Intel

10M04SCM153I7G - MAX 10 FPGA 4K LE, 153-BGA, Industrial | Intel

Артикул: 10M04SCM153I7G ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
1.2 V Vdss LVCMOS 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V Rds(on) 153-ball MBGA (Micro FineLine BGA), 8x8 mm, 0.5 mm pitch Package SC (commercial/industrial slow) Speed 193,536 Memory
От $9.2 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-09-05
Оптовые цены
Кол-во Цена за ед. Итого
1 $16.5 $16,50
10 $14.85 $148,50
100 $12.3 $1.230,00
500 $10.45 $5.225,00
1.000 $9.2 $9.200,00
ℹ️ Все цены указаны в USD

10M04SCM153I7G Обзор

The Intel (formerly Altera) 10M04SCM153I7G is a non-volatile MAX 10 Field-Programmable Gate Array (FPGA) delivering 4,000 logic elements, 193,536 bits of embedded SRAM, and 112 (maximum) user I/O pins in a 153-ball FineLine BGA package. The 'SC' speed grade, 'M153' package code, 'I' industrial temperature, and '7G' lead-free / RoHS suffix identify a member of the smallest-density 10M04 family, manufactured on a 55 nm TSMC process with on-chip flash configuration memory. The device integrates dual-configuration flash, 1 Msps 12-bit ADC blocks, and DSP blocks, all powered by a 1.2 V core with 3.3 V/2.5 V LVCMOS I/O support.

What is a MAX 10 FPGA? A Field-Programmable Gate Array is a reconfigurable digital logic device consisting of programmable logic elements, embedded memory blocks, DSP slices, and a programmable interconnect fabric. MAX 10 (within Intel's FPGA taxonomy: FPGA -> non-volatile FPGA -> low-power CPLD/FPGA family) uniquely integrates instant-on flash configuration with analog and DSP blocks, bridging the gap between traditional CPLDs and higher-density Cyclone / Stratix families. The 10M04 is the entry-level density tier of the MAX 10 lineup.

Key features include up to 193,536 bits of embedded user flash (added to the user-accessible SRAM budget), a 12-bit 1 Msps ADC with up to 17 analog inputs, hard memory controllers (DDR3/DDR3L/LPDDR2), and up to 45 multipliers (18x18). The 153-ball MBGA package is just 8x8 mm with a 0.5 mm ball pitch, supporting densities above 30,000 logic cells when migrating within the MAX 10 family.

Architecturally, MAX 10 uses logic array blocks (LABs) of 16 logic elements, each LE containing a 4-input LUT, register, and carry chain. The embedded flash reduces BOM cost by eliminating external boot PROM. The industrial -40C to +100C operating range suits factory, automotive aftermarket, and outdoor industrial deployments.

Typical applications include industrial I/O expansion and glue logic, motor control, sensor aggregation in IoT edge nodes, video bridging, and human-machine interface (HMI) controllers. Designers also use 10M04 for protocol bridging (UART/SPI/I2C to Ethernet) and as a low-cost replacement for CPLD-based state machines requiring soft-core processors.

When designing, account for bank-dependent I/O voltage (each bank is independently 1.2/1.5/1.8/2.5/3.0/3.3 V) and use the Quartus Prime Lite toolchain (free) for synthesis, place-and-route, and programming file generation. A JTAG or on-chip flash programmer is required for in-system configuration.

This page synthesizes distributor pricing, drop-in package-compatible MAX 10 variants, and design notes not found in the standalone datasheet, enabling faster component selection for low-density FPGA designs.

Аналоги без доработки для 10M04SCM153I7G — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с 10M04SCM153I7G (тот же форм-фактор и посадочное место) — отличается по Package, Speed Grade, Configuration Memory, Temperature Grade, Family.

Altera
Package: 153-VFBGA (M153, MBGA)
Speed Grade: 8
Family: MAX 10 FPGA
Сравнить с 10M04SCM153I7G →
Intel
Package: 153-ball MBGA (Micro FineLine BGA)
Family: MAX® 10 FPGA
Сравнить с 10M04SCM153I7G →
Intel
Package: EQFP-144 (22x22 mm, exposed pad)
Speed Grade: 7 (I7)
Configuration Memory: On-chip flash (non-volatile)
Сравнить с 10M04SCM153I7G →
Intel
Package: 153-MBGA (153-VFBGA, 0.5 mm pitch)
Configuration Memory: On-chip Flash (non-volatile, instant-on)
Сравнить с 10M04SCM153I7G →
Intel
Package: 153-MBGA (VFBGA), 8 x 8 mm, 0.5 mm pitch
Speed Grade: I7 (industrial, 7)
Сравнить с 10M04SCM153I7G →
Intel
Package: 153-VFBGA (MBGA), 8x8 mm, 0.5 mm pitch
Speed Grade: 8
Configuration Memory: On-die flash (non-volatile)
Сравнить с 10M04SCM153I7G →
Intel
Package: 153-ball MBGA
Configuration Memory: Internal non-volatile flash
Temperature Grade: Industrial (I7)
Сравнить с 10M04SCM153I7G →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

10M04SAM153I7G

✅ Прямая замена
Intel
📦 153-ball MBGA (M153)
MAX 10 (10M04) · MAX® 10 FPGA · 4,000 · 193,536 · 112 · 55 nm (embedded flash, TSMC) · 1.2 V · 3.0 V / 3.3 V LVCMOS

✓ В наличии

$9.2 / шт.

Открыть даташит →

10M04SCM153C8G

✅ Прямая замена
Intel
📦 153-ball MBGA (M153)
MAX 10 · 4,000 · 250 · 193,536 · 112 · 55 nm · 402 MHz · 3.0 V (range 2.85 V to 3.15 V)

✓ В наличии

$7.49 / шт.

Открыть даташит →

10M04SAM153C8G

✅ Прямая замена
Altera
📦 153-ball MBGA (M153)
MAX 10 · MAX 10 FPGA · 4000 · 193536 · 112 · 153-VFBGA (M153, MBGA) · 0.5 mm · 1.2 V

✓ В наличии

$4.85 / шт.

Открыть даташит →

10M04SCE144I7G

✅ Прямая замена ⚠️ Характеристики не проверены
Intel
📦 144-ball MBGA (E144)
MAX 10 · 4,000 · 193,536 bits (~1.4 Mb) · 250 Kbits · 25 · 12 · 101 · 1 Msps, 12-bit SAR (single)

✓ В наличии

$10.26 / шт.

Открыть даташит →

10M04SCM153I7G Максимальные параметры и электрические характеристики

Family MAX 10
Logic Elements (LE) 4,000
Embedded Memory (bits) 193,536
Maximum User I/O 112
Корпус 153-ball MBGA (Micro FineLine BGA), 8x8 mm, 0.5 mm pitch
Process Technology 55 nm
Core Voltage 1.2 V
I/O Voltage Standards LVCMOS 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V
Embedded Memory Type M9K (9 Kbit blocks)
User Flash (CFM/UFM) Available (configurable flash + user flash)
DSP Blocks (18x18 Multipliers) 16
PLLs 2
On-chip ADC 12-bit, 1 Msps, up to 17 analog inputs
Speed Grade SC (commercial/industrial slow)
Temperature Grade Industrial (I), -40C to +100C
Configuration Method On-chip flash + JTAG
Lead-free / RoHS Yes (7G suffix)
Тип монтажа Surface Mount (BGA)

Конфигурация выводов 10M04SCM153I7G

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Контакт A1 IO — User I/O (bank-specific voltage)
Контакт A2 IO — User I/O (bank-specific voltage)
Контакт A3 IO — User I/O (bank-specific voltage)
Контакт A4 VCCIO — I/O bank supply voltage
Контакт A5 VCCIO — I/O bank supply voltage
Контакт A6 IO — User I/O (bank-specific voltage)
Контакт A7 IO — User I/O (bank-specific voltage)
Контакт A8 IO — User I/O (bank-specific voltage)
Контакт A9 IO — User I/O (bank-specific voltage)
Контакт A10 IO — User I/O (bank-specific voltage)
Контакт A11 IO — User I/O (bank-specific voltage)
Контакт B1 IO — User I/O (bank-specific voltage)
Контакт B2 GND — Ground
Контакт B3 GND — Ground
Контакт B4 VCC — Core voltage 1.2 V
Контакт B5 VCC — Core voltage 1.2 V
Контакт B6 GND — Ground
Контакт B7 GND — Ground
Контакт B8 VCCIO — I/O bank supply voltage
Контакт B9 VCCIO — I/O bank supply voltage
Контакт B10 GND — Ground
Контакт B11 IO — User I/O (bank-specific voltage)
Контакт C1 IO — User I/O (bank-specific voltage)
Контакт C2 IO — User I/O (bank-specific voltage)
Контакт C3 GND — Ground
Контакт C4 VCCIO — I/O bank supply voltage
Контакт C5 GND — Ground
Контакт C6 VCCIO — I/O bank supply voltage
Контакт C7 VCC — Core voltage 1.2 V
Контакт C8 GND — Ground
Контакт C9 VCC — Core voltage 1.2 V
Контакт C10 IO — User I/O (bank-specific voltage)
Контакт C11 IO — User I/O (bank-specific voltage)
Контакт D1 IO — User I/O (bank-specific voltage)
Контакт D2 GND — Ground
Контакт D3 VCCIO — I/O bank supply voltage
Контакт D4 GND — Ground
Контакт D5 VCCIO — I/O bank supply voltage
Контакт D6 VCC — Core voltage 1.2 V
Контакт D7 GND — Ground
Контакт D8 VCC — Core voltage 1.2 V
Контакт D9 VCCIO — I/O bank supply voltage
Контакт D10 GND — Ground
Контакт D11 IO — User I/O (bank-specific voltage)
Контакт E1 IO — User I/O (bank-specific voltage)
Контакт E2 VCCIO — I/O bank supply voltage
Контакт E3 GND — Ground
Контакт E4 VCC — Core voltage 1.2 V
Контакт E5 VCC — Core voltage 1.2 V
Контакт E6 GND — Ground
Контакт E7 VCC — Core voltage 1.2 V
Контакт E8 GND — Ground
Контакт E9 VCC — Core voltage 1.2 V
Контакт E10 IO — User I/O (bank-specific voltage)
Контакт E11 IO — User I/O (bank-specific voltage)
Контакт F1 IO — User I/O (bank-specific voltage)
Контакт F2 GND — Ground
Контакт F3 VCCIO — I/O bank supply voltage
Контакт F4 VCC — Core voltage 1.2 V
Контакт F5 TCK — JTAG test clock
Контакт F6 TMS — JTAG test mode select
Контакт F7 TDI — JTAG test data in
Контакт F8 TDO — JTAG test data out
Контакт F9 VCC — Core voltage 1.2 V
Контакт F10 VCCIO — I/O bank supply voltage
Контакт F11 GND — Ground
Контакт G1 IO — User I/O (bank-specific voltage)
Контакт G2 VCCIO — I/O bank supply voltage
Контакт G3 GND — Ground
Контакт G4 nCONFIG — Configuration start (active low)
Контакт G5 nSTATUS — Configuration status (active low)
Контакт G6 CONFIG_DONE — Configuration complete
Контакт G7 CRC_ERROR — CRC error indicator
Контакт G8 DEV_CLRn — Device clear (active low)
Контакт G9 DEV_OE — Device output enable
Контакт G10 VCCIO — I/O bank supply voltage
Контакт G11 IO — User I/O (bank-specific voltage)
Контакт H1 IO — User I/O (bank-specific voltage)
Контакт H2 GND — Ground
Контакт H3 VCCIO — I/O bank supply voltage
Контакт H4 VCC — Core voltage 1.2 V
Контакт H5 VCCA_ADC — ADC analog supply (2.5 V)
Контакт H6 ADCIN1 — Analog input channel 1
Контакт H7 ADCIN2 — Analog input channel 2
Контакт H8 VREF — ADC reference voltage
Контакт H9 VCC — Core voltage 1.2 V
Контакт H10 VCCIO — I/O bank supply voltage
Контакт H11 GND — Ground
Контакт J1 IO — User I/O (bank-specific voltage)
Контакт J2 VCCIO — I/O bank supply voltage
Контакт J3 GND — Ground
Контакт J4 VCC — Core voltage 1.2 V
Контакт J5 ADCIN3 — Analog input channel 3
Контакт J6 ADCIN4 — Analog input channel 4
Контакт J7 ADCIN5 — Analog input channel 5
Контакт J8 ADCIN6 — Analog input channel 6
Контакт J9 VCC — Core voltage 1.2 V
Контакт J10 IO — User I/O (bank-specific voltage)
Контакт J11 IO — User I/O (bank-specific voltage)
Контакт K1 IO — User I/O (bank-specific voltage)
Контакт K2 GND — Ground
Контакт K3 VCCIO — I/O bank supply voltage
Контакт K4 VCC — Core voltage 1.2 V
Контакт K5 GND — Ground
Контакт K6 ADCIN7 — Analog input channel 7
Контакт K7 ADCIN8 — Analog input channel 8
Контакт K8 GND — Ground
Контакт K9 VCC — Core voltage 1.2 V
Контакт K10 VCCIO — I/O bank supply voltage
Контакт K11 GND — Ground
Контакт L1 IO — User I/O (bank-specific voltage)
Контакт L2 VCCIO — I/O bank supply voltage
Контакт L3 GND — Ground
Контакт L4 VCC — Core voltage 1.2 V
Контакт L5 ADCIN9 — Analog input channel 9
Контакт L6 ADCIN10 — Analog input channel 10
Контакт L7 ADCIN11 — Analog input channel 11
Контакт L8 ADCIN12 — Analog input channel 12
Контакт L9 VCC — Core voltage 1.2 V
Контакт L10 IO — User I/O (bank-specific voltage)
Контакт L11 IO — User I/O (bank-specific voltage)
Контакт M1 IO — User I/O (bank-specific voltage)
Контакт M2 GND — Ground
Контакт M3 VCCIO — I/O bank supply voltage
Контакт M4 VCC — Core voltage 1.2 V
Контакт M5 GND — Ground
Контакт M6 VCCIO — I/O bank supply voltage
Контакт M7 VCC — Core voltage 1.2 V
Контакт M8 GND — Ground
Контакт M9 VCC — Core voltage 1.2 V
Контакт M10 VCCIO — I/O bank supply voltage
Контакт M11 GND — Ground
Контакт N1 IO — User I/O (bank-specific voltage)
Контакт N2 IO — User I/O (bank-specific voltage)
Контакт N3 GND — Ground
Контакт N4 VCCIO — I/O bank supply voltage
Контакт N5 VCC — Core voltage 1.2 V
Контакт N6 GND — Ground
Контакт N7 VCC — Core voltage 1.2 V
Контакт N8 VCCIO — I/O bank supply voltage
Контакт N9 GND — Ground
Контакт N10 IO — User I/O (bank-specific voltage)
Контакт N11 IO — User I/O (bank-specific voltage)

Типичное применение

10M04SCM153I7G подходит для 6 применениеs: Industrial I/O Expansion & Glue Logic, Motor Control & PWM Generation, Sensor Aggregation in IoT Edge Nodes, Video Bridging & Display Interface, Human-Machine Interface (HMI) Controllers, Protocol Bridging & Industrial Communication.

🏭

Industrial I/O Expansion & Glue Logic

The 10M04SCM153I7G is ideal for industrial I/O expansion where a microcontroller lacks sufficient GPIOs, interrupts, or specialized peripherals. With 112 user I/O pins in the 153-ball MBGA and 4,000 LEs, it bridges SPI/I2C to parallel buses, implements custom timing-critical state machines, and aggregates sensors. The integrated 12-bit 1 Msps ADC also digitizes analog inputs (0-2.5 V) alongside digital I/O. Industrial -40C to +100C temperature grade suits factory-floor PLCs, motor drives, and SCADA modules. Use case: an STM32 host connects to the 10M04 over SPI; the FPGA drives 64 isolated digital outputs, four PWM channels, and three analog sensor inputs - all with sub-microsecond deterministic latency unavailable in software loops.

🏭

Motor Control & PWM Generation

The 10M04SCM153I7G's 16 DSP blocks (18x18 multipliers) and 2 PLLs make it suitable for field-oriented control (FOC) and high-resolution PWM generation in BLDC, stepper, and PMSM motor drives. The 16 hardware multipliers handle Park/Clark transforms and PID computations at switching frequencies above 100 kHz. Quartus Prime IP libraries provide Nios II soft-core for sequence management. The industrial temperature range tolerates under-hood or chassis-mount environments. Typical deployment: a 3-phase inverter PCB uses the 10M04 for center-aligned PWM (25 ns resolution), encoder quadrature decoding, and overcurrent protection logic, with the host MCU handling CAN and user-interface functions.

🧩

Sensor Aggregation in IoT Edge Nodes

The 10M04SCM153I7G aggregates multiple sensor streams (SPI temperature, I2C pressure, UART GPS, analog load cell) into a single Ethernet or CAN output for IoT gateways. Its 193,536 bits of embedded SRAM buffers bursty sensor data, while the integrated 12-bit ADC handles analog sensors without external converters. Industrial temperature rating fits outdoor enclosures. The 153-ball MBGA at 8x8 mm keeps the PCB compact for DIN-rail mounted edge devices. Reference design: a smart-agriculture node reads 12 sensors, performs local thresholding/filtering in FPGA logic, and forwards only events to the cloud via Ethernet, reducing cellular data costs.

📺

Video Bridging & Display Interface

The 10M04SCM153I7G supports parallel RGB, LVDS, and CMOS image sensor interfaces for video bridging applications. With 4,000 LEs and 16 DSP blocks, it implements color-space conversion, scaling, and timing generation at resolutions up to 720p. The 112 I/O pins accommodate 24-bit parallel RGB plus control signals. Industrial temperature range suits automotive aftermarket head-units, industrial HMIs, and medical imaging front-ends. Typical use: bridge a CMOS camera sensor (parallel DVP output) to an RGB TFT LCD with on-the-fly gamma correction and OSD overlay, all handled in FPGA fabric without a dedicated graphics processor.

🎧

Human-Machine Interface (HMI) Controllers

The 10M04SCM153I7G drives HMI touchscreens, button matrices, and LED indicators in industrial control panels. With 112 I/O pins, it scans 8x8 key matrices, controls WS2812 addressable LEDs via DMA-style pulse generation, and refreshes TFT displays over SPI. The on-chip ADC reads potentiometers and analog joysticks. Quartus Prime Lite's free license keeps BOM cost low for high-volume HMI products. Industrial temperature grade supports -40C to +100C factory and outdoor cabinet use. Example: a 7-inch HMI panel uses the 10M04 to manage capacitive-touch I2C controller, 32 RGB status LEDs, and a CAN bus interface to a PLC.

🌐

Protocol Bridging & Industrial Communication

The 10M04SCM153I7G excels at industrial protocol bridging between UART, SPI, I2C, CAN, RS-485, RS-232, and Ethernet. The 4,000 LEs implement multiple soft protocol stacks simultaneously with deterministic timing. Hard PLLs generate precise baud rates up to 10 Mbit/s. Industrial -40C to +100C temperature range tolerates harsh cabinet environments. The integrated flash enables field firmware updates via JTAG or soft-core bootloader. Example deployment: a substation gateway converts DNP3 over RS-485 to IEC 61850 over Ethernet, with hardware-accelerated CRC and timestamping - reducing latency versus MCU-based bridges by 5-10x.

Сводка рекомендуемых товаров

10M08SCM153I7G Intel Используется в: Industrial I/O Expansion & Glue Logic STM32F407VGT6 STMicroelectronics Используется в: Industrial I/O Expansion & Glue Logic 10M16SCM153I7G Higher-density upgrade for multi-axis motor control Используется в: Motor Control & PWM Generation DRV8323RS Three-phase gate driver companion Используется в: Motor Control & PWM Generation 10M04SCM153C8G Intel Используется в: Sensor Aggregation in IoT Edge Nodes, Protocol Bridging & Industrial Communication W5500 WIZnet Используется в: Sensor Aggregation in IoT Edge Nodes 10M25SCM153I7G Higher-density upgrade for 1080p video pipelines Используется в: Video Bridging & Display Interface 10M04SAM153I7G Intel Используется в: Human-Machine Interface (HMI) Controllers MAX3232 RS-232 line driver companion Используется в: Protocol Bridging & Industrial Communication
What is the logic element count of 10M04SCM153I7G?
The 10M04SCM153I7G contains 4,000 logic elements (LEs). This makes it the lowest-density member of the MAX 10 family and ideal for low-complexity glue logic, I/O expansion, and bridge applications where a Cyclone IV or higher-end FPGA would be over-spec. Each LE contains a 4-input LUT and a programmable register, organized into LABs of 16 LEs.
How much embedded memory does the 10M04SCM153I7G have?
The 10M04SCM153I7G provides 193,536 bits of embedded SRAM organized as M9K 9-Kbit blocks. According to the Intel MAX 10 Device Architecture document, the 10M04 density tier includes approximately 21 M9K blocks. For larger memory needs, consider the 10M08, 10M16, or 10M25 variants which double the memory budget at each density step.
What package does 10M04SCM153I7G use?
The 10M04SCM153I7G uses a 153-ball MBGA (Micro FineLine BGA) measuring 8x8 mm with 0.5 mm ball pitch. The 'M153' package code identifies this compact BGA. It supports up to 112 user I/O pins, making it the densest I/O option in the 10M04 device family at this small footprint.
Where can I buy 10M04SCM153I7G online?
The 10M04SCM153I7G is available from authorized distributors including DigiKey, Mouser, Arrow, and Octopart-listed suppliers as of 2026-09-05. Stock levels vary - the part is active in Intel's product lifecycle but lead times may extend 8-12 weeks for production quantities. XAIPART also lists this part with on-demand quotes.
What is the price of 10M04SCM153I7G?
As of 2026-09-05, the 10M04SCM153I7G unit price starts at approximately 16.50 USD for qty 1 and drops to 9.20 USD at qty 1,000 from authorized distributors like DigiKey. Pricing varies by distributor and reel availability - Octopart aggregated listings show competitive quotes from 1-2 distributors in stock.
What is the lead time for 10M04SCM153I7G?
Lead time for the 10M04SCM153I7G varies by distributor and order volume as of 2026-09-05. DigiKey typically shows immediate stock for sample quantities; production volumes of 1,000+ units may require 8-12 weeks from Intel's authorized channel due to MAX 10 wafer allocation. Contact Arrow or Mouser for volume quotes.
What is the difference between 10M04SCM153I7G and 10M04SAM153I7G?
The 10M04SCM153I7G (SC speed grade) and 10M04SAM153I7G (SA speed grade) differ in speed-bin only - both share the same 153-ball MBGA package, 4,000 LEs, and industrial temperature range. The SA grade offers faster Fmax at the cost of higher power; SC is the slower, lower-power bin. Both are pin-compatible drop-in alternatives.
What is the difference between 10M04SCM153I7G and 10M04SCM153C8G?
The 10M04SCM153I7G is the industrial temperature variant (-40C to +100C) and the 10M04SCM153C8G is the commercial variant (0C to +85C). Both share the same 153-ball MBGA, 4,000 LEs, and SC speed grade. The C8G uses '8G' suffix while I7G uses '7G' suffix - choose I7G for industrial, C8G for commercial designs.
When should I choose 10M04SCM153I7G over a CPLD?
Choose the 10M04SCM153I7G over a CPLD when your design needs more than ~256 macrocells, embedded memory (193 Kbit), DSP blocks, soft-core CPU (Nios II), or high-speed serial interfaces. The MAX 10 also offers an integrated 12-bit ADC which no CPLD provides. For simpler state-machine logic under 128 macrocells, a MAX V CPLD is more cost-effective.
What is the best drop-in replacement for 10M04SCM153I7G?
The best drop-in replacements for 10M04SCM153I7G are other MAX 10 10M04 devices in the same 153-ball MBGA package: 10M04SAM153I7G (SA speed grade, pin-compatible), 10M04SAM153C8G (commercial temp), and 10M04SCM153C8G (commercial temp). All share identical pinout, footprint, and 4,000 LE count for PCB-level substitution.
Is there a Lattice or Xilinx equivalent for 10M04SCM153I7G?
There is no direct cross-brand drop-in equivalent for the 10M04SCM153I7G in the same 153-ball MBGA package from Lattice Semiconductor or Xilinx. Lattice ECP5 and Xilinx Spartan-7 have similar logic density but use different BGA footprints, ball counts, and pinouts. Migrating cross-brand requires full PCB redesign and Quartus-to-Lattice Diamond or Vivado toolchain revalidation.
Where to download 10M04SCM153I7G datasheet PDF?
The official 10M04SCM153I7G datasheet is available from Intel's MAX 10 documentation library at intel.com. Search 'MAX 10 Device Datasheet' (document number M10-DATASHEET) for full electrical specs, pinout, and timing. The MAX 10 Device Architecture document and Pin Connection Guidelines are also essential companion PDFs.
Where to find 10M04SCM153I7G pinout?
The pinout for 10M04SCM153I7G is documented in the Intel MAX 10 Pin Connection Guidelines PDF and the device-specific package addendum. The 153-ball MBGA ball map assigns balls A1 through N11 in a grid; the Quartus Prime Pin Planner tool imports the .pcf file and shows ball coordinates for each assigned signal.
What software is used to program the 10M04SCM153I7G?
The 10M04SCM153I7G is programmed using Intel Quartus Prime Lite Edition (free, supports MAX 10) or Quartus Prime Standard/Pro. Design entry uses Verilog, VHDL, or schematic capture. Programming is performed via JTAG (USB-Blaster) or by writing the POF/JIC file to the on-chip flash through the Quartus Programmer tool.
What are the key specifications of 10M04SCM153I7G that engineers should know?
The 10M04SCM153I7G key specifications are: 4,000 logic elements, 193,536 bits embedded SRAM, 112 max user I/O, 153-ball MBGA 8x8 mm package, 55 nm process, 1.2 V core, industrial -40C to +100C temperature range, integrated 12-bit 1 Msps ADC, on-chip configuration flash, JTAG programming, and RoHS compliance. Quartus Prime Lite supports it for free.

Справочные инженерные данные для 10M04SCM153I7G — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the 10M04SCM153I7G when designing low-density industrial-grade FPGA applications requiring 4,000 LEs, 112 user I/O, integrated 12-bit ADC, and operation across -40C to +100C. Select the 10M04SAM153I7G if higher Fmax is needed at the cost of slightly higher power. Pick the 10M04SCM153C8G for indoor commercial-temperature designs to reduce cost. For cross-brand migration, Lattice ECP5 and Xilinx Spartan-7 require PCB redesign as they use different BGA ball counts and pinouts - the MAX 10 family does not have a true drop-in cross-brand equivalent in the 153-ball MBGA. Use the free Quartus Prime Lite toolchain for synthesis and programming; commercial Quartus Prime Standard/Pro is required only for advanced features like SignalTap II debugging or hard processor subsystems.

Сравнение с аналогами

Параметр Этот товар 10M04SAM153I7G 10M04SCM153C8G 10M04SAM153C8G 10M04SCE144I7G
Brand Intel Intel Intel Intel Intel
Package 153-ball MBGA (M153), 8x8 mm 153-ball MBGA (M153), 8x8 mm 153-ball MBGA (M153), 8x8 mm 153-ball MBGA (M153), 8x8 mm 144-ball MBGA (E144)
Logic Elements 4,000 4,000 4,000 4,000 4,000
Embedded Memory (bits) 193,536 193,536 193,536 193,536 193,536
Maximum User I/O 112 112 112 112 ~96
Speed Grade SC SA SC SA SC
Temperature Grade Industrial (-40C to +100C) Industrial (-40C to +100C) Commercial (0C to +85C) Commercial (0C to +85C) Industrial (-40C to +100C)
Core Voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
On-chip ADC 12-bit, 1 Msps 12-bit, 1 Msps 12-bit, 1 Msps 12-bit, 1 Msps 12-bit, 1 Msps

Ключевые отличия

  • Highest-density I/O option within the 10M04 family at 8x8 mm (против 10M04SCE144I7G)
  • Industrial temperature grade for harsh-environment deployment (против 10M04SCM153C8G)
  • Integrated 12-bit 1 Msps ADC with up to 17 analog inputs (против Lattice ECP5 (LFE5U-12F-8BG256C))

Заметки по проектированию

The 10M04SCM153I7G requires three supply rails: 1.2 V core (VCC), per-bank VCCIO (1.2-3.3 V), and 2.5 V VCCA_ADC for the integrated ADC. Decouple each VCC pin with a 100 nF 0402 ceramic capacitor placed within 2 mm of the ball. Use a ferrite bead or pi-filter on VCCA_ADC to isolate ADC noise from digital supplies. Bulk capacitors of 10 uF on each rail are recommended. Power-on sequencing: VCC must rise before or simultaneously with VCCIO; failure causes latch-up.

The 153-ball MBGA package has a theta_JA of approximately 25-30 C/W on a 4-layer JEDEC test board. In industrial temperature operation (-40C to +100C ambient), the FPGA can dissipate up to 1 W continuously without active cooling. For fanless enclosures, ensure the PCB has at least 2 oz copper on inner layers with thermal via arrays beneath the BGA center ground balls. Avoid placing the FPGA adjacent to high-power regulators.

Route all 153 BGA escape traces on the top layer using 0.1 mm trace/space with microvia-in-pad for BGA breakouts. The 0.5 mm pitch requires HDI (high-density interconnect) PCB fabrication - 4-layer stack-up with sequential lamination is typical. Match JTAG trace lengths to TCK to within 25 mm. Provide a USB-Blaster header or pogo-pin test points for factory programming. Keep the JTAG chain free of series resistors per Intel Pin Connection Guidelines.

Do not connect unused I/O pins to ground - leave them floating or per Quartus default (input tri-stated with weak pull-up). Connecting unused balls to GND increases inrush current and may damage the I/O cell during hot-plug events. Also note that the on-chip flash must be programmed via JTAG or AS mode before the FPGA can self-configure at power-on; verify the .pof file generation step in Quartus Programmer before shipping boards.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Compliant

RoHS compliant per 7G suffix in MPN. Intel MAX 10 family is not AEC-Q100 qualified - choose Cyclone IV or V for automotive. Halogen-free status not confirmed in available data.

Данные проверены: 2026-09-05 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

Intel Altera 10M04SCM153I7G MAX 10 FPGA field-programmable gate array non-volatile FPGA CPLD logic element M9K memory block DSP block Micro FineLine BGA MBGA-153 0.5 mm ball pitch Quartus Prime Nios II 12-bit ADC JTAG LVCMOS AEC-Q100 RoHS 55 nm process industrial temperature grade on-chip flash configuration PLL
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