A3P250-FGG144 - 250K Gate ProASIC3 FPGA | Microchip
N.º da peça: A3P250-FGG144 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
A3P250-FGG144 Visão geral
A field-programmable gate array is a programmable digital semiconductor. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacture to implement combinational and sequential logic. An FPGA sits in the broader hierarchy of programmable logic devices and embedded semiconductors, enabling design changes without replacing the physical IC when logic requirements evolve.
The verified data identifies the A3P250-FGG144 as a ProASIC3 device and separately reports 250,000 gates, 97 I/O, and a 144-LBGA package. The related A3P250 family page describes ProASIC3 devices as reprogrammable, low-density FPGAs with small-footprint packages and advanced features. These attributes make the device relevant to industrial control, communications, consumer electronics, and embedded interface designs, subject to the specific electrical, timing, and tool requirements that must be checked in the manufacturer documentation.
The FGG144 package is a fine-pitch ball-grid-array package suitable for dense PCB layouts. Package-level design work should account for ball pitch, escape routing, power and ground distribution, decoupling, programming access, and thermal performance. The exact pin names, voltage ratings, timing grades, and programming interface details were not included in the supplied verified data and therefore are marked as data needed rather than inferred.
Typical design considerations include validating the clock and reset architecture, confirming that all external interfaces fit within 97 available I/O, planning deterministic programming and configuration behavior, and reviewing the manufacturer’s package and timing documentation before layout release. The device should not be treated as a universal cross-brand replacement without verifying pinout, voltage, timing, configuration memory, and software-tool compatibility.
This page consolidates verified distributor and manufacturer information with sourcing questions and design guidance. It is intended to support initial component selection, not to replace the complete A3P250 family datasheet, package drawing, timing specification, or configuration-tool documentation.
Alternativas drop-in para A3P250-FGG144 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P250-FGG144 (mesmo formato e footprint) — diferindo em Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P250-FGG144I
✅ Drop-In✓ Em estoque
$14.06 / unidade
Ver ficha técnica →A3P250-FGG144T
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P250-FGG144
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →A3P250L-1FG144
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P250L-FG144I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P250-FGG144 Classificações máximas e características elétricas
| Device Type | ProASIC3 Field Programmable Gate Array (FPGA) IC |
| Logic Capacity | 250,000 gates |
| I/O Count | 97 I/O |
| Encapsulamento | 144-LBGA |
| Package Family | FBGA-144 |
| Related Listed Package Dimensions | 13 mm x 13 mm, 1.45 mm height, 1 mm pitch |
| FPGA Family | ProASIC3 |
| Programmability | Reprogrammable |
| Technology | CMOS |
| Related Listed Speed | 350 MHz |
| Related Listed CLBs | 6,144 CLBs |
| Estilo de montagem | Surface Mount |
Guia de Configuração de Pinos do A3P250-FGG144 13 mm x 13 mm, 1.45 mm height, 1 mm pitch
Configuração de pinos para A3P250-FGG144 (pacote 13 mm x 13 mm, 1.45 mm height, 1 mm pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3P250-FGG144.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3P250-FGG144 é adequado para 7 aplicaçãos: Industrial Control Logic, Communications Interface, Embedded Instrumentation, Consumer Electronics Control, Programmable Signal Conditioning, Programmable I/O Hub, Aerospace and Defense Prototyping.
Industrial Control Logic
The A3P250-FGG144 fits programmable control blocks that require 250,000 gates and 97 I/O in a compact 144-LBGA package. It can combine sequencing, state-machine, interface, and control functions in one FPGA rather than relying on several fixed-function devices. The verified package identification supports high-density PCB placement, but the final design must confirm voltage, timing, temperature, and pin-assignment requirements. Use the manufacturer A3P250 documentation to define clocking, reset, I/O standards, and configuration behavior before releasing the schematic and layout.
Recomendado
Communications Interface
The ProASIC3 FPGA can be used to implement programmable communications interfaces, protocol converters, framing logic, and test instrumentation functions. Its verified 97-I/O count provides a defined external connectivity budget for the 144-LBGA device, while the 250,000-gate capacity allows moderate parallel datapaths and control logic to share one package. The supplied evidence does not specify I/O voltage standards, supported interfaces, or timing grades, so those parameters must be checked before selecting termination, level-shifting, and clocking schemes.
Recomendado
Embedded Instrumentation
A3P250-FGG144 is suitable for programmable measurement and instrumentation front ends when a design needs flexible logic near the sensor or stimulus interface. The 250,000-gate resource can support control sequencing, digital filtering, calibration tables, and communication formatting, while 97 I/O can expose sensors, clocks, and status signals. Because the supplied data does not define analog performance, I/O standards, or operating temperature, analog front-end design should be treated as a separate engineering task and validated with the exact package and timing documentation.
Recomendado
Consumer Electronics Control
The reprogrammable ProASIC3 architecture can support consumer products that benefit from flexible logic, configuration updates, and compact integration. A3P250-FGG144 provides 250,000 gates and 97 I/O in a 144-LBGA package, making it a candidate for keypad control, display sequencing, peripheral arbitration, or custom interface logic. Commercial suitability depends on verified operating-temperature, lifecycle, cost, and supply information that is not present in the supplied data. Confirm programming support and product availability before committing to a high-volume consumer design.
Recomendado
Programmable Signal Conditioning
The A3P250-FGG144 can be evaluated for digital signal-conditioning, timing, trigger, and data-path functions that are more naturally implemented as programmable logic than as fixed circuitry. Its 250,000-gate capacity and 97 I/O provide resources for parallel channels, data registers, counters, and control state machines. The part should be evaluated against the required clock rate and I/O timing rather than the related 350 MHz listing alone. Board design must include controlled clock distribution, return paths, decoupling, and configuration access for reliable operation.
Recomendado
Programmable I/O Hub
The ProASIC3 FPGA is a candidate for consolidating digital routing, expansion, and peripheral-control functions around a microcontroller or processor. With 97 I/O and 250,000 gates, the device can provide address decoding, arbitration, latch logic, status aggregation, and custom interface mapping while preserving reprogrammability. Actual deployment requires confirmation of which balls are user I/O, which are power or configuration pins, and the supported I/O voltage ranges. Those details are not supplied here and must be checked against the exact 144-LBGA package documentation.
Recomendado
Aerospace and Defense Prototyping
A reprogrammable FPGA can be useful in aerospace and defense prototypes where logic requirements are evolving and a compact programmable implementation is valuable. The supplied evidence confirms the A3P250-FGG144 identity, 250,000 gates, 97 I/O, and 144-LBGA package, but it does not provide radiation, qualification, temperature, or lifecycle data. The device must not be treated as qualified for flight, defense, or safety-critical use without the appropriate manufacturer and system-level approvals. Review the exact ordering code, package construction, environmental ratings, and procurement documentation first.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P250-FGG144 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P250-FGG144I | A3P250-FGG144T | A3P250-FGG144 | A3P250L-1FG144 | A3P250L-FG144I |
|---|---|---|---|---|---|---|
| Package | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| FPGA Family | ProASIC3 | Related ProASIC3 listing | ProASIC3 | ProASIC3 | Related A3P250 listing | Related A3P250 listing |
| Pricing | Numeric price not supplied | Price not supplied | Price not supplied | Price not supplied | Price not supplied | Price not supplied |
Principais diferenciais
- Large verified logic capacity for a compact programmable device (vs A3P250-FGG144I)
- Reprogrammable ProASIC3 architecture (vs A3P250-FGG144T)
- High-density 144-LBGA package option (vs A3P250L-1FG144)
Notas de projeto
Before layout, obtain the exact 144-LBGA package drawing and ball map for A3P250-FGG144. Treat the verified 144-LBGA package identification as confirmed, but do not derive pin assignments from a related family listing. Reserve clean power and ground planes, provide local decoupling at each supply ball group, and route high-speed clocks and configuration signals with controlled impedance and return paths.
Define clock, reset, JTAG or configuration, and external-interface routing before component placement. The supplied data confirms 97 I/O but does not identify supported I/O standards, voltage ranges, or timing constraints. Verify those details in the exact A3P250 documentation, then use series damping, appropriate level translation, and topology-controlled routing where required by the interface specification.
Do not substitute A3P250-FGG144I, A3P250-FGG144T, or A3P250L variants solely because they are related ProASIC3 listings. Check ordering suffix meaning, speed grade, temperature grade, voltage, package ball map, configuration method, and toolchain compatibility. Also confirm lifecycle status because the supplied evidence does not provide a structured active or end-of-life declaration.
Informações de conformidade
The supplied data does not provide verified compliance declarations for the exact MPN. Related comparison pages mention RoHS and REACH topics, but those statements are not treated as verified compliance evidence here.
