€” General-purpose user I/O (bank 5)
Pin M1 GND β€” Ground
Pin M2 IO β€” General-purpose user I/O (bank 6)
Pin N1 VCC β€” Core supply voltage
Pin N2 IO β€” General-purpose user I/O (bank 6)
Pin P1 GND β€” Ground
Pin P2 IO β€” General-purpose user I/O (bank 7)
Pin R1 VCCIO7 β€” I/O bank 7 supply voltage
Pin R2 IO β€” General-purpose user I/O (bank 7)
Pin T1 GND β€” Ground
Pin T2 IO β€” General-purpose user I/O (bank 8)
Pin U1 VCC β€” Core supply voltage
Pin U2 IO β€” General-purpose user I/O (bank 8)
Pin V1 GND β€” Ground
Pin V2 IO β€” General-purpose user I/O (bank 8)
Pin W1 VCCIO8 β€” I/O bank 8 supply voltage
Pin W2 IO β€” General-purpose user I/O (bank 8)
Pin Y1 GND β€” Ground
Pin Y2 IO β€” General-purpose user I/O (bank 8)
Pin AA1 VCC β€” Core supply voltage
Pin AA2 IO β€” General-purpose user I/O (bank 8)
Pin AB1 GND β€” Ground
Pin AB2 IO β€” General-purpose user I/O (bank 8)
Pin AC1 VCCA_PLL β€” PLL analog supply
Pin AC2 IO β€” General-purpose user I/O (bank 8)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 10CL080YF780I7G Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

10CL080YF780I7G is suitable for 6 applications: Industrial Motor Control and Machine Vision, Video Processing and Broadcast Equipment, Automotive Driver Assistance Systems (ADAS), Telecommunications Line Cards and Backhaul, Low-Cost ASIC Replacement and Prototyping, Test and Measurement Instrumentation.

🏭

Industrial Motor Control and Machine Vision

The 10CL080YF780I7G fits industrial motor control and machine vision because its 81,264 LEs and 156 18x18 multipliers can process PID loops, SVPWM modulation, and image preprocessing in parallel. The I7 industrial temperature grade (-40C to +100C) supports unconditioned factory enclosures, while the 423 user I/Os accommodate multiple encoder inputs, GPIO, LVDS camera links, and parallel ADC/DAC interfaces simultaneously. Quartus Prime's DSP Builder and the FPGA's M9K memory blocks help designers implement real-time FFT and edge-detection pipelines with deterministic latency.

πŸ“Ί

Video Processing and Broadcast Equipment

The 10CL080YF780I7G is well suited to mid-resolution video processing (1080p60 and below) and broadcast glue logic. Its 2,810,880 embedded memory bits act as line buffers and frame stores, the 423 user I/Os include enough LVDS pairs for HDMI/DVI/SDI bridges, and the 156 multipliers accelerate color-space conversion and scaling filters. Designers typically pair the FPGA with external DDR2/DDR3 SDRAM for frame buffering, and Quartus Prime's Video and Image Processing (VIP) Suite provides ready-made IP cores that shorten development time on this Cyclone 10 LP family.

πŸš—

Automotive Driver Assistance Systems (ADAS)

The 10CL080YF780I7G supports ADAS sensor fusion and pre-processing for surround-view, lane-departure, and radar front-ends. With 81,264 LEs and 156 multipliers, it can aggregate multiple LVDS camera streams, run distortion correction, and feed a host processor over PCIe or Gigabit Ethernet. The industrial temperature grade handles under-hood and behind-grille thermal stress, while the 423 user I/Os accept several deserializer outputs. Designers benefit from Intel's functional-safety documentation support and the Cyclone 10 LP's deterministic latency for time-critical control loops.

🌐

Telecommunications Line Cards and Backhaul

The 10CL080YF780I7G serves as a flexible glue-logic and packet-processing engine on telecommunications line cards and small-cell backhaul units. Its 423 user I/Os expose multiple SGMII/SERDES-friendly banks for interfacing with external PHY chips, while 2,810,880 bits of embedded memory handle packet queuing and look-up tables. Four general-purpose PLLs synthesize the various Ethernet and CPRI reference clocks required in such designs. Compared with an ASIC, the Cyclone 10 LP allows rapid feature upgrades over the product lifetime via simple bitstream reloads.

πŸ–₯️

Low-Cost ASIC Replacement and Prototyping

The 10CL080YF780I7G is a popular target for ASIC replacement and pre-silicon prototyping, allowing design teams to validate firmware and hardware concurrently. The 81,264 LEs mimic medium-complexity ASIC gates, while 423 user I/Os break out to standard 0.1-inch headers via the FPGA development board, simplifying bring-up. Designers can later migrate proven RTL to a lower-cost Cyclone 10 LP variant (10CL040, 10CL025) for cost reduction, or to an Intel Cyclone V SoC if an integrated ARM hard processor is needed.

πŸ”§

Test and Measurement Instrumentation

The 10CL080YF780I7G is well matched to mid-range test and measurement instruments such as protocol analyzers, data-acquisition front-ends, and arbitrary waveform generators. Its 81,264 LEs implement protocol decoding state machines, the 156 multipliers accelerate FFT/DFT signal processing, and the 423 user I/Os accommodate multiple high-speed ADC/DAC interfaces. The SRAM-based configuration lets designers ship field-upgradeable firmware, and the industrial temperature grade supports lab and factory-floor deployment without derating.

Recommended Products Summary

10CL016YF484I7G Intel Used in: Industrial Motor Control and Machine Vision EPCS16SI8N Active Serial configuration flash (16 Mbit) Used in: Industrial Motor Control and Machine Vision 10CL040YF484C8G Intel Used in: Video Processing and Broadcast Equipment MT48LC16M16A2 External SDRAM for video frame buffers Used in: Video Processing and Broadcast Equipment 10CL055YF484I7G Intel Used in: Automotive Driver Assistance Systems (ADAS) EPCQ64ASI16N 64-Mbit Active Serial configuration flash Used in: Automotive Driver Assistance Systems (ADAS) 10CL025YU256C8G Intel Used in: Telecommunications Line Cards and Backhaul EPCS64SI16N 64-Mbit AS configuration memory Used in: Telecommunications Line Cards and Backhaul 10CL040YU484C8G Intel Used in: Low-Cost ASIC Replacement and Prototyping EPCQ16SI8N 16-Mbit AS configuration memory Used in: Low-Cost ASIC Replacement and Prototyping 10CL055ZF484I8G Intel Used in: Test and Measurement Instrumentation EPCS128SI16N 128-Mbit AS configuration flash for dual bitstreams Used in: Test and Measurement Instrumentation
What is the logic element count of 10CL080YF780I7G?
The 10CL080YF780I7G contains 81,264 logic elements (LEs) based on the Cyclone 10 LP architecture. According to the Intel Cyclone 10 LP device overview, the 10CL080 sits near the top of the family and pairs this LE count with 2,810,880 bits of embedded M9K memory and 156 18x18 multipliers, suiting mid-density parallel processing, video bridging, and industrial control designs where more than 50K LEs are typically required.
How many user I/O pins does 10CL080YF780I7G have?
The 10CL080YF780I7G provides 423 maximum user I/O pins in its 780-ball FBGA (F780) package. Verified distributor listings confirm the 423-I/O figure, making this the largest-pin-count package in the 10CL080 family and ideal for designs that need wide external memory buses, multiple high-speed LVDS channels, or several parallel peripheral interfaces on a single FPGA.
What is the difference between 10CL080YF780I7G and 10CL080YF780C6G?
The 10CL080YF780I7G (speed grade I7, industrial temp) offers faster Fmax timing than the 10CL080YF780C6G (speed grade C6, commercial temp). Both share the same 780-ball FBGA package, 81,264 LEs, and pinout, making them drop-in compatible when operating within the same temperature envelope, although I7 also supports the broader -40C to +100C industrial range.
What is the difference between 10CL080YF780I7G and 10CL016YF484C8G?
The 10CL080YF780I7G is a high-density variant with 81,264 LEs and 423 user I/Os in a 780-BGA, while the 10CL016YF484C8G is a low-density variant with only 15,408 LEs and fewer I/Os in a 484-BGA. They are NOT drop-in compatible because the package pin counts and ball maps differ; the 10CL016 is meant for cost-optimized small designs, not as a substitute for the 10CL080.
Where to download 10CL080YF780I7G datasheet PDF?
The official 10CL080YF780I7G product page is hosted at the Intel Altera Cyclone 10 LP portal (altera.com/products/fpga/cyclone/10/lp/10cl080-f780/10CL080YF780I7G). From that page engineers can reach the Cyclone 10 LP device datasheet, Pin Information File, and the Quartus Prime device support documentation that covers the F780 pinout.
Where to find 10CL080YF780I7G pinout?
The 10CL080YF780I7G pinout is delivered as a Pin Information File in CSV/PAD format from the Intel Cyclone 10 LP support page, and is also rendered graphically inside Quartus Prime's Pin Planner tool once the F780 device is selected. The 780-ball FBGA ball map follows the standard Intel sub-fine-pitch BGA convention with pin 1 at the A1 corner dot.
What is the operating temperature of 10CL080YF780I7G?
The 10CL080YF780I7G is rated for industrial-temperature operation from -40C to +100C junction, per the Cyclone 10 LP industrial (I) grade specification. This makes it suitable for outdoor enclosures, factory automation, and unconditioned industrial environments where commercial-grade parts (0C to +85C) would be unreliable across full annual thermal swing.
What configuration memory does 10CL080YF780I7G use?
The 10CL080YF780I7G uses SRAM-based configuration cells and therefore requires an external non-volatile boot source on every power-up. The most common schemes are Active Serial (AS) using a low-cost EPCS or EPCQ flash, Active Parallel (AP) for fast multi-bit loading, and JTAG for development and factory programming.
How much embedded memory does 10CL080YF780I7G have?
The 10CL080YF780I7G integrates 2,810,880 bits of embedded memory organized as M9K (9 Kbit) blocks, per the Cyclone 10 LP device overview. This is roughly 343 Kbytes usable as RAM, ROM, or shift-register FIFO buffers, and supports single-port, dual-port, and true dual-port modes up to 250 MHz.
What is the price of 10CL080YF780I7G?
As of 2026-09-05, the 10CL080YF780I7G lists at approximately 285 USD at qty-1, dropping to around 198 USD at qty-1000 on authorized distributors like DigiKey, Mouser, and Arrow. Octopart cross-checks consistently confirm this pricing band; check the live distributor page for current stock because industrial-grade FPGAs in FBGA packaging can swing 15-25% with lead time.
Where to buy 10CL080YF780I7G online?
Authorized online distributors currently listing the 10CL080YF780I7G include DigiKey (ships same-day), Mouser, Arrow, Heisener, and TrustedParts. The Octopart part page aggregates all three top franchised distributors with quantity-break pricing and real-time stock counts, useful for comparing lead times if one distributor is out of stock.
Is 10CL080YF780I7G in stock?
Heisener publicly reports 3,936 pieces of 10CL080YF780I7G in stock as of 2026-09-05, and the part is generally available across DigiKey and Mouser. Lead time for large orders is typically 6-10 weeks from Intel directly; for production volumes, request a quote and book ahead because FBGA inventory can deplete quickly during industrial design-in waves.
What is the lead time for 10CL080YF780I7G?
Distributor lead time for the 10CL080YF780I7G is typically same-day to 2 weeks for quantities under 100 pieces from DigiKey/Mouser stock. Bulk orders of 500+ units commonly require 6-10 weeks from Intel's authorized channel because the 780-BGA is a custom-package OPN; for predictable supply, lock orders with a single franchised distributor.
What is the best drop-in replacement for 10CL080YF780I7G?
Within Intel's Cyclone 10 LP family, the 10CL080YF780C8G and 10CL080YF780C6G are direct drop-in replacements for the 10CL080YF780I7G: identical 780-BGA pinout, identical 81,264 LEs and 2,810,880 memory bits, and only the speed grade and temperature grade differ. Cross-brand drop-in equivalents in the same FBGA-780 footprint are not available because each vendor assigns a unique ball map.
Can the 10CL080YF780I7G be replaced by a Cyclone V or Cyclone IV device?
No, the 10CL080YF780I7G cannot be replaced by a Cyclone V or Cyclone IV device in the same 780-BGA footprint because each generation uses a unique ball map and ball pitch; even when pin counts match, pin functions and bank voltages differ. Engineers targeting legacy migration should choose 10CL080 family variants (10CL080YF780C8G, 10CL080YF780C6G) for true drop-in compatibility.
What software is used to program 10CL080YF780I7G?
The 10CL080YF780I7G is programmed with Intel Quartus Prime design software (the free Quartus Prime Lite or the licensed Quartus Prime Standard/Pro editions). Quartus Prime handles synthesis, place-and-route, timing analysis, pin assignment, and bitstream generation for the Cyclone 10 LP family, and is required to generate the JTAG or Active Serial .pof/.sof images.
Is 10CL080YF780I7G RoHS compliant?
Yes, the 10CL080YF780I7G is RoHS compliant per Intel's product environmental compliance documentation for the Cyclone 10 LP family. It is also REACH-compliant and lead-free (Pb-free), satisfying the requirements of EU Directive 2011/65/EU and similar regional substance restrictions for electronic equipment placed on the market.
What are the key specifications of 10CL080YF780I7G that engineers should know?
Key specifications engineers should know about the 10CL080YF780I7G: 81,264 logic elements, 2,810,880 bits of embedded M9K memory (about 343 Kbytes), 156 18x18 hardware multipliers, 423 maximum user I/O pins, 4 general-purpose PLLs, 780-ball FBGA package, I7 industrial speed grade (-40C to +100C), and SRAM configuration requiring an external serial or parallel flash boot source.

Engineering reference data for 10CL080YF780I7G β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the 10CL080YF780I7G when you need the largest Cyclone 10 LP density (81,264 LEs) in the 780-BGA package with industrial-grade timing margin and the full -40C to +100C temperature range. For bench prototypes and commercial-temperature products where cost dominates, drop down to the 10CL080YF780C8G (same pinout, ~10% slower Fmax) or 10CL080YF780C6G (same pinout, ~20% slower Fmax). If you do not need 81K LEs, consider the 10CL055 or 10CL040 family in the same F780 footprint for meaningful cost savings; if you need fewer I/Os, the F484 package options (10CL080YF484I7G, 10CL080YF484C8G, 10CL080YF484C6G) deliver the same LE and memory count at smaller pin count. The 10CL080YF780I7G is the right answer when both industrial temperature AND the full 423-I/O F780 pinout are mandatory.

Comparison with Alternatives

Parameter This Product 10CL080YF780C8G 10CL080YF780C6G
Brand Altera Altera Altera
Package 780-FBGA (F780) 780-FBGA (F780) - same 780-FBGA (F780) - same
Logic Elements 81,264 81,264 81,264
Embedded Memory Bits 2,810,880 2,810,880 2,810,880
18x18 Multipliers 156 156 156
Maximum User I/O 423 423 423
Speed Grade I7 (industrial) C8 (commercial, ~10% slower) C6 (commercial, ~20% slower)
Operating Temperature -40C to +100C (industrial) 0C to +85C (commercial) 0C to +85C (commercial)

Key Differentiators

  • Industrial speed grade I7 with -40C to +100C operating range (vs 10CL080YF780C8G)
  • Highest-density Cyclone 10 LP OPN with 81,264 LEs in 780-BGA (vs 10CL080YF780C6G)
  • 423 user I/Os in F780 package (vs 10CL016YF484C8G)

Design Notes

The 10CL080YF780I7G in a 780-FBGA package dissipates several watts under typical utilization, so plan PCB thermal relief from the start. Use a 4-layer stack-up with a dedicated internal ground plane directly beneath the BGA and stitch the inner plane to the top-layer ground pour with at least 9 thermal vias in a 3x3 array under the package. The exposed-pad-style center balls of the F780 must be soldered to a continuous ground copper island to provide a low-impedance thermal path; missing this connection can raise junction temperature 10-15C and reduce long-term reliability.

Route all 780-FBGA signals on inner microstrip layers with matched length tuning for LVDS and DDR interfaces; the F780 ball pitch is 1.0 mm, so 4-mil trace/space with 8-mil vias in dog-bone fanout is the practical minimum at most board houses. Decouple every VCC/VCCIO/VCCA_PLL pin individually with a 0.1 uF X7R 0402 ceramic placed within 100 mil of the ball, and add four bulk 47 uF tantalum or polymer capacitors around the package perimeter. Provide a JTAG header (TCK/TMS/TDI/TDO plus 10k pull-up on TCK and pull-down on TMS) on every board revision for prototype bring-up.

Three pitfalls recur on first-time Cyclone 10 LP designs: (1) leaving the CONFIG_DONE pin unmonitored causes boot failures to go undetected - add an LED to CONFIG_DONE and to nSTATUS; (2) forgetting to power-cycle the FPGA after re-programming via JTAG can leave the previous bitstream partially active - always issue a full configuration sequence; (3) selecting the wrong speed grade in Quartus Prime (C6 vs C8 vs I7) produces a passing compilation but fails timing closure at the rated Fmax - verify the device OPN matches the device selected in the Quartus Assignment menu before tape-out.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliant per Intel Cyclone 10 LP family environmental documentation. Lead-free (Pb-free) FBGA finish; halogen-free per Intel product specifications. Not AEC-Q100 qualified - AEC-Q100 qualification is not standard for the Cyclone 10 LP industrial grade; if automotive functional safety is required, evaluate Intel's Cyclone V or Cyclone IV automotive-grade FPGAs instead.

Data verified on: 2026-09-05 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera Cyclone 10 LP 10CL080YF780I7G 10CL080YF780C8G 10CL080YF780C6G 10CL016YF484C8G FPGA field-programmable gate array programmable logic logic element M9K memory block 18x18 multiplier DSP block PLL LVDS SGMII FBGA 780-BGA BGA package SRAM configuration Active Serial JTAG Quartus Prime RoHS REACH AEC-Q100 industrial temperature grade ASIC replacement machine vision ADAS industrial motor control
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