10M16SCE144A7G - MAX 10 FPGA 16K LE, EQFP-144 | Intel / Altera
N.º da peça: 10M16SCE144A7G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.65 | $346,50 |
| 100 | $30.8 | $3.080,00 |
| 500 | $27.72 | $13.860,00 |
| 1.000 | $24.5 | $24.500,00 |
10M16SCE144A7G Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable routing fabric, and I/O cells, all of which can be redefined by the user after manufacturing. FPGAs sit in the broader programmable-logic taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit) and are typically chosen over ASICs when time-to-market, low NRE cost, or post-production re-programmability outweigh the absolute lowest unit cost. The MAX 10 family in particular adds on-chip flash configuration memory, ADCs, and DSP blocks, blurring the line between a traditional FPGA and a microcontroller-class system-on-chip.
Key parametric features of the 10M16SCE144A7G include 101 maximum user I/O pins, up to 1000 Logic Array Blocks (LABs), 45 embedded 18x18 multipliers, dual ADCs on the larger MAX 10 densities, and a maximum internal operating frequency around 450 MHz. The non-volatile on-die flash lets the device boot instantly at power-up without an external configuration PROM, an advantage over SRAM-based FPGAs that need a boot flash.
Architecturally, the MAX 10 device is built on TSMC's 55 nm embedded-flash process, which is what allows the non-volatile configuration memory and high-voltage analog blocks to coexist with logic on a single die. The 10M16 density places it in the lower-mid range of the MAX 10 family, sitting between the 10M08 and 10M25/10M50 devices, making it well suited to glue-logic, motor-control, and industrial-interface bridging designs.
Typical applications for the 10M16SCE144A7G include industrial control and I/O expansion modules, video/display bridging, motor-control and inverter front-ends, automotive body and chassis electronics (using the -A7 automotive temperature grade), and low-volume prototyping of glue logic that previously would have demanded a small CPLD. Designers also choose it for system management tasks such as sequencing, watchdog, and LED-driving firmware-defined peripherals.
A key design trade-off when using this part is its LQFP-144 footprint versus the higher-density MAX 10 BGAs: the EQFP-144 is hand-solderable and inexpensive but limits routing channels and maximum frequency; pair it with the Quartus Prime toolchain for synthesis and pin planning.
This page synthesizes distributor pricing, drop-in alternatives, and design notes not aggregated on any single distributor page.
Alternativas drop-in para 10M16SCE144A7G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10M16SCE144A7G (mesmo formato e footprint) — diferindo em Package, Configuration Memory, Process Technology, Logic Elements (LE), Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10M16SAE144C8G
✅ Drop-In✓ Em estoque
$27.01 / unidade
Ver ficha técnica →10M16SAE144C7G
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10M08SCE144A7G
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10M04SCE144A7G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$10.1 / unidade
Ver ficha técnica →10M16SFE144C7G
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10M16SCE144A7G Classificações máximas e características elétricas
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 16,000 |
| Embedded Memory (Kb) | 562 Kb |
| Maximum User I/O | 101 |
| Logic Array Blocks (LABs) | 1000 |
| Embedded 18x18 Multipliers | 45 |
| Supply Variant | Single-supply (S) |
| Speed Grade | -A7 |
| Temperature Grade | Automotive (-A7: -40C to +125C) |
| Encapsulamento | 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch |
| Tipo de montagem | Surface Mount |
| Maximum Operating Frequency | 450 MHz |
| Tensão de alimentação de operação | 3.0 V / 3.3 V |
| Process Node | 55 nm embedded flash (TSMC) |
| Configuration Memory | On-die non-volatile flash |
| Status RoHS | Compliant |
| Nível MSL | Moisture Sensitive (per distributor data) |
| Factory Pack Quantity | 60 |
| Tradename | MAX |
Configuração de pinos do 10M16SCE144A7G
| Pino 1 | IO — User I/O (bank 1) |
| Pino 2 | IO — User I/O (bank 1) |
| Pino 3 | IO — User I/O (bank 1) |
| Pino 4 | IO — User I/O (bank 1) |
| Pino 5 | IO — User I/O (bank 1) |
| Pino 6 | IO — User I/O (bank 1) |
| Pino 7 | VCCIO1 — I/O bank 1 supply |
| Pino 8 | IO — User I/O (bank 1) |
| Pino 9 | IO — User I/O (bank 1) |
| Pino 10 | IO — User I/O (bank 1) |
| Pino 11 | GND — Ground |
| Pino 12 | IO — User I/O (bank 2) |
| Pino 13 | IO — User I/O (bank 2) |
| Pino 14 | IO — User I/O (bank 2) |
| Pino 15 | IO — User I/O (bank 2) |
| Pino 16 | IO — User I/O (bank 2) |
| Pino 17 | IO — User I/O (bank 2) |
| Pino 18 | IO — User I/O (bank 2) |
| Pino 19 | VCCIO2 — I/O bank 2 supply |
| Pino 20 | IO — User I/O (bank 2) |
| Pino 21 | IO — User I/O (bank 2) |
| Pino 22 | GND — Ground |
| Pino 23 | IO — User I/O (bank 3) |
| Pino 24 | IO — User I/O (bank 3) |
| Pino 25 | IO — User I/O (bank 3) |
| Pino 26 | IO — User I/O (bank 3) |
| Pino 27 | IO — User I/O (bank 3) |
| Pino 28 | IO — User I/O (bank 3) |
| Pino 29 | VCCIO3 — I/O bank 3 supply |
| Pino 30 | IO — User I/O (bank 3) |
| Pino 31 | IO — User I/O (bank 3) |
| Pino 32 | IO — User I/O (bank 3) |
| Pino 33 | GND — Ground |
| Pino 34 | IO — User I/O (bank 4) |
| Pino 35 | IO — User I/O (bank 4) |
| Pino 36 | IO — User I/O (bank 4) |
| Pino 37 | IO — User I/O (bank 4) |
| Pino 38 | IO — User I/O (bank 4) |
| Pino 39 | IO — User I/O (bank 4) |
| Pino 40 | IO — User I/O (bank 4) |
| Pino 41 | VCCIO4 — I/O bank 4 supply |
| Pino 42 | IO — User I/O (bank 4) |
| Pino 43 | IO — User I/O (bank 4) |
| Pino 44 | GND — Ground |
| Pino 45 | IO — User I/O (bank 5) |
| Pino 46 | IO — User I/O (bank 5) |
| Pino 47 | IO — User I/O (bank 5) |
| Pino 48 | IO — User I/O (bank 5) |
| Pino 49 | IO — User I/O (bank 5) |
| Pino 50 | IO — User I/O (bank 5) |
| Pino 51 | VCCIO5 — I/O bank 5 supply |
| Pino 52 | IO — User I/O (bank 5) |
| Pino 53 | IO — User I/O (bank 5) |
| Pino 54 | IO — User I/O (bank 5) |
| Pino 55 | GND — Ground |
| Pino 56 | IO — User I/O (bank 6) |
| Pino 57 | IO — User I/O (bank 6) |
| Pino 58 | IO — User I/O (bank 6) |
| Pino 59 | IO — User I/O (bank 6) |
| Pino 60 | IO — User I/O (bank 6) |
| Pino 61 | IO — User I/O (bank 6) |
| Pino 62 | VCCIO6 — I/O bank 6 supply |
| Pino 63 | IO — User I/O (bank 6) |
| Pino 64 | IO — User I/O (bank 6) |
| Pino 65 | IO — User I/O (bank 6) |
| Pino 66 | GND — Ground |
| Pino 67 | IO — User I/O (bank 7) |
| Pino 68 | IO — User I/O (bank 7) |
| Pino 69 | IO — User I/O (bank 7) |
| Pino 70 | IO — User I/O (bank 7) |
| Pino 71 | IO — User I/O (bank 7) |
| Pino 72 | IO — User I/O (bank 7) |
| Pino 73 | VCCIO7 — I/O bank 7 supply |
| Pino 74 | IO — User I/O (bank 7) |
| Pino 75 | IO — User I/O (bank 7) |
| Pino 76 | IO — User I/O (bank 7) |
| Pino 77 | GND — Ground |
| Pino 78 | IO — User I/O (bank 8) |
| Pino 79 | IO — User I/O (bank 8) |
| Pino 80 | IO — User I/O (bank 8) |
| Pino 81 | IO — User I/O (bank 8) |
| Pino 82 | IO — User I/O (bank 8) |
| Pino 83 | IO — User I/O (bank 8) |
| Pino 84 | VCCIO8 — I/O bank 8 supply |
| Pino 85 | IO — User I/O (bank 8) |
| Pino 86 | IO — User I/O (bank 8) |
| Pino 87 | IO — User I/O (bank 8) |
| Pino 88 | GND — Ground |
| Pino 89 | TMS — JTAG test mode select |
| Pino 90 | TCK — JTAG test clock |
| Pino 91 | TDO — JTAG test data out |
| Pino 92 | TDI — JTAG test data in |
| Pino 93 | nCONFIG — Configuration active-low reset |
| Pino 94 | nSTATUS — Configuration status |
| Pino 95 | CONF_DONE — Configuration done |
| Pino 96 | DCLK — Configuration clock |
| Pino 97 | DATA0 — Configuration data |
| Pino 98 | VCC — Core supply (single-supply variant) |
| Pino 99 | VCC — Core supply (single-supply variant) |
| Pino 100 | GND — Ground |
| Pino 101 | GND — Ground |
| Pino 102 | IO — User I/O |
| Pino 103 | IO — User I/O |
| Pino 104 | IO — User I/O |
| Pino 105 | IO — User I/O |
| Pino 106 | IO — User I/O |
| Pino 107 | IO — User I/O |
| Pino 108 | VCCIO — I/O supply |
| Pino 109 | IO — User I/O |
| Pino 110 | IO — User I/O |
| Pino 111 | IO — User I/O |
| Pino 112 | GND — Ground |
| Pino 113 | IO — User I/O |
| Pino 114 | IO — User I/O |
| Pino 115 | IO — User I/O |
| Pino 116 | IO — User I/O |
| Pino 117 | IO — User I/O |
| Pino 118 | IO — User I/O |
| Pino 119 | VCCIO — I/O supply |
| Pino 120 | IO — User I/O |
| Pino 121 | IO — User I/O |
| Pino 122 | IO — User I/O |
| Pino 123 | GND — Ground |
| Pino 124 | IO — User I/O |
| Pino 125 | IO — User I/O |
| Pino 126 | IO — User I/O |
| Pino 127 | IO — User I/O |
| Pino 128 | IO — User I/O |
| Pino 129 | IO — User I/O |
| Pino 130 | VCCIO — I/O supply |
| Pino 131 | IO — User I/O |
| Pino 132 | IO — User I/O |
| Pino 133 | IO — User I/O |
| Pino 134 | GND — Ground |
| Pino 135 | IO — User I/O |
| Pino 136 | IO — User I/O |
| Pino 137 | IO — User I/O |
| Pino 138 | IO — User I/O |
| Pino 139 | IO — User I/O |
| Pino 140 | IO — User I/O |
| Pino 141 | VCCIO — I/O supply |
| Pino 142 | IO — User I/O |
| Pino 143 | IO — User I/O |
| Pino 144 | GND — Ground (and EPAD thermal pad) |
Aplicações típicas
10M16SCE144A7G é adequado para 6 aplicaçãos: Industrial I/O Expansion and Glue Logic, Automotive Body and Chassis Electronics, Motor Control and Inverter Front-Ends, Video Bridging and Display Formatting, System Management and Sequencing, Low-Volume Prototyping of ASIC Glue Logic.
Industrial I/O Expansion and Glue Logic
The 10M16SCE144A7G's 16K LE and 1000 LABs make it a strong fit for industrial I/O expansion modules that aggregate sensors, push-buttons, and field-bus interfaces. With up to 101 user I/O on the EQFP-144 footprint, designers can fan out SPI, I2C, UART, and GPIO buses from a host MCU without paying for a larger FPGA. The on-die configuration flash boots the device instantly at power-up, eliminating the external PROM cost and board area that an SRAM-based FPGA would require. Compared with a discrete CPLD approach, the MAX 10's embedded 18x18 multipliers (45 total) and 562 Kb block RAM also let designers add simple DSP (filtering, PWM generation) and buffering on the same chip. For industrial PLC backplanes and modular I/O cards, this combination of density, I/O count, and single-supply operation is the primary value proposition.
Recomendado
Automotive Body and Chassis Electronics
The -A7 automotive temperature grade (-40C to +125C) qualifies the 10M16SCE144A7G for under-hood and cabin body controllers in vehicles. Typical roles include body control modules (BCMs) that drive lighting, mirror, and seat-position actuators, plus chassis sub-systems such as seatbelt pretensioner logic and HVAC damper control. The 16K LE comfortably fits state-machine-based actuator control plus LIN/CAN bus bridging, while the embedded flash avoids the cold-boot latency of SRAM FPGAs - critical when an ECU must respond within milliseconds of ignition. Engineers targeting ASIL-rated functions should add a watchdog MCU, but for QM-grade body and chassis tasks the MAX 10 is widely deployed.
Recomendado
Motor Control and Inverter Front-Ends
Field-oriented control (FOC) loops for small BLDC and PMSM motors fit comfortably within the 10M16SCE144A7G's 45 embedded 18x18 multipliers and 1000 LABs. Designers implement the current-loop math (Clarke/Park transforms, inverse Park, SVPWM) on the FPGA fabric while a companion MCU handles the slower speed/torque loop and the user interface. The MAX 10's exposed thermal pad (EQFP-144) aids heat extraction when the device runs at high toggle rates near full utilization. Single-supply operation simplifies the power tree - only 3.3 V is needed - which is helpful in space-constrained motor-drive PCBs that already host high-voltage stages. The 450 MHz internal clock is more than sufficient for the kHz-range PWM update rates used in motor control.
Recomendado
Video Bridging and Display Formatting
The 10M16SCE144A7G's 562 Kb of embedded block RAM is enough to line-buffer small video frames, and its high I/O count supports LVDS / RGB / MIPI-style bridging at low resolutions. Designers use the MAX 10 to convert between display interfaces (e.g. RGB888 to LVDS, or MIPI-DSI to parallel RGB) inside industrial HMIs and aftermarket infotainment head units. The non-volatile boot means the bridge firmware is live within microseconds of power-up - a noticeable improvement over SRAM FPGAs that may take tens of milliseconds to configure. For resolutions above 720p, designers typically step up to a larger MAX 10 density or a Cyclone IV/V device, but for small LCDs and segment displays the 10M16 hits a sweet spot.
Recomendado
System Management and Sequencing
System-management tasks on larger boards - power rail sequencing, watchdog supervision, LED control, and slow-speed GPIO aggregation - map naturally onto the 10M16SCE144A7G. With 16K LE, the device has more than enough headroom for arbitrarily complex state machines and I2C/SPI slaves that monitor and control board health. The on-die flash lets the FPGA assert its output rails within microseconds of power-up, which is essential when sequencing supplies for an application processor. Designers often co-locate the MAX 10 with the main SoC to handle glue logic that does not fit comfortably into the SoC's pin-mux options, while keeping the BOM cost much lower than an ASIC.
Recomendado
Low-Volume Prototyping of ASIC Glue Logic
When a design originally targeted a small ASIC but volume does not justify NRE, the 10M16SCE144A7G offers a near-ASIC integration path. 16K LE accommodates complex proprietary bus interfaces, custom peripherals, and board-level state machines that would otherwise force a second supporting CPLD or ASIC. The EQFP-144 package is hand-solderable for prototypes and low-volume production, and the same Quartus Prime toolchain used for development can target higher-density MAX 10 devices if the design grows. For series production below roughly 50k units/year, this MAX 10 density is often more cost-effective than a masked ASIC.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10M16SCE144A7G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10M16SAE144C8G | 10M16SAE144C7G | 10M08SCE144A7G | 10M04SCE144A7G | 10M16SFE144C7G |
|---|---|---|---|---|---|---|
| Package | EQFP-144 (144-LQFP Exposed Pad) | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 16,000 | 16,000 | 16,000 | 8,000 (-50%) | 4,000 (-75%) | 16,000 |
| Embedded Memory (Kb) | 562 | 562 | 562 | 378 (-33%) | 189 (-66%) | 562 |
| Speed Grade | -7 (A7) | -8 (C8, faster) | -7 (C7) | -7 (A7, same) | -7 (A7, same) | -7 (C7) |
| Temperature Grade | Automotive -40C to +125C | Commercial 0C to +85C | Commercial 0C to +85C | Automotive (same) | Automotive (same) | Commercial 0C to +85C |
| Supply Variant | Single-supply (S) | Single-supply (S) | Single-supply (S) | Single-supply (S) | Single-supply (S) | Dual-supply (D, requires separate core rail) |
| Maximum User I/O | 101 | 101 | 101 | 101 (same pinout) | 101 (same pinout) | 101 |
| Approx Unit Price (qty 1) | $38.50 | $40-45 | $35-40 | $20-25 | $12-18 | $35-42 |
Principais diferenciais
- On-die non-volatile configuration flash (vs 10M16SCE144A7G vs SRAM-based FPGAs (Cyclone IV E))
- Single-supply operation (vs 10M16SCE144A7G (single-supply) vs 10M16DCE144 (dual-supply))
- Automotive temperature grade at the slowest speed grade (vs 10M16SCE144A7G vs 10M16SAE144C8G)
Notas de projeto
The single-supply 'S' variant of the 10M16SCE144A7G requires only one 3.0/3.3 V rail for both core and I/O. Decouple each VCCIO bank pin with a 100 nF ceramic cap placed within 5 mm of the pin, and add a bulk 10 uF tantalum or polymer cap per bank. Tie all GND pins to a solid ground plane; the exposed thermal pad (EPAD) must be soldered to a thermal via array for heat extraction at high toggle rates.
Estimated: at full logic utilization (~80%) with all I/O toggling at 100 MHz in still air, the EQFP-144 package dissipates approximately 0.5-1.0 W. Solder the EPAD to a 4x4 via array (0.3 mm drill, 0.5 mm pitch) tied to the inner ground plane. Without EPAD soldering, junction temperature can rise above the 125 C automotive limit during continuous operation.
Route JTAG (TMS/TCK/TDO/TDI) as a daisy-chain with 10 kohm pull-ups on TMS and TDI. Use 4-layer PCB stack-up with continuous ground beneath the device for signal integrity and SSN reduction. The 0.5 mm LQFP pitch requires 0.2 mm traces and 0.2 mm spaces; escape routing on inner layers with microvias is acceptable but not required at 100 MHz toggle rates.
Do not assume the 10M16SCE144A7G (single-supply) can be replaced pin-for-pin by a 10M16DF prefix (dual-supply) variant. The dual-supply variants require a separate VCCINT and VCCIO rail; if the board only routes 3.3 V, the dual-supply part will not power the core. Always verify the 'S' vs 'D' supply prefix in the OPN before placing the order.
Informações de conformidade
RoHS compliant per datasheet.com listing ('ROHS COMPLIANT, PLASTIC, EQFP-144'). The -A7 suffix denotes the automotive temperature grade per Intel/Altera MAX 10 ordering code conventions, but AEC-Q100 qualification status is not separately listed in the provided data and should be confirmed with Intel FAE for safety-critical automotive deployments.
