2VM3358 - Versal Prime Gen 2 Adaptive SoC | AMD
MPN: 2VM3358 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for 2VM3358 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
2VM3558
✅ Drop-In✓ In Stock
$900 / Unit
View Datasheet →2VM3858
✅ Drop-In📋 Reference alternative (not in catalog)
2VM3358 Maximum Ratings & Electrical Characteristics
| Application Cores | 8x Arm Cortex-A78AE |
| Real-Time Cores | 10x Arm Cortex-R52 |
| Scalar Compute Performance | Up to 10x vs previous Versal/Zynq UltraScale+ |
| Package | SFVA1089 |
| Series | Versal Prime Series Gen 2 |
| Device Family | 2VM3358, 2VM3558, 2VM3858 |
| Process Technology | [DATA_NEEDED: process node] |
| Programmable Logic Cells | [DATA_NEEDED: logic cells] |
| DSP Engines | [DATA_NEEDED: DSP engines] |
| AI Engines | [DATA_NEEDED: AI engines] |
| Maximum Clock Frequency | [DATA_NEEDED: max clock frequency] |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] |
| Power Consumption (Smallest System) | [DATA_NEEDED: power consumption] |
| High-Speed Transceivers | [DATA_NEEDED: transceiver count] |
| Memory Interfaces | [DATA_NEEDED: memory interface types] |
| I/O Count | [DATA_NEEDED: I/O count] |
| RoHS Status | [DATA_NEEDED: RoHS status] |
2VM3358 sfva1089 Pin Configuration Guide
Complete pinout information for 2VM3358 (sfva1089 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 2VM3358.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
2VM3358 is suitable for 6 applications: Avionics, Factory Automation, Building Automation, Grid Infrastructure, Edge Computing, Machine Vision.
Avionics
The 2VM3358 is designed for avionics applications, offering 8 Arm Cortex-A78AE cores for high-performance processing and 10 Cortex-R52 cores for real-time control. Its 10x scalar compute improvement enables advanced flight management, sensor fusion, and display processing. The device's heterogeneous architecture allows hardware acceleration of critical algorithms, reducing latency and power consumption. Designers can partition safety-critical and non-critical functions across the cores, ensuring deterministic behavior. The SFVA1089 package supports high-speed data interfaces needed for avionics data buses. This makes the 2VM3358 a compelling choice for next-generation avionics platforms.
Recommended
Factory Automation
The 2VM3358 excels in factory automation, providing 8 Cortex-A78AE cores for HMI, vision, and communication, and 10 Cortex-R52 cores for deterministic motion control and I/O handling. The programmable logic enables custom industrial protocols and real-time Ethernet interfaces. Its 10x scalar compute allows advanced machine learning inference at the edge, improving quality inspection and predictive maintenance. The device supports multiple industrial communication standards, reducing BOM complexity. Designers can implement safety functions in the real-time cores, meeting functional safety requirements. The SFVA1089 package provides ample I/O for sensors and actuators, making it ideal for modern smart factories.
Recommended
Building Automation
The 2VM3358 is well-suited for building automation, offering high compute density for centralized control of HVAC, lighting, and security systems. Its 8 Cortex-A78AE cores can run complex building management software, while the 10 Cortex-R52 cores handle real-time sensor and actuator control. The programmable logic allows integration of custom communication protocols like BACnet or KNX. The device's 10x scalar compute enables advanced energy optimization algorithms, reducing operational costs. Its heterogeneous architecture supports edge computing, reducing reliance on cloud services. The SFVA1089 package provides connectivity for numerous building subsystems, making it a versatile platform for smart buildings.
Recommended
Grid Infrastructure
The 2VM3358 is ideal for grid infrastructure, providing 8 Cortex-A78AE cores for grid monitoring and analytics, and 10 Cortex-R52 cores for real-time protection and control. Its 10x scalar compute enables advanced phasor measurement and fault detection algorithms. The programmable logic supports custom communication protocols like IEC 61850, ensuring interoperability. The device's high performance allows real-time power quality analysis and predictive maintenance. Its heterogeneous architecture enables hardware acceleration of signal processing, reducing latency. The SFVA1089 package supports high-speed ADCs and communication interfaces, making it suitable for smart grid applications.
Recommended
Edge Computing
The 2VM3358 is a powerful edge computing platform, combining 8 Cortex-A78AE cores for general-purpose processing and 10 Cortex-R52 cores for real-time tasks. Its 10x scalar compute enables on-device AI inference, reducing latency and bandwidth requirements. The programmable logic allows custom accelerators for specific workloads, improving efficiency. The device supports multiple operating systems, including Linux and RTOS, providing flexibility. Its high performance makes it suitable for edge servers, industrial PCs, and autonomous systems. The SFVA1089 package provides high-speed connectivity for networking and storage, enabling robust edge solutions.
Recommended
Machine Vision
The 2VM3358 is excellent for machine vision, offering 8 Cortex-A78AE cores for image processing and AI, and 10 Cortex-R52 cores for real-time camera control. Its 10x scalar compute enables advanced deep learning models for object detection and classification. The programmable logic allows custom image processing pipelines, reducing latency. The device supports multiple camera interfaces, including MIPI and GigE Vision. Its high performance enables real-time video analytics at the edge. The SFVA1089 package provides sufficient I/O for multiple cameras and displays, making it ideal for industrial inspection and autonomous vehicles.
Recommended
Recommended Products Summary
Engineering reference data for 2VM3358 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 2VM3558 | 2VM3858 |
|---|---|---|---|
| Package | SFVA1089 | SFVA1089 | SFVA1089 |
| Brand | AMD | AMD | AMD |
| Application Cores | 8x Cortex-A78AE | 8x Cortex-A78AE | 8x Cortex-A78AE |
| Real-Time Cores | 10x Cortex-R52 | 10x Cortex-R52 | 10x Cortex-R52 |
| Scalar Compute | Up to 10x vs previous gen | Up to 10x vs previous gen | Up to 10x vs previous gen |
| Series | Versal Prime Gen 2 | Versal Prime Gen 2 | Versal Prime Gen 2 |
| Programmable Logic | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Target Applications | Avionics, factory automation, grid | Avionics, factory automation, grid | Avionics, factory automation, grid |
Key Differentiators
- 10x scalar compute performance (vs Previous Versal/Zynq UltraScale+)
- 8 Cortex-A78AE + 10 Cortex-R52 cores (vs 2VM3558/2VM3858)
- Versal Prime Gen 2 architecture (vs Competitor adaptive SoCs)
Design Notes
The 2VM3358 is a high-performance adaptive SoC with significant power requirements. According to AMD support forums, the power consumption of the smallest system configuration is a key design consideration. Use a robust power supply design with multiple voltage rails, and consider using power modules from vendors like Monolithic Power Systems for efficient power delivery. Ensure adequate decoupling capacitors near the device's power pins to maintain signal integrity.
Given the 2VM3358's high compute performance, thermal management is critical. The SFVA1089 package requires a proper heatsink and airflow design to dissipate heat effectively. Calculate the thermal budget based on your application's power consumption and ambient temperature. Consider using thermal vias and a copper pour on the PCB to enhance heat spreading. For avionics or industrial applications, ensure the thermal solution meets the operating temperature range requirements.
The SFVA1089 package has a high pin count and requires careful PCB layout. Follow AMD's layout guidelines for high-speed interfaces, including impedance control and length matching for DDR and transceiver signals. Use a multi-layer PCB with dedicated power and ground planes. Refer to the AM013 Versal Adaptive SoC Packaging and Pinouts Architecture Manual for mechanical drawings and pinout details. Proper decoupling and power integrity are essential for reliable operation.
Compliance Information
Compliance information not available in the provided data. Contact AMD for RoHS/REACH status.