10M16SCE144I7G - MAX 10 FPGA, 16K LE, 144-LQFP | Intel / Altera
MPN: 10M16SCE144I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $51.99 | $51.99 |
| 10 | $48.5 | $485.00 |
| 100 | $42.75 | $4,275.00 |
| 500 | $38.2 | $19,100.00 |
| 1,000 | $34.85 | $34,850.00 |
Drop-in alternatives for 10M16SCE144I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M16SCE144A7G
✅ Drop-In✓ In Stock
$24.5 / Unit
View Datasheet →10M16SCE144C8G
✅ Drop-In📋 Reference alternative (not in catalog)
10M08SCE144I7G
✅ Drop-In✓ In Stock
$10.85 / Unit
View Datasheet →10M04SCE144I7G
✅ Drop-In✓ In Stock
$15.8 / Unit
View Datasheet →10M02SCE144A7G
✅ Drop-In✓ In Stock
$4.62 / Unit
View Datasheet →10M16SCE144I7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 16,000 |
| Embedded Memory (bits) | 562,176 |
| User I/O Pins | 101 |
| Package | 144-LQFP Exposed Pad (EQFP-144, 22x22 mm, 0.5 mm pitch) |
| Mounting Type | Surface Mount |
| Process Technology | 55 nm CMOS, non-volatile (on-chip flash) |
| Core Voltage | 1.0 V (internal regulator from 3.3 V/2.5 V supply) |
| Supply Voltage Range | 2.85 V to 3.465 V (single 3.3 V supply supported) |
| Operating Temperature Grade | I7G (Industrial, -40 C to +100 C junction) |
| RoHS Status | RoHS Compliant |
| Embedded SRAM Blocks | M9K (9 Kbit blocks) |
| DSP Blocks | Yes (18x18 multipliers) |
| Hardened ADC | 12-bit SAR, up to 1 MSPS, 17 channels |
| Configuration Memory | On-chip dual-configuration flash (instant-on) |
10M16SCE144I7G 144-lqfp exposed pad (eqfp-144, 22x22 mm, 0.5 mm pitch) Pin Configuration Guide
Complete pinout information for 10M16SCE144I7G (144-lqfp exposed pad (eqfp-144, 22x22 mm, 0.5 mm pitch) package) with 101 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M16SCE144I7G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 101 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M16SCE144I7G is suitable for 6 applications: Industrial Motor Control, IoT Edge Sensor Aggregation, Portable Test & Measurement, Automotive Body Electronics, Video Bridging & Display Processing, Communication Protocol Bridging.
Industrial Motor Control
The 10M16SCE144I7G fits industrial motor-control designs where the integrated 12-bit SAR ADC (up to 1 MSPS, 17 channels) samples current and voltage feedback while the 16,000 LEs implement field-oriented control loops, PWM generation, and encoder decoding. Operating from a single 3.3 V supply with on-chip regulation simplifies the analog front end. The I7G industrial temperature grade supports factory-floor environments from -40 C to +100 C junction, and the hardened DSP blocks accelerate the Park/Clarke transforms required for AC drives.
Recommended
IoT Edge Sensor Aggregation
For IoT edge gateways aggregating multiple sensor streams (SPI, I2C, UART, GPIO), the 10M16SCE144I7G provides 101 user I/Os and 562 Kbit of embedded SRAM for FIFO buffering, plus DSP blocks for on-device signal preprocessing. The MAX 10 instant-on feature boots from internal flash in microseconds, an advantage over SRAM-based FPGAs that need an external boot PROM. Low static power suits battery-backed edge nodes; LVCMOS 3.3 V I/O directly interfaces with most MEMS sensors and MCUs.
Recommended
Portable Test & Measurement
The integrated ADC and on-chip flash of the 10M16SCE144I7G are useful for portable instruments such as handheld multimeters, oscilloscope probes, and data loggers that need acquisition, signal conditioning, and a display interface in one device. The 16K LEs handle triggering, decimation, and display refresh, while the 562 Kbit SRAM buffers sample data before USB or Bluetooth uplink. Industrial-temperature operation and a single 3.3 V supply simplify enclosure and battery management.
Recommended
Automotive Body Electronics
Body-control modules benefit from the 10M16SCE144I7G's instant-on flash, integrated ADC for switch-bounce detection, and high I/O count for driving LIN/CAN transceivers, LEDs, and relays. The 144-LQFP Exposed Pad package suits under-dash PCB sizes. Designers targeting AEC-Q100 must select an automotive-grade MAX 10 variant; the I7G industrial-grade part shown here is suitable for non-safety body electronics but is not AEC-Q100 qualified.
Recommended
Video Bridging & Display Processing
The 10M16SCE144I7G serves low-cost video bridging, format conversion, and LVDS display driving thanks to its DSP blocks, PLLs, and LVDS-capable I/Os at 144 pins. 16K LEs implement simple scaling, color-space conversion, and timing controllers for industrial monitors and digital signage. The on-chip configuration flash removes the external boot PROM common to SRAM-based FPGA display pipelines, reducing BOM and board area.
Recommended
Communication Protocol Bridging
Bridging between industrial protocols (Modbus, PROFIBUS, CAN, SPI, I2C, UART) is a classic MAX 10 use case. The 10M16SCE144I7G's 101 user I/Os and 562 Kbit SRAM support multiple protocol stacks concurrently, while the hardened ADC monitors bus voltages. Industrial-temperature rating and on-chip flash enable compact, reliable gateways deployed on factory floors where external boot devices would add cost and failure modes.
Recommended
Recommended Products Summary
Engineering reference data for 10M16SCE144I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M16SCE144A7G | 10M16SCE144C8G | 10M08SCE144I7G | 10M04SCE144I7G | 10M02SCE144A7G |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 144-LQFP Exposed Pad (EQFP-144, 22x22 mm) | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same |
| Logic Elements | 16,000 | 16,000 | 16,000 | 8,000 | 4,000 | 2,000 |
| Embedded Memory (bits) | 562,176 | 562,176 | 562,176 | 378,880 (approx) | 189,440 (approx) | [DATA_NEEDED] |
| User I/O | 101 | 101 | 101 | 101 | 101 | 101 |
| Speed/Temperature Grade | I7G (Industrial) | A7G (Commercial) | C8G (Commercial) | I7G (Industrial) | I7G (Industrial) | A7G (Commercial) |
| Integrated ADC | 12-bit SAR, 17 channels | 12-bit SAR, 17 channels | 12-bit SAR, 17 channels | 12-bit SAR, 17 channels | 12-bit SAR, 17 channels | 12-bit SAR, 17 channels |
| Approx. Unit Price (qty 1, USD) | 51.99 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Lowest-density MAX 10 with full feature set intact (vs 10M08SCE144I7G)
- Industrial-temperature I7G grade from same die (vs 10M16SCE144A7G)
- Drop-in alternate speed grade (vs 10M16SCE144C8G)
Design Notes
The 144-LQFP Exposed Pad package of the 10M16SCE144I7G relies on the exposed die pad for both ground return and thermal dissipation. The PCB must solder this pad to a continuous copper pour of at least 1 square inch with multiple thermal vias to the internal ground plane. Estimated: assuming theta_JA of approximately 25 C/W with a properly designed 4-layer thermal pad, the device can dissipate roughly 2 W at 70 C ambient while keeping the junction below 100 C, but the actual MAX 10 power is application-dependent and must be measured.
Decouple the 10M16SCE144I7G power pins with 0.1 uF ceramic capacitors placed within 100 mils of each supply pin, plus bulk 10 uF-22 uF tantalum or polymer capacitors near the package. Keep all MAX 10 supply rails (VCCINT, VCCA, VCCIO, VCCPD) properly sequenced per the device handbook; improper sequencing can prevent configuration. Route JTAG signals (TCK, TMS, TDI, TDO) with controlled impedance and series terminators if the trace exceeds 2 inches.
Common pitfalls when designing with the 10M16SCE144I7G include: (1) failing to connect the exposed pad, which causes electrical and thermal failures; (2) mixing 3.3 V and 2.5 V VCCIO without correct bank-by-bank I/O standard assignments in Quartus; (3) assuming the integrated ADC replaces an external front-end without verifying sample rate and SNR; (4) overlooking configuration mode selection (JTAG vs AS vs PS) which determines whether the device boots from internal flash or external memory.
Route high-speed LVDS pairs on the 10M16SCE144I7G with matched lengths within 20 mils, and keep ground-reference planes continuous under the routes. Place the JTAG header near the device and away from switching power or motor-driver stages to avoid programming failures. For designs using the integrated ADC, route analog inputs away from digital switching traces and use a separate analog ground island joined at a single point to the digital ground at the device.
Compliance Information
RoHS compliance confirmed per Datasheets.com package description (ROHS COMPLIANT, PLASTIC, EQFP-144). Industrial temperature grade I7G but not AEC-Q100 qualified; select an automotive-grade MAX 10 variant for safety-critical automotive applications.
