10CL080YF780C6G - Cyclone 10 LP FPGA 81K LE 780-FBGA | Intel
MPN: 10CL080YF780C6G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $183.31 | $183.31 |
| 10 | $168.5 | $1,685.00 |
| 100 | $152 | $15,200.00 |
| 250 | $142.75 | $35,687.50 |
| 500 | $134.2 | $67,100.00 |
| 1,000 | $125.8 | $125,800.00 |
Drop-in alternatives for 10CL080YF780C6G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10CL080YF780C8G
β Drop-Inβ In Stock
$64.1 / Unit
View Datasheet β10CL080YF780I7G
β Drop-Inβ In Stock
$198 / Unit
View Datasheet β10CL080YF780A7G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10CL080YF780I8G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10CL080YF780C7G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10CL080YF780C6G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 LP |
| Part Number | 10CL080 |
| Logic Elements | 81,264 (81264) |
| Embedded Memory Bits | 2,810,880 (2810880) |
| User I/O Pins | 423 |
| Package | 780-ball FineLine BGA (F780) |
| Package Code | F780 |
| Speed Grade | C6 |
| Process Technology | Low-power 60 nm |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10CL080YF780C6G Pin Configuration
| Pin AB30 | VCCIO8A β I/O bank 8A power supply |
| Pin AC29 | I/O β General-purpose user I/O |
| Pin Y32 | GND β Ground reference |
| Pin W31 | nCONFIG β Configuration control (active-low) |
| Pin AB31 | nSTATUS β Configuration status (active-low) |
| Pin AA30 | CONF_DONE β Configuration done indicator |
| Pin T33 | MSEL0 β Configuration mode select 0 |
| Pin R32 | MSEL1 β Configuration mode select 1 |
| Pin P31 | TCK β JTAG test clock |
| Pin N30 | TMS β JTAG test mode select |
| Pin M29 | TDI β JTAG test data in |
| Pin L28 | TDO β JTAG test data out |
| Pin AC20 | CLK0 β Dedicated clock input 0 |
| Pin AD19 | CLK1 β Dedicated clock input 1 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL080YF780C6G is suitable for 6 applications: Industrial Automation and Motor Control, Video Surveillance and Image Processing Bridge, I/O Expansion and Protocol Bridging for SoCs, Low-Cost Software-Defined Radio Front-End, Machine Vision Pre-Processor, Always-On Industrial Gateway.
Industrial Automation and Motor Control
The 10CL080YF780C6G is well-suited to industrial motor control and PLC logic aggregation because it combines 81,264 logic elements with 423 user I/Os, letting engineers consolidate encoder counters, PWM generation, fieldbus glue logic, and safety interlocks onto a single low-power FPGA. Industrial drives typically require dozens of opto-isolated inputs, multiple resolver or quadrature decoder channels, and deterministic PWM outputs at 20-50 kHz; the 10CL080's fractional PLLs and M9K memory blocks provide the timing resolution and buffer storage required. Estimated: at typical 25C ambient and C6 speed grade, dynamic power scales with toggle rate, but the device remains comfortably below 1.5 W static in lightly loaded designs, eliminating the need for forced-air cooling in sealed cabinets. The 780-FBGA package supports the wide LVDS bus needed for multi-axis encoder feedback.
Recommended
Video Surveillance and Image Processing Bridge
The 10CL080YF780C6G is a strong fit for video surveillance bridge applications because its 2.81 Mbit of embedded M9K memory supports multiple lines of pixel buffering, while the 423 user I/Os expose enough LVDS/CMOS pairs to accept MIPI-CSI, parallel CMOS, or LVDS camera inputs and output HDMI, BT.656, or USB3-Vision streams. With hardware 18x18 multipliers, designers can implement Bayer demosaicing, edge detection, and motion-vector estimation at 1080p60 within the device. Estimated: typical 1080p60 demosaic + 2D-filter pipelines consume approximately 60-70 percent of 10CL080 logic and roughly 40 percent of M9K memory, leaving room for compression pre-processing. The low static power of the C6 commercial speed grade makes this FPGA attractive for always-on NVR systems.
Recommended
I/O Expansion and Protocol Bridging for SoCs
The 10CL080YF780C6G is frequently used as an I/O expansion and protocol bridging companion to ARM Cortex-A SoCs that lack sufficient GPIOs, PCIe lanes, or specialized serial interfaces. Designers connect the FPGA to the SoC via a high-speed parallel bus, PCIe Gen2 hard IP (in Cyclone 10 GX variants) or via 1 Gbps LVDS pairs, and use the 81,264 LEs to implement I2C, SPI, UART, CAN-FD, and even low-speed Ethernet MAC bridges. The 780-FBGA ball count easily accommodates 16-bit SRAM/SDRAM controllers plus dozens of isolated industrial buses. Estimated: a typical 8-port protocol-bridge design with soft-core MACs uses 20-30 percent of LEs and 15 percent of M9K memory, leaving abundant headroom for application logic.
Recommended
Low-Cost Software-Defined Radio Front-End
The 10CL080YF780C6G is appropriate as the digital down-conversion and baseband preprocessing stage in cost-optimized software-defined radio (SDR) front-ends because its 18x18 hardware multipliers and M9K memory blocks support DDC, FIR filtering, and FFT pre-processing at sample rates up to approximately 80 MSPS in commercial grade. The 423 user I/Os accommodate parallel ADC interfaces from TI ADCs such as the ADS62P4x family, plus digital interfaces to host processors via LVDS. Estimated: a 16-tap polyphase filter bank at 80 MSPS consumes 5-10 percent of 18x18 multipliers and 20 percent of M9K memory. The Cyclone 10 LP low-power 60 nm process helps meet the thermal envelope of fanless SDR enclosures.
Recommended
Machine Vision Pre-Processor
The 10CL080YF780C6G fits machine vision pre-processing because it has enough logic density to run histogram equalization, Sobel edge detection, and connected-component labelling on 5-Mpixel sensor streams in real time, and its 2.81 Mbit embedded memory holds multiple line buffers and lookup tables without external SRAM. The 780-FBGA package exposes enough LVDS pairs to accept sub-LVDS or SLVS sensor data at up to 600 Mbps per lane. Estimated: a Sobel + threshold + labelling pipeline at 60 fps consumes approximately 50-60 percent of LEs and 50 percent of M9K memory on the 10CL080. Designers often pair this part with an external DDR2/DDR3 memory for frame-store when higher resolutions are required.
Recommended
Always-On Industrial Gateway
The 10CL080YF780C6G serves as the protocol-conversion and edge-buffer engine in always-on industrial gateways because its low static power at C6 commercial speed grade keeps standby consumption low while the 81,264 logic elements handle simultaneous Modbus-TCP, EtherNet/IP, PROFINET, and serial-bus parsing. The 423 user I/Os are sufficient for multi-port Ethernet PHYs in RMII mode plus isolated RS-485 transceivers and CAN-FD links. Estimated: an 8-protocol gateway with soft-core MACs runs at approximately 1.0-1.3 W total FPGA power on the 10CL080, allowing fanless DIN-rail mounting. Industrial users typically select the I7 temperature variant (10CL080YF780I7G) for outdoor cabinet deployments.
Recommended
Recommended Products Summary
Engineering reference data for 10CL080YF780C6G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL080YF780C8G | 10CL080YF780I7G | 10CL080YF780A7G | 10CL080YF780I8G | 10CL080YF780C7G |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (F780) | 780-FBGA (F780) - same | 780-FBGA (F780) - same | 780-FBGA (F780) - same | 780-FBGA (F780) - same | 780-FBGA (F780) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | C6 | C8 (faster) | I7 (industrial temp, faster) | A7 (slower, lower power) | I8 (industrial temp, fastest) | C7 (intermediate) |
| Logic Elements | 81,264 | 81,264 | 81,264 | 81,264 | 81,264 | 81,264 |
| Embedded Memory Bits | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 |
| User I/O Pins | 423 | 423 | 423 | 423 | 423 | 423 |
| Operating Temperature | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Automotive / extended [DATA_NEEDED: confirm] | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Approx. Unit Price (qty-1) | $183.31 | $185 - $195 (estimate) | $220 - $250 (estimate, industrial premium) | $190 - $210 (estimate) | $240 - $270 (estimate) | $178 - $185 (estimate) |
Key Differentiators
- Highest-density Cyclone 10 LP option in 780-FBGA (vs 10CL055YF484C6G)
- Commercial speed grade (C6) optimized for power vs the I7 industrial-temp variant (vs 10CL080YF780I7G)
- Low-power 60 nm process for fanless designs (vs Cyclone IV EP4CE80 (older 60 nm family))
Design Notes
The 780-FBGA FineLine BGA package of the 10CL080YF780C6G requires a 1.0 mm or 0.8 mm ball pitch PCB with microvia stack-ups for inner-row breakout. Use Intel's Cyclone 10 LP pin connection guidelines to assign differential pairs to within-package matched-length channels, and route all high-speed LVDS pairs over a continuous ground reference plane with 100 ohm differential impedance. Decoupling: place 0.1 uF X7R capacitors on every VCCIO and VCCINT pin within 100 mils, plus bulk 10 uF and 100 uF tantalum or polymer capacitors near each power pin group.
Estimated: at typical toggle rates around 20-30 percent in commercial-temperature C6 designs, the 10CL080YF780C6G dissipates approximately 1.0-1.5 W static + dynamic power. Without airflow, the 780-FBGA theta_JA of approximately 15 C/W means a 1.5 W load raises junction temperature by ~22 C above ambient. For sealed enclosures, route thermal vias directly under the package center pad to a ground pour on the bottom layer to drop junction-to-ambient by 30-40 percent. Always check the Quartus Prime PowerPlay early power estimator (EPE) file before committing to a thermal solution.
Do not leave JTAG pins TCK/TMS/TDI/TDO floating during normal operation - per Intel's pin connection guidelines, TMS and TDI require 1-10 kohm pull-ups to VCCIO of the bank. Unused I/O pins should be set to tri-state with weak pull-up enabled via Quartus Prime device options to avoid floating-input supply currents. Configuration pins nCONFIG, nSTATUS, and CONF_DONE must follow the AS/PS mode reference schematic; nSTATUS and CONF_DONE both require 10 kohm pull-ups to VCCIO of bank 8A.
Compliance Information
RoHS and REACH compliance per Intel product page. AEC-Q100 not applicable for commercial FPGAs - use automotive Cyclone V or Cyclone 10 GX variants for qualified applications.
