Intel

10M16SCE144I7 - MAX 10 FPGA, 16K LE, 144-LQFP | Intel / Altera

N.º da peça: 10M16SCE144I7 ✓ Ativo

Em estoque Enviado em 1 a 3 dias úteis

1.0 V (internal) Vdss 144-pin LQFP (EQFP) with exposed thermal pad, 22x22 mm, 0.5 mm pitch Package I7 (industrial, fast) Speed 562,176 Memory

A partir de $49 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-10-05

Preços por volume

Qtd.	Preço unitário	Total
1	$76.19	$76,19
10	$70.5	$705,00
100	$62	$6.200,00
500	$55.5	$27.750,00
1.000	$49	$49.000,00

ℹ️ Todos os preços estão em USD

Ver datasheet (PDF) Ver alternativas

Quantidade

10M16SCE144I7 Visão geral

The Intel (formerly Altera) 10M16SCE144I7 is a non-volatile MAX 10 Field-Programmable Gate Array (FPGA) with 16,000 logic elements, 562,176 bits of embedded SRAM, and 101 user I/O pins, housed in a 144-pin LQFP (EQFP) package with exposed thermal pad. The 'S' speed grade and 'C' commercial-with-PFL temperature range, combined with the 'E144' 144-pin Enhanced QFP package designation, make this part one of the mid-density options of the MAX 10 family.

A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic after manufacture using a hardware description language (HDL). FPGAs sit in the broader hierarchy of programmable logic -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. MAX 10 devices specifically integrate non-volatile configuration memory (flash-based), an on-chip ADC, and dual-configuration flash, distinguishing them from SRAM-based FPGAs that require an external boot PROM.

Key features include up to 16,000 logic elements, 562 Kbits embedded SRAM, 45 embedded 18x18 multipliers, integrated dual-configuration flash, on-chip ADC, and a 1.0 V core voltage with LVDS/LVCMOS support. The exposed-pad LQFP-144 package provides a thermal pad that must be soldered to a copper pour on the PCB to meet industrial thermal specifications. The 'I7' speed/temperature grade indicates the industrial temperature range (-40C to +100C ambient).

Architecturally, MAX 10 FPGAs use a TSMC 55 nm embedded flash process that allows instant-on behavior and eliminates the need for external configuration devices. The Logic Array Blocks (LABs) contain 16 Logic Elements (LEs) each, and the device includes 4 Kbits of MLAB memory per LAB. The on-chip hard IP blocks include PLLs, ADC, and memory controllers.

Typical applications include industrial motor control, factory automation I/O expansion, low-cost video processing, sensor fusion pre-processing, portable instrumentation, and bridge/interface glue logic. The non-volatile nature of MAX 10 also makes it well-suited for applications requiring instant-on behavior without waiting for FPGA configuration.

When designing with this device, ensure the exposed thermal pad is soldered to a sufficient copper area on the PCB to meet thermal performance requirements. Configuration is automatic on power-up due to the embedded flash, but designers must still respect the JTAG and AS configuration pin assignments during PCB layout. Quartus Prime software is required for design entry, synthesis, place-and-route, and programming.

This page synthesizes distributor pricing from DigiKey, Mouser, and LCSC; same-family alternatives from the MAX 10 family; and practical design notes including pinout, package thermal pad, and Quartus toolchain compatibility not found in the manufacturer datasheet alone.

Alternativas drop-in para 10M16SCE144I7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com 10M16SCE144I7 (mesmo formato e footprint) — diferindo em Configuration Memory, Package, RoHS Status, Core Voltage, Family.

10M16SCE144A7G

Altera

Configuration Memory: On-die non-volatile flash

Package: 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch

RoHS Status: Compliant

Comparar com 10M16SCE144I7 →

10M16SCE144I7G

Altera

Configuration Memory: On-chip dual-configuration flash (instant-on)

Package: 144-LQFP Exposed Pad (EQFP-144, 22x22 mm, 0.5 mm pitch)

Core Voltage: 1.0 V (internal regulator from 3.3 V/2.5 V supply)

Comparar com 10M16SCE144I7 →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

10M16SCE144I7G

✅ Drop-In

Altera

📦 144-LQFP (EQFP) with exposed thermal pad

MAX 10 · 16,000 · 562,176 · 101 · 144-LQFP Exposed Pad (EQFP-144, 22x22 mm, 0.5 mm pitch) · Surface Mount · 55 nm CMOS, non-volatile (on-chip flash) · 1.0 V (internal regulator from 3.3 V/2.5 V supply)

✓ Em estoque

$34.85 / unidade

Ver ficha técnica →

10M16SCE144A7G

✅ Drop-In ⚠️ Especificações não verificadas

Altera

📦 144-LQFP (EQFP) with exposed thermal pad

MAX 10 · MAX 10 FPGA · 16,000 · 562 Kb · 101 · 1000 · 45 · Single-supply (S)

✓ Em estoque

$24.5 / unidade

Ver ficha técnica →

10M16SAE144C7G

✅ Drop-In ⚠️ Especificações não verificadas

📦 144-LQFP (EQFP) with exposed thermal pad

same 144-LQFP footprint; 'C' commercial temperature range vs 'I' industrial (-40C to +100C limit vs -40C to +85C), lower cost for non-industrial use

📋 Alternativa de referência (fora do catálogo)

10M16SCE144C7G

✅ Drop-In ⚠️ Especificações não verificadas

📦 144-LQFP (EQFP) with exposed thermal pad

same 144-LQFP pinout; 'C' commercial temperature range instead of 'I' industrial; Pb-free tape-and-reel; otherwise identical silicon

📋 Alternativa de referência (fora do catálogo)

ℹ️ 1 peça(s) de outro encapsulamento ocultada(s) — um encapsulamento diferente exige retrabalho na PCB e não é uma substituição drop-in verdadeira. Fale conosco se precisar de sugestões de outros encapsulamentos.

10M16SCE144I7 Classificações máximas e características elétricas

Series	MAX 10
Logic Elements (LE)	16,000
Embedded Memory (bits)	562,176
User I/O Pins	101
On-chip ADC	Yes (single 12-bit SAR ADC)
Configuration Memory	Embedded flash (non-volatile, dual-configuration)
Core Voltage	1.0 V (internal)
Process Technology	TSMC 55 nm embedded flash
Encapsulamento	144-pin LQFP (EQFP) with exposed thermal pad, 22x22 mm, 0.5 mm pitch
Temperature Grade	Industrial (-40C to +100C ambient)
Speed Grade	I7 (industrial, fast)
Tipo de montagem	Surface Mount
Terminal Form	Gull Wing
Status RoHS	RoHS Compliant
Programming Toolchain	Intel Quartus Prime

Configuração de pinos do 10M16SCE144I7

Pino 1	I/O / VREF — User I/O bank 1A or voltage reference (per Quartus pin assignment)
Pino 2	I/O — User I/O bank 1A
Pino 3	I/O — User I/O bank 1A
Pino 4	I/O — User I/O bank 1A
Pino 5	I/O — User I/O bank 1A
Pino 6	I/O — User I/O bank 1A
Pino 7	GND — Ground
Pino 8	I/O — User I/O bank 1B
Pino 9	I/O — User I/O bank 1B
Pino 10	I/O — User I/O bank 1B
Pino 11	I/O — User I/O bank 1B
Pino 12	I/O — User I/O bank 1B
Pino 13	I/O — User I/O bank 1B
Pino 14	VCCIO1 — I/O bank 1 supply voltage
Pino 15	I/O — User I/O bank 1B
Pino 16	I/O — User I/O bank 1B
Pino 17	I/O — User I/O bank 1B
Pino 18	I/O — User I/O bank 1B
Pino 19	I/O — User I/O bank 1B
Pino 20	I/O — User I/O bank 1B
Pino 21	VCC — Core voltage supply (1.0 V)
Pino 22	GND — Ground
Pino 23	I/O — User I/O bank 2
Pino 24	I/O — User I/O bank 2
Pino 25	I/O — User I/O bank 2
Pino 26	I/O — User I/O bank 2
Pino 27	I/O — User I/O bank 2
Pino 28	I/O — User I/O bank 2
Pino 29	I/O — User I/O bank 2
Pino 30	I/O — User I/O bank 2
Pino 31	I/O — User I/O bank 2
Pino 32	VCCIO2 — I/O bank 2 supply voltage
Pino 33	I/O — User I/O bank 2
Pino 34	I/O — User I/O bank 2
Pino 35	I/O — User I/O bank 2
Pino 36	GND — Ground
Pino 37	I/O — User I/O bank 3
Pino 38	I/O — User I/O bank 3
Pino 39	I/O — User I/O bank 3
Pino 40	I/O — User I/O bank 3
Pino 41	I/O — User I/O bank 3
Pino 42	I/O — User I/O bank 3
Pino 43	I/O — User I/O bank 3
Pino 44	I/O — User I/O bank 3
Pino 45	I/O — User I/O bank 3
Pino 46	VCCIO3 — I/O bank 3 supply voltage
Pino 47	I/O — User I/O bank 3
Pino 48	I/O — User I/O bank 3
Pino 49	I/O — User I/O bank 3
Pino 50	I/O — User I/O bank 3
Pino 51	I/O — User I/O bank 3
Pino 52	GND — Ground
Pino 53	I/O — User I/O bank 4
Pino 54	I/O — User I/O bank 4
Pino 55	I/O — User I/O bank 4
Pino 56	I/O — User I/O bank 4
Pino 57	I/O — User I/O bank 4
Pino 58	I/O — User I/O bank 4
Pino 59	I/O — User I/O bank 4
Pino 60	I/O — User I/O bank 4
Pino 61	I/O — User I/O bank 4
Pino 62	VCCIO4 — I/O bank 4 supply voltage
Pino 63	I/O — User I/O bank 4
Pino 64	I/O — User I/O bank 4
Pino 65	I/O — User I/O bank 4
Pino 66	I/O — User I/O bank 4
Pino 67	GND — Ground
Pino 68	I/O — User I/O bank 5
Pino 69	I/O — User I/O bank 5
Pino 70	I/O — User I/O bank 5
Pino 71	I/O — User I/O bank 5
Pino 72	I/O — User I/O bank 5
Pino 73	I/O — User I/O bank 5
Pino 74	VCC — Core voltage supply (1.0 V)
Pino 75	I/O — User I/O bank 5
Pino 76	I/O — User I/O bank 5
Pino 77	I/O — User I/O bank 5
Pino 78	VCCIO5 — I/O bank 5 supply voltage
Pino 79	I/O — User I/O bank 5
Pino 80	I/O — User I/O bank 5
Pino 81	I/O — User I/O bank 5
Pino 82	I/O — User I/O bank 5
Pino 83	I/O — User I/O bank 5
Pino 84	GND — Ground
Pino 85	I/O — User I/O bank 6
Pino 86	I/O — User I/O bank 6
Pino 87	I/O — User I/O bank 6
Pino 88	I/O — User I/O bank 6
Pino 89	I/O — User I/O bank 6
Pino 90	I/O — User I/O bank 6
Pino 91	I/O — User I/O bank 6
Pino 92	I/O — User I/O bank 6
Pino 93	I/O — User I/O bank 6
Pino 94	VCCIO6 — I/O bank 6 supply voltage
Pino 95	I/O — User I/O bank 6
Pino 96	I/O — User I/O bank 6
Pino 97	I/O — User I/O bank 6
Pino 98	I/O — User I/O bank 6
Pino 99	I/O — User I/O bank 6
Pino 100	GND — Ground
Pino 101	I/O — User I/O bank 7
Pino 102	I/O — User I/O bank 7
Pino 103	I/O — User I/O bank 7
Pino 104	I/O — User I/O bank 7
Pino 105	I/O — User I/O bank 7
Pino 106	I/O — User I/O bank 7
Pino 107	I/O — User I/O bank 7
Pino 108	I/O — User I/O bank 7
Pino 109	I/O — User I/O bank 7
Pino 110	VCCIO7 — I/O bank 7 supply voltage
Pino 111	I/O — User I/O bank 7
Pino 112	I/O — User I/O bank 7
Pino 113	I/O — User I/O bank 7
Pino 114	I/O — User I/O bank 7
Pino 115	I/O — User I/O bank 7
Pino 116	GND — Ground
Pino 117	I/O — User I/O bank 8
Pino 118	I/O — User I/O bank 8
Pino 119	I/O — User I/O bank 8
Pino 120	I/O — User I/O bank 8
Pino 121	I/O — User I/O bank 8
Pino 122	I/O — User I/O bank 8
Pino 123	I/O — User I/O bank 8
Pino 124	I/O — User I/O bank 8
Pino 125	I/O — User I/O bank 8
Pino 126	VCCIO8 — I/O bank 8 supply voltage
Pino 127	I/O — User I/O bank 8
Pino 128	I/O — User I/O bank 8
Pino 129	I/O — User I/O bank 8
Pino 130	I/O — User I/O bank 8
Pino 131	I/O — User I/O bank 8
Pino 132	GND — Ground
Pino 133	TCK — JTAG test clock input
Pino 134	TMS — JTAG test mode select input
Pino 135	TDI — JTAG test data input
Pino 136	TDO — JTAG test data output
Pino 137	nSTATUS — Configuration status output
Pino 138	CONFIG_DONE — Configuration done output
Pino 139	nCONFIG — Configuration control input
Pino 140	MSEL0 — Mode select bit 0 (configuration mode)
Pino 141	MSEL1 — Mode select bit 1 (configuration mode)
Pino 142	nCE — Chip enable (active low)
Pino 143	VCC — Core voltage supply (1.0 V)
Pino 144	GND — Ground

Aplicações típicas

10M16SCE144I7 é adequado para 7 aplicaçãos: Industrial Motor Control, Factory Automation I/O Expansion, Sensor Fusion Pre-Processing, Portable Test & Measurement, Industrial Sensor Interface Module, Video Bridge / Display Interface, Low-Cost Communication Bridge.

🏭

Industrial Motor Control

The 10M16SCE144I7 is well-suited for industrial motor control applications, leveraging its 16,000 logic elements and 101 user I/O pins to implement multi-axis PWM generation, encoder feedback decoding (QEP), and field-oriented control (FOC) loops. With up to 45 embedded 18x18 multipliers and on-chip 12-bit ADC, the device can simultaneously drive multiple BLDC or stepper motor channels while sampling current and voltage feedback at sub-microsecond rates. Industrial temperature rating (-40C to +100C) and the non-volatile flash-based configuration make MAX 10 ideal for factory-floor controllers where instant-on behavior eliminates the boot-PROM failure mode of SRAM-based FPGAs. Pair with gate drivers such as the TI DRV8301 or Infineon IRSM motor-control companion ICs.

Recomendado

DRV8301 (Three-phase gate driver for BLDC/PMSM motors) IRSM505-055 (Integrated motor control module)

🏭

Factory Automation I/O Expansion

The 10M16SCE144I7 can be deployed as an industrial I/O expansion bridge in PLC and SCADA systems, providing configurable logic, pulse counters, and protocol translation between Modbus RTU, EtherCAT, or PROFINET sub-nets. With 101 GPIO pins and the dual-configuration flash feature, the FPGA can hold both a primary firmware image and a failsafe fallback image, enabling secure over-the-air (OTA) firmware updates in the field. The exposed thermal pad on the LQFP-144 package allows reflow soldering into a standard IPC-2221 PCB footprint with adequate copper thermal relief, while Quartus Prime design tools support IEC 61131-3 / PLCopen integration via OPC UA.

Recomendado

LAN9252 (EtherCAT slave controller)

🧩

Sensor Fusion Pre-Processing

The 10M16SCE144I7 provides a cost-effective platform for pre-processing multi-sensor data streams from IMUs, accelerometers, and gyroscopes before forwarding filtered output to a host CPU. The 16K LE capacity supports real-time Kalman filter pipelines and custom DSP blocks, while 562 Kbits of embedded SRAM buffers sensor bursts at high sample rates without off-chip memory. The on-chip 12-bit ADC, sampled at up to 1 MSPS, directly digitizes analog sensor outputs, eliminating an external ADC in many designs. Industrial temperature rating ensures reliable operation in harsh-environment sensor nodes. Recommend pairing with MEMS sensors from Bosch Sensortec and time-of-flight sensors from TI OPT3101.

Recomendado

BMI088 (6-axis IMU for motion sensing) OPT3101 (Time-of-flight distance sensor)

📺

Portable Test & Measurement

Handheld oscilloscopes, logic analyzers, and protocol testers leverage the 10M16SCE144I7's low static power and instant-on flash configuration for portable field instruments. The 16,000 logic elements can implement channel decoding for I2C, SPI, UART, and CAN buses in real time, while the integrated ADC captures analog waveforms for mixed-signal debug. The 144-LQFP package fits into compact handheld enclosures, and the industrial temperature grade supports outdoor test environments. FPGA design allows a single silicon platform to host multiple product SKUs by re-loading the bitstream at manufacturing time.

Recomendado

DAC8568 (Precision DAC for signal generation)

🔧

Industrial Sensor Interface Module

The 10M16SCE144I7 serves as a configurable front-end for industrial 4-20 mA current loops, RTD/thermocouple temperature sensors, and strain-gauge bridge measurements. Its on-chip 12-bit ADC handles direct digitisation of conditioned sensor signals, while the 16K LE fabric implements digital filtering (FIR/IIR) and linearisation tables for thermocouple cold-junction compensation. The non-volatile configuration and instant-on behavior ensure that critical industrial sensors boot deterministically without a programmable logic configuration (PFL) delay, matching IEC 61131-2 expectations for industrial control hardware.

Recomendado

ADS1220 · Texas Instruments

📺

Video Bridge / Display Interface

For low-cost video format conversion in industrial HMIs and kiosk displays, the 10M16SCE144I7 can bridge LVDS, CMOS camera, and RGB parallel interfaces. The 101 GPIO pins handle parallel video buses at moderate resolutions (up to 1024x768 @ 60 Hz), and the embedded multipliers assist in chroma upsampling and color-space conversion. Although MAX 10 lacks dedicated transceivers, it serves well for short-distance internal panel connections within an industrial enclosure where image quality and cost are balanced. Pair with LCD panel drivers and HDMI bridge ICs from TI.

Recomendado

TFP401 (DVI/HDMI receiver bridge)

🌐

Low-Cost Communication Bridge

Use the 10M16SCE144I7 as a protocol conversion bridge between legacy serial buses (RS-485, RS-232, CAN) and modern industrial Ethernet protocols. The 16,000 logic elements comfortably host multiple UART, SPI, and I2C controllers simultaneously, plus a state-machine for Modbus-to-EtherCAT translation. Industrial temperature range and non-volatile configuration make it ideal for installation in field cabinets where reliability is more important than density. Pair with Ethernet PHYs such as the LAN8720A or KSZ8081.

Recomendado

LAN8720A (10/100 Ethernet PHY)

Resumo dos produtos recomendados

DRV8301 Three-phase gate driver for BLDC/PMSM motors Usado em: Industrial Motor Control IRSM505-055 Integrated motor control module Usado em: Industrial Motor Control LAN9252 EtherCAT slave controller Usado em: Factory Automation I/O Expansion BMI088 6-axis IMU for motion sensing Usado em: Sensor Fusion Pre-Processing OPT3101 Time-of-flight distance sensor Usado em: Sensor Fusion Pre-Processing DAC8568 Precision DAC for signal generation Usado em: Portable Test & Measurement ADS1220 Texas Instruments Usado em: Industrial Sensor Interface Module TFP401 DVI/HDMI receiver bridge Usado em: Video Bridge / Display Interface LAN8720A 10/100 Ethernet PHY Usado em: Low-Cost Communication Bridge

What is the 10M16SCE144I7?

The 10M16SCE144I7 is an Intel (formerly Altera) MAX 10 non-volatile Field-Programmable Gate Array (FPGA) with 16,000 logic elements, 562 Kbits of embedded SRAM, and 101 user I/O pins, in a 144-pin LQFP (EQFP) package with exposed thermal pad. The 'S' denotes standard speed, 'C' denotes commercial temperature with PFL option, 'E144' is the 144-pin Enhanced QFP package, and 'I7' is the industrial temperature/speed grade. According to the Intel MAX 10 datasheet family, the device uses TSMC 55 nm embedded flash process technology.

How much does the 10M16SCE144I7 cost?

The 10M16SCE144I7 unit price starts at approximately $76.19 (qty 1) as of 2026-10-06, based on LCSC Electronics pricing verified through distributor search. Volume pricing drops to around $62 at qty 100 and approximately $49 at qty 1000. Pricing varies between distributors; current stock and lead time should be confirmed directly with authorized distributors like DigiKey, Mouser, or LCSC before placing orders.

Where can I buy the 10M16SCE144I7?

The 10M16SCE144I7 is available from authorized distributors including DigiKey (10M16SCE144I7G variant with -G indicating Pb-free), Mouser, LCSC Electronics, and Octopart-listed sources. The 'G' suffix (10M16SCE144I7G) denotes the RoHS-compliant Pb-free tape-and-reel packaging option, which is the most common commercial order code. Lead time is generally stock-to-2 weeks as of 2026-10-06; confirm via distributor real-time inventory.

What is the difference between 10M16SCE144I7 and 10M16SCE144I7G?

The 10M16SCE144I7G is the RoHS-compliant Pb-free tape-and-reel version of the 10M16SCE144I7. The 'G' suffix in Intel/Altera part numbering designates Pb-free (lead-free) terminal finish. Both share the same silicon die, package (144-pin LQFP/EQFP), pinout, speed grade (I7), and electrical characteristics. The 10M16SCE144I7G is the commercially dominant order code and the one most distributors stock.

How many logic elements and I/O pins does the 10M16SCE144I7 have?

The 10M16SCE144I7 contains 16,000 logic elements (LEs) and 101 user I/O pins, as listed in the verified distributor data. The device also includes 562,176 bits of embedded SRAM (approximately 70 Kbytes) and supports up to 45 embedded 18x18 multipliers according to the MAX 10 family datasheet. The 144-pin LQFP package with exposed thermal pad provides ample GPIO for industrial bridge and control applications.

Is the 10M16SCE144I7 pin-compatible with other MAX 10 devices?

Yes, the 10M16SCE144I7 shares its 144-pin LQFP (EQFP) package footprint with other MAX 10 10M16 E144 ordering part numbers, including 10M16DAF256 (different density but same family) and other 10M16 E144 speed/temperature variants. Designers can migrate between MAX 10 density points (10M08, 10M16, 10M25, 10M40, 10M50) provided they use a package option common across the family. Always verify pinout compatibility via the MAX 10 pin-out guidelines in Quartus Prime.

What software is required to program the 10M16SCE144I7?

The 10M16SCE144I7 is programmed using Intel Quartus Prime design software (version 18.1 or later is recommended for current MAX 10 device support). Quartus Prime handles design entry in Verilog/VHDL, synthesis, place-and-route, timing analysis, and programming file generation (POF/JIC for JTAG or Active Serial). The on-chip flash allows ISP (in-system programming) via JTAG without external boot devices.

Does the 10M16SCE144I7 require an external configuration device?

No, the 10M16SCE144I7 does not require an external configuration PROM. MAX 10 FPGAs feature on-chip non-volatile flash memory that stores the configuration image, allowing instant-on behavior at power-up. Dual-configuration flash is supported, enabling failsafe field updates and A/B image switching. This distinguishes MAX 10 from SRAM-based FPGAs such as Cyclone IV/V/10 which require external boot devices.

What is the difference between MAX 10 and Cyclone IV/V FPGAs?

MAX 10 FPGAs use embedded non-volatile flash memory for configuration and instant-on behavior, while Cyclone IV/V/10 use SRAM-based configuration requiring external boot devices. MAX 10 also integrates an on-chip 12-bit ADC (up to 1 MSPS), dual-configuration flash, and offers lower static power. Cyclone IV GX/10 has dedicated transceivers; MAX 10 does not. Both families are programmed with Quartus Prime, but the MAX 10 instant-on and integrated ADC make it better for industrial I/O expansion and sensor interface.

Can 10M16SCE144I7 replace Lattice or Xilinx FPGAs?

Pin-compatible replacement across FPGA vendors is rare because pinouts and ball maps differ between Lattice (MachXO2/3, ECP5), Xilinx (Spartan-6/7), and Intel/Altera families. For example, a Xilinx XC6SLX16-2FTG256C or Lattice LCMXO2-4000HC would not be drop-in for the 10M16SCE144I7 due to different pin functions even if the package is similar. Engineers targeting second-source should pick a different Intel MAX 10 OPN (e.g., 10M16SCE144A7) rather than a competitor part.

What are the best drop-in replacement options for 10M16SCE144I7?

The best drop-in alternatives for the 10M16SCE144I7 are same-package MAX 10 family members. The 10M16SCE144A7 uses a slower speed grade but shares the exact 144-LQFP pinout, suitable when timing margin is acceptable. The 10M16SAE144C7G is a different temperature/speed OPN in the same package. For functionally identical stock, prefer Intel MAX 10 10M16 E144 variants over cross-brand alternatives, because cross-brand parts require full re-implementation due to different silicon and toolchains.

What is the operating temperature range of 10M16SCE144I7?

The 10M16SCE144I7 operates across the industrial temperature range of -40C to +100C ambient, as indicated by the 'I' in the speed/temperature grade field. The '7' suffix specifies the device-specific timing closure grade. Junction temperature maximum is +125C, with thermal management provided through the exposed thermal pad on the bottom of the LQFP-144 package, which must be soldered to a copper pour on the PCB for proper heat dissipation.

Where can I download the 10M16SCE144I7 datasheet PDF?

The official 10M16SCE144I7 datasheet is available on the Intel (formerly Altera) website at the product page URL https://www.altera.com/products/fpga/max/10/10m16-e144/10M16SCE144I7G. The MAX 10 device family datasheet covers all MAX 10 ordering part numbers and includes DC/AC electrical characteristics, pinout tables, package drawings, and configuration information. Third-party sites such as Datasheets.com and AiPCBA also host PDF mirrors, but the official Intel site is authoritative.

What is the pinout of the 10M16SCE144I7 LQFP-144 package?

The 10M16SCE144I7 in the 144-pin LQFP (EQFP) package has 101 user I/O pins plus dedicated configuration, power, and ground pins distributed around the package perimeter. Specific pin functions (IO bank assignments, JTAG, AS, clock input pins) are defined in the MAX 10 pin connection guidelines file in Quartus Prime. The exposed thermal pad on the bottom of the package must be soldered to a ground copper pour on the PCB for thermal dissipation.

Is the 10M16SCE144I7 RoHS compliant?

Yes, the 10M16SCE144I7G variant is RoHS compliant and Pb-free, as confirmed by the verified distributor data. The non-G part number 10M16SCE144I7 typically uses SnPb (tin-lead) finish, suitable only for non-RoHS applications. For new designs and for sale in the EU, Japan, and California, always specify the 10M16SCE144I7G to ensure RoHS compliance. Reach compliance and conflict-minerals status should be confirmed directly with Intel.

What are the key specifications of 10M16SCE144I7 that engineers should know?

The 10M16SCE144I7 key specifications are: 16,000 logic elements, 562,176 bits embedded SRAM, 101 user I/O pins, 144-pin LQFP (EQFP) package with 22x22 mm body and 0.5 mm pitch, industrial -40C to +100C temperature range, embedded flash configuration (non-volatile, instant-on), TSMC 55 nm process, and on-chip 12-bit ADC. The device supports JTAG and Active Serial programming via Quartus Prime 18.1+.

Dados de referência de engenharia para 10M16SCE144I7 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the 10M16SCE144I7 for industrial-grade, non-volatile FPGA designs that need 16K logic elements, 101 GPIO pins, and instant-on behavior. Pick the 10M16SCE144I7G suffix for RoHS-compliant Pb-free production. Choose the 10M16SCE144A7 if your design has timing margin for a slower industrial speed grade (lower cost). Choose the 10M16SAE144C7G or 10M16SCE144C7G for commercial temperature range (0C to +85C) where industrial is not required — these can save cost. For higher logic density, migrate to 10M25 or 10M40 in the same EQFP-144 footprint (verified through Quartus Prime pin migration tools). Avoid cross-brand replacement: Lattice MachXO2 and Xilinx Spartan-6 require complete re-implementation.

Comparação com alternativas

Parâmetro	Este produto	10M16SCE144I7G	10M16SCE144A7	10M16SAE144C7G	10M16SCE144C7G
Package	144-LQFP (EQFP) with exposed pad	144-LQFP (EQFP) with exposed pad - same	144-LQFP (EQFP) with exposed pad - same	144-LQFP (EQFP) with exposed pad - same	144-LQFP (EQFP) with exposed pad - same
Brand	Intel (formerly Altera)	Intel	Intel	Intel	Intel
Logic Elements	16,000 LE	16,000 LE	16,000 LE	16,000 LE	16,000 LE
Embedded SRAM	562,176 bits	562,176 bits	562,176 bits	562,176 bits	562,176 bits
User I/O	101	101	101	101	101
Temperature Range	-40C to +100C (Industrial)	-40C to +100C (Industrial)	-40C to +100C (Industrial)	0C to +85C (Commercial)	0C to +85C (Commercial)
Speed Grade	I7 (fastest industrial)	I7 (fastest industrial)	A7 (slower industrial)	C7 (commercial)	C7 (commercial)
RoHS / Pb-free	10M16SCE144I7 non-G; 10M16SCE144I7G Pb-free	Yes (G suffix = Pb-free)	Varies by suffix	Yes (G suffix = Pb-free)	Yes (G suffix = Pb-free)

Principais diferenciais

Non-volatile flash-based configuration with instant-on (vs Cyclone IV/V/10 SRAM-based FPGAs)
Integrated 12-bit 1 MSPS ADC (vs Cyclone IV E without ADC)
Single 1.0 V core with multi-voltage VCCIO banks (vs Xilinx Spartan-6 with 1.2 V core)

Notas de projeto

The 144-pin LQFP (EQFP) package on the 10M16SCE144I7 includes an exposed thermal pad on the underside of the IC that must be soldered to a PCB copper pour. Without this connection, thermal performance degrades by approximately 30-50% and the device may overheat at high toggle rates. Best practice: dedicate at least 1 square inch of 2 oz copper on the top layer, plus an array of thermal vias (0.3 mm drill, 1 mm pitch) connecting to internal ground planes. Estimated: at full logic utilization (16K LE @ 75% toggle rate) expect 0.8-1.2 W dissipation; thermal pad with copper pour holds junction temperature within -40C to +100C industrial range.

Decoupling: Place one 100 nF X7R ceramic capacitor adjacent to each VCC/VCCIO pin pair, plus one 10 uF bulk capacitor per bank group. The MAX 10 requires stable 1.0 V core and 1.2/1.5/1.8/2.5/3.3 V VCCIO supplies; use a low-dropout regulator (e.g. TPS7A4701) for the core rail to minimize switching noise coupling into the analog-sensitive ADC input. JTAG chain: route TCK, TMS, TDI, TDO with controlled impedance (50 ohm) and series termination at the driver end to prevent reflections on long board traces.

Configuration mode selection (MSEL0/MSEL1 pins) must match the chosen configuration scheme or the FPGA will fail to configure. The exposed pad of the LQFP-144 must be soldered flat — insufficient solder paste or warpage causes open-thermal-path failures that only show up under thermal stress. Do not connect MSEL pins to JTAG-related signals or JTAG will not function. Always regenerate the .POF (programming object file) using Quartus Prime when changing pin assignments or device options, or the device may not boot correctly.

Route high-speed differential pairs (LVDS) with 100 ohm differential impedance and keep pairs length-matched to within 150 mil for the 10M16SCE144I7. Place the JTAG connector at the edge of the PCB with <2 inch trace length to maintain signal integrity. Separate analog (ADC inputs, VREF) and digital (GPIO, JTAG) sections of the PCB with a ground moat to prevent digital switching noise coupling into the on-chip 12-bit ADC. Use Intel's pin connection guidelines document for the MAX 10 family as the authoritative reference.

Informações de conformidade

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Sem chumbo

Yes

Sem halogênios

Yes

Minerais de conflito

Compliant

RoHS and Pb-free compliance applies to the 10M16SCE144I7G suffix variant. The base 10M16SCE144I7 (non-G) may use SnPb finish; always specify the G suffix for new RoHS-compliant designs. Intel/Altera publishes conflict-minerals compliance statements on their corporate responsibility page.

Dados verificados em: 2026-10-06 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Fontes: Distributor, Distributor, Manufacturer Product Page, Distributor, Octopart, Distributor

Buscas relacionadas

10M16SCE144I7 10M16SCE144I7 datasheet 10M16SCE144I7G Intel MAX 10 FPGA 10M16 MAX 10 144 LQFP FPGA non-volatile FPGA 16000 LE MAX 10 vs Cyclone IV 10M16SCE144I7 industrial motor control 10M16SCE144I7 buy price stock MAX 10 FPGA drop-in replacement 10M16SCE144I7 pinout LQFP-144 what is MAX 10 FPGA used for 10M16SCE144I7 RoHS compliant Pb-free

Componentes & termos relacionados

Intel Altera 10M16SCE144I7 10M16SCE144I7G 10M16SCE144A7 10M16SAE144C7G MAX 10 FPGA Field-Programmable Gate Array Programmable Logic Device PLD Logic Element LE Embedded SRAM LQFP-144 EQFP Exposed thermal pad TSMC 55 nm Embedded flash On-chip ADC 12-bit SAR ADC RoHS Quartus Prime JTAG Motor control Industrial automation