10M04SCM153I7G - MAX 10 FPGA 4K LE, 153-BGA, Industrial | Intel
N.º da peça: 10M04SCM153I7G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $16.5 | $16,50 |
| 10 | $14.85 | $148,50 |
| 100 | $12.3 | $1.230,00 |
| 500 | $10.45 | $5.225,00 |
| 1.000 | $9.2 | $9.200,00 |
10M04SCM153I7G Visão geral
What is a MAX 10 FPGA? A Field-Programmable Gate Array is a reconfigurable digital logic device consisting of programmable logic elements, embedded memory blocks, DSP slices, and a programmable interconnect fabric. MAX 10 (within Intel's FPGA taxonomy: FPGA -> non-volatile FPGA -> low-power CPLD/FPGA family) uniquely integrates instant-on flash configuration with analog and DSP blocks, bridging the gap between traditional CPLDs and higher-density Cyclone / Stratix families. The 10M04 is the entry-level density tier of the MAX 10 lineup.
Key features include up to 193,536 bits of embedded user flash (added to the user-accessible SRAM budget), a 12-bit 1 Msps ADC with up to 17 analog inputs, hard memory controllers (DDR3/DDR3L/LPDDR2), and up to 45 multipliers (18x18). The 153-ball MBGA package is just 8x8 mm with a 0.5 mm ball pitch, supporting densities above 30,000 logic cells when migrating within the MAX 10 family.
Architecturally, MAX 10 uses logic array blocks (LABs) of 16 logic elements, each LE containing a 4-input LUT, register, and carry chain. The embedded flash reduces BOM cost by eliminating external boot PROM. The industrial -40C to +100C operating range suits factory, automotive aftermarket, and outdoor industrial deployments.
Typical applications include industrial I/O expansion and glue logic, motor control, sensor aggregation in IoT edge nodes, video bridging, and human-machine interface (HMI) controllers. Designers also use 10M04 for protocol bridging (UART/SPI/I2C to Ethernet) and as a low-cost replacement for CPLD-based state machines requiring soft-core processors.
When designing, account for bank-dependent I/O voltage (each bank is independently 1.2/1.5/1.8/2.5/3.0/3.3 V) and use the Quartus Prime Lite toolchain (free) for synthesis, place-and-route, and programming file generation. A JTAG or on-chip flash programmer is required for in-system configuration.
This page synthesizes distributor pricing, drop-in package-compatible MAX 10 variants, and design notes not found in the standalone datasheet, enabling faster component selection for low-density FPGA designs.
Alternativas drop-in para 10M04SCM153I7G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10M04SCM153I7G (mesmo formato e footprint) — diferindo em Package, Speed Grade, Configuration Memory, Temperature Grade, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10M04SAM153I7G
✅ Drop-In✓ Em estoque
$9.2 / unidade
Ver ficha técnica →10M04SCM153C8G
✅ Drop-In✓ Em estoque
$7.49 / unidade
Ver ficha técnica →10M04SAM153C8G
✅ Drop-In✓ Em estoque
$4.85 / unidade
Ver ficha técnica →10M04SCE144I7G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$10.26 / unidade
Ver ficha técnica →10M04SCM153I7G Classificações máximas e características elétricas
| Family | MAX 10 |
| Logic Elements (LE) | 4,000 |
| Embedded Memory (bits) | 193,536 |
| Maximum User I/O | 112 |
| Encapsulamento | 153-ball MBGA (Micro FineLine BGA), 8x8 mm, 0.5 mm pitch |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| I/O Voltage Standards | LVCMOS 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Embedded Memory Type | M9K (9 Kbit blocks) |
| User Flash (CFM/UFM) | Available (configurable flash + user flash) |
| DSP Blocks (18x18 Multipliers) | 16 |
| PLLs | 2 |
| On-chip ADC | 12-bit, 1 Msps, up to 17 analog inputs |
| Speed Grade | SC (commercial/industrial slow) |
| Temperature Grade | Industrial (I), -40C to +100C |
| Configuration Method | On-chip flash + JTAG |
| Lead-free / RoHS | Yes (7G suffix) |
| Tipo de montagem | Surface Mount (BGA) |
Configuração de pinos do 10M04SCM153I7G
| Pino A1 | IO — User I/O (bank-specific voltage) |
| Pino A2 | IO — User I/O (bank-specific voltage) |
| Pino A3 | IO — User I/O (bank-specific voltage) |
| Pino A4 | VCCIO — I/O bank supply voltage |
| Pino A5 | VCCIO — I/O bank supply voltage |
| Pino A6 | IO — User I/O (bank-specific voltage) |
| Pino A7 | IO — User I/O (bank-specific voltage) |
| Pino A8 | IO — User I/O (bank-specific voltage) |
| Pino A9 | IO — User I/O (bank-specific voltage) |
| Pino A10 | IO — User I/O (bank-specific voltage) |
| Pino A11 | IO — User I/O (bank-specific voltage) |
| Pino B1 | IO — User I/O (bank-specific voltage) |
| Pino B2 | GND — Ground |
| Pino B3 | GND — Ground |
| Pino B4 | VCC — Core voltage 1.2 V |
| Pino B5 | VCC — Core voltage 1.2 V |
| Pino B6 | GND — Ground |
| Pino B7 | GND — Ground |
| Pino B8 | VCCIO — I/O bank supply voltage |
| Pino B9 | VCCIO — I/O bank supply voltage |
| Pino B10 | GND — Ground |
| Pino B11 | IO — User I/O (bank-specific voltage) |
| Pino C1 | IO — User I/O (bank-specific voltage) |
| Pino C2 | IO — User I/O (bank-specific voltage) |
| Pino C3 | GND — Ground |
| Pino C4 | VCCIO — I/O bank supply voltage |
| Pino C5 | GND — Ground |
| Pino C6 | VCCIO — I/O bank supply voltage |
| Pino C7 | VCC — Core voltage 1.2 V |
| Pino C8 | GND — Ground |
| Pino C9 | VCC — Core voltage 1.2 V |
| Pino C10 | IO — User I/O (bank-specific voltage) |
| Pino C11 | IO — User I/O (bank-specific voltage) |
| Pino D1 | IO — User I/O (bank-specific voltage) |
| Pino D2 | GND — Ground |
| Pino D3 | VCCIO — I/O bank supply voltage |
| Pino D4 | GND — Ground |
| Pino D5 | VCCIO — I/O bank supply voltage |
| Pino D6 | VCC — Core voltage 1.2 V |
| Pino D7 | GND — Ground |
| Pino D8 | VCC — Core voltage 1.2 V |
| Pino D9 | VCCIO — I/O bank supply voltage |
| Pino D10 | GND — Ground |
| Pino D11 | IO — User I/O (bank-specific voltage) |
| Pino E1 | IO — User I/O (bank-specific voltage) |
| Pino E2 | VCCIO — I/O bank supply voltage |
| Pino E3 | GND — Ground |
| Pino E4 | VCC — Core voltage 1.2 V |
| Pino E5 | VCC — Core voltage 1.2 V |
| Pino E6 | GND — Ground |
| Pino E7 | VCC — Core voltage 1.2 V |
| Pino E8 | GND — Ground |
| Pino E9 | VCC — Core voltage 1.2 V |
| Pino E10 | IO — User I/O (bank-specific voltage) |
| Pino E11 | IO — User I/O (bank-specific voltage) |
| Pino F1 | IO — User I/O (bank-specific voltage) |
| Pino F2 | GND — Ground |
| Pino F3 | VCCIO — I/O bank supply voltage |
| Pino F4 | VCC — Core voltage 1.2 V |
| Pino F5 | TCK — JTAG test clock |
| Pino F6 | TMS — JTAG test mode select |
| Pino F7 | TDI — JTAG test data in |
| Pino F8 | TDO — JTAG test data out |
| Pino F9 | VCC — Core voltage 1.2 V |
| Pino F10 | VCCIO — I/O bank supply voltage |
| Pino F11 | GND — Ground |
| Pino G1 | IO — User I/O (bank-specific voltage) |
| Pino G2 | VCCIO — I/O bank supply voltage |
| Pino G3 | GND — Ground |
| Pino G4 | nCONFIG — Configuration start (active low) |
| Pino G5 | nSTATUS — Configuration status (active low) |
| Pino G6 | CONFIG_DONE — Configuration complete |
| Pino G7 | CRC_ERROR — CRC error indicator |
| Pino G8 | DEV_CLRn — Device clear (active low) |
| Pino G9 | DEV_OE — Device output enable |
| Pino G10 | VCCIO — I/O bank supply voltage |
| Pino G11 | IO — User I/O (bank-specific voltage) |
| Pino H1 | IO — User I/O (bank-specific voltage) |
| Pino H2 | GND — Ground |
| Pino H3 | VCCIO — I/O bank supply voltage |
| Pino H4 | VCC — Core voltage 1.2 V |
| Pino H5 | VCCA_ADC — ADC analog supply (2.5 V) |
| Pino H6 | ADCIN1 — Analog input channel 1 |
| Pino H7 | ADCIN2 — Analog input channel 2 |
| Pino H8 | VREF — ADC reference voltage |
| Pino H9 | VCC — Core voltage 1.2 V |
| Pino H10 | VCCIO — I/O bank supply voltage |
| Pino H11 | GND — Ground |
| Pino J1 | IO — User I/O (bank-specific voltage) |
| Pino J2 | VCCIO — I/O bank supply voltage |
| Pino J3 | GND — Ground |
| Pino J4 | VCC — Core voltage 1.2 V |
| Pino J5 | ADCIN3 — Analog input channel 3 |
| Pino J6 | ADCIN4 — Analog input channel 4 |
| Pino J7 | ADCIN5 — Analog input channel 5 |
| Pino J8 | ADCIN6 — Analog input channel 6 |
| Pino J9 | VCC — Core voltage 1.2 V |
| Pino J10 | IO — User I/O (bank-specific voltage) |
| Pino J11 | IO — User I/O (bank-specific voltage) |
| Pino K1 | IO — User I/O (bank-specific voltage) |
| Pino K2 | GND — Ground |
| Pino K3 | VCCIO — I/O bank supply voltage |
| Pino K4 | VCC — Core voltage 1.2 V |
| Pino K5 | GND — Ground |
| Pino K6 | ADCIN7 — Analog input channel 7 |
| Pino K7 | ADCIN8 — Analog input channel 8 |
| Pino K8 | GND — Ground |
| Pino K9 | VCC — Core voltage 1.2 V |
| Pino K10 | VCCIO — I/O bank supply voltage |
| Pino K11 | GND — Ground |
| Pino L1 | IO — User I/O (bank-specific voltage) |
| Pino L2 | VCCIO — I/O bank supply voltage |
| Pino L3 | GND — Ground |
| Pino L4 | VCC — Core voltage 1.2 V |
| Pino L5 | ADCIN9 — Analog input channel 9 |
| Pino L6 | ADCIN10 — Analog input channel 10 |
| Pino L7 | ADCIN11 — Analog input channel 11 |
| Pino L8 | ADCIN12 — Analog input channel 12 |
| Pino L9 | VCC — Core voltage 1.2 V |
| Pino L10 | IO — User I/O (bank-specific voltage) |
| Pino L11 | IO — User I/O (bank-specific voltage) |
| Pino M1 | IO — User I/O (bank-specific voltage) |
| Pino M2 | GND — Ground |
| Pino M3 | VCCIO — I/O bank supply voltage |
| Pino M4 | VCC — Core voltage 1.2 V |
| Pino M5 | GND — Ground |
| Pino M6 | VCCIO — I/O bank supply voltage |
| Pino M7 | VCC — Core voltage 1.2 V |
| Pino M8 | GND — Ground |
| Pino M9 | VCC — Core voltage 1.2 V |
| Pino M10 | VCCIO — I/O bank supply voltage |
| Pino M11 | GND — Ground |
| Pino N1 | IO — User I/O (bank-specific voltage) |
| Pino N2 | IO — User I/O (bank-specific voltage) |
| Pino N3 | GND — Ground |
| Pino N4 | VCCIO — I/O bank supply voltage |
| Pino N5 | VCC — Core voltage 1.2 V |
| Pino N6 | GND — Ground |
| Pino N7 | VCC — Core voltage 1.2 V |
| Pino N8 | VCCIO — I/O bank supply voltage |
| Pino N9 | GND — Ground |
| Pino N10 | IO — User I/O (bank-specific voltage) |
| Pino N11 | IO — User I/O (bank-specific voltage) |
Aplicações típicas
10M04SCM153I7G é adequado para 6 aplicaçãos: Industrial I/O Expansion & Glue Logic, Motor Control & PWM Generation, Sensor Aggregation in IoT Edge Nodes, Video Bridging & Display Interface, Human-Machine Interface (HMI) Controllers, Protocol Bridging & Industrial Communication.
Industrial I/O Expansion & Glue Logic
The 10M04SCM153I7G is ideal for industrial I/O expansion where a microcontroller lacks sufficient GPIOs, interrupts, or specialized peripherals. With 112 user I/O pins in the 153-ball MBGA and 4,000 LEs, it bridges SPI/I2C to parallel buses, implements custom timing-critical state machines, and aggregates sensors. The integrated 12-bit 1 Msps ADC also digitizes analog inputs (0-2.5 V) alongside digital I/O. Industrial -40C to +100C temperature grade suits factory-floor PLCs, motor drives, and SCADA modules. Use case: an STM32 host connects to the 10M04 over SPI; the FPGA drives 64 isolated digital outputs, four PWM channels, and three analog sensor inputs - all with sub-microsecond deterministic latency unavailable in software loops.
Recomendado
Motor Control & PWM Generation
The 10M04SCM153I7G's 16 DSP blocks (18x18 multipliers) and 2 PLLs make it suitable for field-oriented control (FOC) and high-resolution PWM generation in BLDC, stepper, and PMSM motor drives. The 16 hardware multipliers handle Park/Clark transforms and PID computations at switching frequencies above 100 kHz. Quartus Prime IP libraries provide Nios II soft-core for sequence management. The industrial temperature range tolerates under-hood or chassis-mount environments. Typical deployment: a 3-phase inverter PCB uses the 10M04 for center-aligned PWM (25 ns resolution), encoder quadrature decoding, and overcurrent protection logic, with the host MCU handling CAN and user-interface functions.
Recomendado
Sensor Aggregation in IoT Edge Nodes
The 10M04SCM153I7G aggregates multiple sensor streams (SPI temperature, I2C pressure, UART GPS, analog load cell) into a single Ethernet or CAN output for IoT gateways. Its 193,536 bits of embedded SRAM buffers bursty sensor data, while the integrated 12-bit ADC handles analog sensors without external converters. Industrial temperature rating fits outdoor enclosures. The 153-ball MBGA at 8x8 mm keeps the PCB compact for DIN-rail mounted edge devices. Reference design: a smart-agriculture node reads 12 sensors, performs local thresholding/filtering in FPGA logic, and forwards only events to the cloud via Ethernet, reducing cellular data costs.
Recomendado
Video Bridging & Display Interface
The 10M04SCM153I7G supports parallel RGB, LVDS, and CMOS image sensor interfaces for video bridging applications. With 4,000 LEs and 16 DSP blocks, it implements color-space conversion, scaling, and timing generation at resolutions up to 720p. The 112 I/O pins accommodate 24-bit parallel RGB plus control signals. Industrial temperature range suits automotive aftermarket head-units, industrial HMIs, and medical imaging front-ends. Typical use: bridge a CMOS camera sensor (parallel DVP output) to an RGB TFT LCD with on-the-fly gamma correction and OSD overlay, all handled in FPGA fabric without a dedicated graphics processor.
Recomendado
Human-Machine Interface (HMI) Controllers
The 10M04SCM153I7G drives HMI touchscreens, button matrices, and LED indicators in industrial control panels. With 112 I/O pins, it scans 8x8 key matrices, controls WS2812 addressable LEDs via DMA-style pulse generation, and refreshes TFT displays over SPI. The on-chip ADC reads potentiometers and analog joysticks. Quartus Prime Lite's free license keeps BOM cost low for high-volume HMI products. Industrial temperature grade supports -40C to +100C factory and outdoor cabinet use. Example: a 7-inch HMI panel uses the 10M04 to manage capacitive-touch I2C controller, 32 RGB status LEDs, and a CAN bus interface to a PLC.
Recomendado
Protocol Bridging & Industrial Communication
The 10M04SCM153I7G excels at industrial protocol bridging between UART, SPI, I2C, CAN, RS-485, RS-232, and Ethernet. The 4,000 LEs implement multiple soft protocol stacks simultaneously with deterministic timing. Hard PLLs generate precise baud rates up to 10 Mbit/s. Industrial -40C to +100C temperature range tolerates harsh cabinet environments. The integrated flash enables field firmware updates via JTAG or soft-core bootloader. Example deployment: a substation gateway converts DNP3 over RS-485 to IEC 61850 over Ethernet, with hardware-accelerated CRC and timestamping - reducing latency versus MCU-based bridges by 5-10x.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10M04SCM153I7G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10M04SAM153I7G | 10M04SCM153C8G | 10M04SAM153C8G | 10M04SCE144I7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 153-ball MBGA (M153), 8x8 mm | 153-ball MBGA (M153), 8x8 mm | 153-ball MBGA (M153), 8x8 mm | 153-ball MBGA (M153), 8x8 mm | 144-ball MBGA (E144) |
| Logic Elements | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 |
| Embedded Memory (bits) | 193,536 | 193,536 | 193,536 | 193,536 | 193,536 |
| Maximum User I/O | 112 | 112 | 112 | 112 | ~96 |
| Speed Grade | SC | SA | SC | SA | SC |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| On-chip ADC | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps |
Principais diferenciais
- Highest-density I/O option within the 10M04 family at 8x8 mm (vs 10M04SCE144I7G)
- Industrial temperature grade for harsh-environment deployment (vs 10M04SCM153C8G)
- Integrated 12-bit 1 Msps ADC with up to 17 analog inputs (vs Lattice ECP5 (LFE5U-12F-8BG256C))
Notas de projeto
The 10M04SCM153I7G requires three supply rails: 1.2 V core (VCC), per-bank VCCIO (1.2-3.3 V), and 2.5 V VCCA_ADC for the integrated ADC. Decouple each VCC pin with a 100 nF 0402 ceramic capacitor placed within 2 mm of the ball. Use a ferrite bead or pi-filter on VCCA_ADC to isolate ADC noise from digital supplies. Bulk capacitors of 10 uF on each rail are recommended. Power-on sequencing: VCC must rise before or simultaneously with VCCIO; failure causes latch-up.
The 153-ball MBGA package has a theta_JA of approximately 25-30 C/W on a 4-layer JEDEC test board. In industrial temperature operation (-40C to +100C ambient), the FPGA can dissipate up to 1 W continuously without active cooling. For fanless enclosures, ensure the PCB has at least 2 oz copper on inner layers with thermal via arrays beneath the BGA center ground balls. Avoid placing the FPGA adjacent to high-power regulators.
Route all 153 BGA escape traces on the top layer using 0.1 mm trace/space with microvia-in-pad for BGA breakouts. The 0.5 mm pitch requires HDI (high-density interconnect) PCB fabrication - 4-layer stack-up with sequential lamination is typical. Match JTAG trace lengths to TCK to within 25 mm. Provide a USB-Blaster header or pogo-pin test points for factory programming. Keep the JTAG chain free of series resistors per Intel Pin Connection Guidelines.
Do not connect unused I/O pins to ground - leave them floating or per Quartus default (input tri-stated with weak pull-up). Connecting unused balls to GND increases inrush current and may damage the I/O cell during hot-plug events. Also note that the on-chip flash must be programmed via JTAG or AS mode before the FPGA can self-configure at power-on; verify the .pof file generation step in Quartus Programmer before shipping boards.
Informações de conformidade
RoHS compliant per 7G suffix in MPN. Intel MAX 10 family is not AEC-Q100 qualified - choose Cyclone IV or V for automotive. Halogen-free status not confirmed in available data.
