2VM3358 - Versal Prime Gen 2 Adaptive SoC | AMD
N.º da peça: 2VM3358 ✓ Ativo| Qtd. | Preço unitário | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
2VM3358 Visão geral
An adaptive SoC (System-on-Chip) is a heterogeneous computing device that combines programmable logic (FPGA fabric) with hardened processing subsystems, including application processors, real-time processors, and various I/O interfaces. In the Versal architecture, the scalar engines (Cortex-A78AE and Cortex-R52) handle general-purpose and real-time processing, while the programmable logic provides custom hardware acceleration. This hierarchy enables a single device to replace multiple discrete components, reducing system complexity and power consumption.
Key features of the 2VM3358 include 8 Arm Cortex-A78AE application cores for high-performance Linux or RTOS applications, 10 Cortex-R52 real-time cores for deterministic, low-latency control tasks, and the Versal adaptive architecture that allows hardware acceleration to be tailored to specific workloads. The device supports up to 10x scalar compute performance versus prior generations, enabling advanced AI, signal processing, and control applications in a single chip.
Technically, the 2VM3358 leverages AMD's advanced process technology and the Versal platform's integrated design tools, including Vitis and Vivado. The device's heterogeneous architecture allows developers to partition workloads between scalar processing, programmable logic, and dedicated AI engines (if present in the specific variant). The SFVA1089 package provides a high-density interconnect, supporting high-speed transceivers and memory interfaces for system-level integration.
Typical applications for the 2VM3358 include avionics, factory automation, building automation, grid infrastructure, and other industrial or aerospace systems requiring high compute density and real-time responsiveness. The device's combination of scalar performance and programmable logic makes it suitable for edge computing, machine vision, and motor control applications.
When designing with the 2VM3358, consider the power consumption of the smallest system configuration, as documented in AMD's support forums. Proper thermal management and power supply design are critical due to the device's high performance and integration level. The SFVA1089 package requires careful PCB layout to manage signal integrity and power distribution.
Alternativas drop-in para 2VM3358 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 2VM3358 (mesmo formato e footprint) — diferindo em Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
2VM3558
✅ Drop-In✓ Em estoque
$900 / unidade
Ver ficha técnica →2VM3858
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
2VM3358 Classificações máximas e características elétricas
| Application Cores | 8x Arm Cortex-A78AE |
| Real-Time Cores | 10x Arm Cortex-R52 |
| Scalar Compute Performance | Up to 10x vs previous Versal/Zynq UltraScale+ |
| Encapsulamento | SFVA1089 |
| Series | Versal Prime Series Gen 2 |
| Device Family | 2VM3358, 2VM3558, 2VM3858 |
Guia de Configuração de Pinos do 2VM3358 sfva1089
Configuração de pinos para 2VM3358 (pacote sfva1089). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 2VM3358.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
2VM3358 é adequado para 6 aplicaçãos: Avionics, Factory Automation, Building Automation, Grid Infrastructure, Edge Computing, Machine Vision.
Avionics
The 2VM3358 is designed for avionics applications, offering 8 Arm Cortex-A78AE cores for high-performance processing and 10 Cortex-R52 cores for real-time control. Its 10x scalar compute improvement enables advanced flight management, sensor fusion, and display processing. The device's heterogeneous architecture allows hardware acceleration of critical algorithms, reducing latency and power consumption. Designers can partition safety-critical and non-critical functions across the cores, ensuring deterministic behavior. The SFVA1089 package supports high-speed data interfaces needed for avionics data buses. This makes the 2VM3358 a compelling choice for next-generation avionics platforms.
Recomendado
Factory Automation
The 2VM3358 excels in factory automation, providing 8 Cortex-A78AE cores for HMI, vision, and communication, and 10 Cortex-R52 cores for deterministic motion control and I/O handling. The programmable logic enables custom industrial protocols and real-time Ethernet interfaces. Its 10x scalar compute allows advanced machine learning inference at the edge, improving quality inspection and predictive maintenance. The device supports multiple industrial communication standards, reducing BOM complexity. Designers can implement safety functions in the real-time cores, meeting functional safety requirements. The SFVA1089 package provides ample I/O for sensors and actuators, making it ideal for modern smart factories.
Recomendado
Building Automation
The 2VM3358 is well-suited for building automation, offering high compute density for centralized control of HVAC, lighting, and security systems. Its 8 Cortex-A78AE cores can run complex building management software, while the 10 Cortex-R52 cores handle real-time sensor and actuator control. The programmable logic allows integration of custom communication protocols like BACnet or KNX. The device's 10x scalar compute enables advanced energy optimization algorithms, reducing operational costs. Its heterogeneous architecture supports edge computing, reducing reliance on cloud services. The SFVA1089 package provides connectivity for numerous building subsystems, making it a versatile platform for smart buildings.
Recomendado
Grid Infrastructure
The 2VM3358 is ideal for grid infrastructure, providing 8 Cortex-A78AE cores for grid monitoring and analytics, and 10 Cortex-R52 cores for real-time protection and control. Its 10x scalar compute enables advanced phasor measurement and fault detection algorithms. The programmable logic supports custom communication protocols like IEC 61850, ensuring interoperability. The device's high performance allows real-time power quality analysis and predictive maintenance. Its heterogeneous architecture enables hardware acceleration of signal processing, reducing latency. The SFVA1089 package supports high-speed ADCs and communication interfaces, making it suitable for smart grid applications.
Recomendado
Edge Computing
The 2VM3358 is a powerful edge computing platform, combining 8 Cortex-A78AE cores for general-purpose processing and 10 Cortex-R52 cores for real-time tasks. Its 10x scalar compute enables on-device AI inference, reducing latency and bandwidth requirements. The programmable logic allows custom accelerators for specific workloads, improving efficiency. The device supports multiple operating systems, including Linux and RTOS, providing flexibility. Its high performance makes it suitable for edge servers, industrial PCs, and autonomous systems. The SFVA1089 package provides high-speed connectivity for networking and storage, enabling robust edge solutions.
Recomendado
Machine Vision
The 2VM3358 is excellent for machine vision, offering 8 Cortex-A78AE cores for image processing and AI, and 10 Cortex-R52 cores for real-time camera control. Its 10x scalar compute enables advanced deep learning models for object detection and classification. The programmable logic allows custom image processing pipelines, reducing latency. The device supports multiple camera interfaces, including MIPI and GigE Vision. Its high performance enables real-time video analytics at the edge. The SFVA1089 package provides sufficient I/O for multiple cameras and displays, making it ideal for industrial inspection and autonomous vehicles.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 2VM3358 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 2VM3558 | 2VM3858 |
|---|---|---|---|
| Package | SFVA1089 | SFVA1089 | SFVA1089 |
| Brand | AMD | AMD | AMD |
| Application Cores | 8x Cortex-A78AE | 8x Cortex-A78AE | 8x Cortex-A78AE |
| Real-Time Cores | 10x Cortex-R52 | 10x Cortex-R52 | 10x Cortex-R52 |
| Scalar Compute | Up to 10x vs previous gen | Up to 10x vs previous gen | Up to 10x vs previous gen |
| Series | Versal Prime Gen 2 | Versal Prime Gen 2 | Versal Prime Gen 2 |
| Target Applications | Avionics, factory automation, grid | Avionics, factory automation, grid | Avionics, factory automation, grid |
Principais diferenciais
- 10x scalar compute performance (vs Previous Versal/Zynq UltraScale+)
- 8 Cortex-A78AE + 10 Cortex-R52 cores (vs 2VM3558/2VM3858)
- Versal Prime Gen 2 architecture (vs Competitor adaptive SoCs)
Notas de projeto
The 2VM3358 is a high-performance adaptive SoC with significant power requirements. According to AMD support forums, the power consumption of the smallest system configuration is a key design consideration. Use a robust power supply design with multiple voltage rails, and consider using power modules from vendors like Monolithic Power Systems for efficient power delivery. Ensure adequate decoupling capacitors near the device's power pins to maintain signal integrity.
Given the 2VM3358's high compute performance, thermal management is critical. The SFVA1089 package requires a proper heatsink and airflow design to dissipate heat effectively. Calculate the thermal budget based on your application's power consumption and ambient temperature. Consider using thermal vias and a copper pour on the PCB to enhance heat spreading. For avionics or industrial applications, ensure the thermal solution meets the operating temperature range requirements.
The SFVA1089 package has a high pin count and requires careful PCB layout. Follow AMD's layout guidelines for high-speed interfaces, including impedance control and length matching for DDR and transceiver signals. Use a multi-layer PCB with dedicated power and ground planes. Refer to the AM013 Versal Adaptive SoC Packaging and Pinouts Architecture Manual for mechanical drawings and pinout details. Proper decoupling and power integrity are essential for reliable operation.
Informações de conformidade
Compliance information not available in the provided data. Contact AMD for RoHS/REACH status.
