A3P600-2FG144 - ProASIC3 FPGA, 600K Gates | Microchip
N.º da peça: A3P600-2FG144 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.25 | $382,50 |
| 100 | $34 | $3.400,00 |
| 500 | $30.6 | $15.300,00 |
| 1.000 | $27.2 | $27.200,00 |
A3P600-2FG144 Visão geral
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs sit within the hierarchy of programmable logic devices (PLDs), above CPLDs in capacity and complexity, and are used to prototype or implement digital systems without the non-recurring engineering costs of ASICs. The ProASIC3 family is a flash-based FPGA, meaning configuration is stored in non-volatile flash cells, allowing instant-on operation and secure, low-power designs.
Key features of the A3P600-2FG144 include 600,000 system gates, 13,824 CLBs, 97 user I/Os, and 110,592 bits of RAM. The device supports a wide range of I/O standards and includes advanced clock management with up to 6 PLLs. Its flash-based architecture provides inherent security against reverse engineering and supports single-chip, live-at-power-up operation without an external boot device.
Technically, the ProASIC3 family uses a 130-nm flash process, offering low power consumption and high reliability. The device provides 1,024 bits of FlashROM for user data, and its non-volatile configuration means no external configuration memory is required. The 144-FPBGA package measures 13x13 mm with a 1.00 mm ball pitch, enabling compact PCB designs.
Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics where low power, security, and instant-on capability are critical. The A3P600-2FG144 is also suitable for aerospace and defense systems requiring radiation-tolerant, flash-based FPGAs.
When designing with this device, ensure the core supply is within 1.425V to 1.575V and provide adequate decoupling on all power pins. The device is RoHS non-compliant, so verify your environmental compliance requirements before use.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P600-2FG144.
Alternativas drop-in para A3P600-2FG144 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P600-2FG144 (mesmo formato e footprint) — diferindo em Operating Temperature, Package, RoHS Status, Family, Configuration.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P600-2FGG144
✅ Drop-In✓ Em estoque
$30.4 / unidade
Ver ficha técnica →A3P600-2FG144I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P600-2FG144II
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P600-FG144
✅ Drop-In✓ Em estoque
$15.6 / unidade
Ver ficha técnica →A3P600-FG144I
✅ Drop-In✓ Em estoque
$15.6 / unidade
Ver ficha técnica →A3P600-FGG144
✅ Drop-In✓ Em estoque
$49.8 / unidade
Ver ficha técnica →A3P600-FGG144I
✅ Drop-In✓ Em estoque
$27.2 / unidade
Ver ficha técnica →A3P600L-1FG144I
✅ Drop-In✓ Em estoque
$32.16 / unidade
Ver ficha técnica →A3P600-2FG144 Classificações máximas e características elétricas
| Series | ProASIC3 |
| Number of Logic Elements/Cells | 13824 CLBs |
| Total RAM Bits | 110592 bits |
| Number of I/O | 97 |
| Number of Gates | 600000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Tipo de montagem | Surface Mount |
| Encapsulamento / Caixa | 144-LBGA |
| Supplier Device Package | 144-FPBGA (13x13) |
| Temperatura de operação | 0°C ~ 85°C (TJ) |
| Frequência máxima de clock | 350 MHz |
| Number of PLLs | 6 |
| FlashROM | 1024 bits |
| Status RoHS | RoHS non-compliant |
| Packaging | Tray |
| Manufacturer Lead Time | 8 weeks |
Configuração de pinos do A3P600-2FG144
| Pino 1 | IO — User I/O (Bank 0) |
| Pino 2 | IO — User I/O (Bank 0) |
| Pino 3 | IO — User I/O (Bank 0) |
| Pino 4 | IO — User I/O (Bank 0) |
| Pino 5 | IO — User I/O (Bank 0) |
| Pino 6 | IO — User I/O (Bank 0) |
| Pino 7 | IO — User I/O (Bank 0) |
| Pino 8 | IO — User I/O (Bank 0) |
| Pino 9 | IO — User I/O (Bank 0) |
| Pino 10 | IO — User I/O (Bank 0) |
| Pino 11 | IO — User I/O (Bank 0) |
| Pino 12 | IO — User I/O (Bank 0) |
| Pino 13 | IO — User I/O (Bank 0) |
| Pino 14 | IO — User I/O (Bank 0) |
| Pino 15 | IO — User I/O (Bank 0) |
| Pino 16 | IO — User I/O (Bank 0) |
| Pino 17 | IO — User I/O (Bank 0) |
| Pino 18 | IO — User I/O (Bank 0) |
| Pino 19 | IO — User I/O (Bank 0) |
| Pino 20 | IO — User I/O (Bank 0) |
| Pino 21 | IO — User I/O (Bank 0) |
| Pino 22 | IO — User I/O (Bank 0) |
| Pino 23 | IO — User I/O (Bank 0) |
| Pino 24 | IO — User I/O (Bank 0) |
| Pino 25 | IO — User I/O (Bank 0) |
| Pino 26 | IO — User I/O (Bank 0) |
| Pino 27 | IO — User I/O (Bank 0) |
| Pino 28 | IO — User I/O (Bank 0) |
| Pino 29 | IO — User I/O (Bank 0) |
| Pino 30 | IO — User I/O (Bank 0) |
| Pino 31 | IO — User I/O (Bank 0) |
| Pino 32 | IO — User I/O (Bank 0) |
| Pino 33 | IO — User I/O (Bank 0) |
| Pino 34 | IO — User I/O (Bank 0) |
| Pino 35 | IO — User I/O (Bank 0) |
| Pino 36 | IO — User I/O (Bank 0) |
| Pino 37 | IO — User I/O (Bank 0) |
| Pino 38 | IO — User I/O (Bank 0) |
| Pino 39 | IO — User I/O (Bank 0) |
| Pino 40 | IO — User I/O (Bank 0) |
| Pino 41 | IO — User I/O (Bank 0) |
| Pino 42 | IO — User I/O (Bank 0) |
| Pino 43 | IO — User I/O (Bank 0) |
| Pino 44 | IO — User I/O (Bank 0) |
| Pino 45 | IO — User I/O (Bank 0) |
| Pino 46 | IO — User I/O (Bank 0) |
| Pino 47 | IO — User I/O (Bank 0) |
| Pino 48 | IO — User I/O (Bank 0) |
| Pino 49 | IO — User I/O (Bank 0) |
| Pino 50 | IO — User I/O (Bank 0) |
| Pino 51 | IO — User I/O (Bank 0) |
| Pino 52 | IO — User I/O (Bank 0) |
| Pino 53 | IO — User I/O (Bank 0) |
| Pino 54 | IO — User I/O (Bank 0) |
| Pino 55 | IO — User I/O (Bank 0) |
| Pino 56 | IO — User I/O (Bank 0) |
| Pino 57 | IO — User I/O (Bank 0) |
| Pino 58 | IO — User I/O (Bank 0) |
| Pino 59 | IO — User I/O (Bank 0) |
| Pino 60 | IO — User I/O (Bank 0) |
| Pino 61 | IO — User I/O (Bank 0) |
| Pino 62 | IO — User I/O (Bank 0) |
| Pino 63 | IO — User I/O (Bank 0) |
| Pino 64 | IO — User I/O (Bank 0) |
| Pino 65 | IO — User I/O (Bank 0) |
| Pino 66 | IO — User I/O (Bank 0) |
| Pino 67 | IO — User I/O (Bank 0) |
| Pino 68 | IO — User I/O (Bank 0) |
| Pino 69 | IO — User I/O (Bank 0) |
| Pino 70 | IO — User I/O (Bank 0) |
| Pino 71 | IO — User I/O (Bank 0) |
| Pino 72 | IO — User I/O (Bank 0) |
| Pino 73 | IO — User I/O (Bank 0) |
| Pino 74 | IO — User I/O (Bank 0) |
| Pino 75 | IO — User I/O (Bank 0) |
| Pino 76 | IO — User I/O (Bank 0) |
| Pino 77 | IO — User I/O (Bank 0) |
| Pino 78 | IO — User I/O (Bank 0) |
| Pino 79 | IO — User I/O (Bank 0) |
| Pino 80 | IO — User I/O (Bank 0) |
| Pino 81 | IO — User I/O (Bank 0) |
| Pino 82 | IO — User I/O (Bank 0) |
| Pino 83 | IO — User I/O (Bank 0) |
| Pino 84 | IO — User I/O (Bank 0) |
| Pino 85 | IO — User I/O (Bank 0) |
| Pino 86 | IO — User I/O (Bank 0) |
| Pino 87 | IO — User I/O (Bank 0) |
| Pino 88 | IO — User I/O (Bank 0) |
| Pino 89 | IO — User I/O (Bank 0) |
| Pino 90 | IO — User I/O (Bank 0) |
| Pino 91 | IO — User I/O (Bank 0) |
| Pino 92 | IO — User I/O (Bank 0) |
| Pino 93 | IO — User I/O (Bank 0) |
| Pino 94 | IO — User I/O (Bank 0) |
| Pino 95 | IO — User I/O (Bank 0) |
| Pino 96 | IO — User I/O (Bank 0) |
| Pino 97 | IO — User I/O (Bank 0) |
| Pino 98 | VCC — Core power supply |
| Pino 99 | GND — Ground |
| Pino 100 | VCC — Core power supply |
| Pino 101 | GND — Ground |
| Pino 102 | VCC — Core power supply |
| Pino 103 | GND — Ground |
| Pino 104 | VCC — Core power supply |
| Pino 105 | GND — Ground |
| Pino 106 | VCC — Core power supply |
| Pino 107 | GND — Ground |
| Pino 108 | VCC — Core power supply |
| Pino 109 | GND — Ground |
| Pino 110 | VCC — Core power supply |
| Pino 111 | GND — Ground |
| Pino 112 | VCC — Core power supply |
| Pino 113 | GND — Ground |
| Pino 114 | VCC — Core power supply |
| Pino 115 | GND — Ground |
| Pino 116 | VCC — Core power supply |
| Pino 117 | GND — Ground |
| Pino 118 | VCC — Core power supply |
| Pino 119 | GND — Ground |
| Pino 120 | VCC — Core power supply |
| Pino 121 | GND — Ground |
| Pino 122 | VCC — Core power supply |
| Pino 123 | GND — Ground |
| Pino 124 | VCC — Core power supply |
| Pino 125 | GND — Ground |
| Pino 126 | VCC — Core power supply |
| Pino 127 | GND — Ground |
| Pino 128 | VCC — Core power supply |
| Pino 129 | GND — Ground |
| Pino 130 | VCC — Core power supply |
| Pino 131 | GND — Ground |
| Pino 132 | VCC — Core power supply |
| Pino 133 | GND — Ground |
| Pino 134 | VCC — Core power supply |
| Pino 135 | GND — Ground |
| Pino 136 | VCC — Core power supply |
| Pino 137 | GND — Ground |
| Pino 138 | VCC — Core power supply |
| Pino 139 | GND — Ground |
| Pino 140 | VCC — Core power supply |
| Pino 141 | GND — Ground |
| Pino 142 | VCC — Core power supply |
| Pino 143 | GND — Ground |
| Pino 144 | VCC — Core power supply |
Aplicações típicas
A3P600-2FG144 é adequado para 6 aplicaçãos: Industrial Control Systems, Automotive Electronics, Communications Infrastructure, Aerospace and Defense, Consumer Electronics, Medical Devices.
Industrial Control Systems
The A3P600-2FG144 is ideal for industrial control systems due to its 600K gates, 97 I/Os, and 350 MHz clock speed, enabling real-time motor control, PLC interfacing, and sensor fusion. Its flash-based architecture provides instant-on operation and high reliability in harsh environments. The device operates from 0°C to 85°C, suitable for most industrial settings, and its low power consumption reduces thermal management requirements. With 6 PLLs, it can generate multiple clock domains for complex control algorithms. The 144-LBGA package allows compact PCB designs, and the non-volatile configuration ensures secure, tamper-resistant operation. Compared to SRAM-based FPGAs, the ProASIC3 family eliminates the need for external configuration memory, simplifying BOM and reducing system cost.
Recomendado
Automotive Electronics
In automotive electronics, the A3P600-2FG144 provides a reliable, flash-based FPGA solution for infotainment, ADAS, and body control modules. Its 600K gates and 97 I/Os support interface bridging, sensor processing, and display control. The device's instant-on capability is critical for automotive applications requiring immediate functionality on power-up. Operating from 1.425V to 1.575V, it integrates well with automotive power rails. The 144-LBGA package is compact enough for space-constrained ECUs. While the standard temperature range is 0°C to 85°C, the -2FG144I variant extends to -40°C to 100°C for under-hood applications. The flash-based architecture provides inherent security against IP theft, a key concern in automotive design. Its low power consumption helps meet stringent vehicle energy efficiency requirements.
Recomendado
Communications Infrastructure
The A3P600-2FG144 excels in communications infrastructure, offering 600K gates and 97 I/Os for protocol bridging, packet processing, and interface conversion. Its 350 MHz clock and 6 PLLs enable high-speed data paths and multiple clock domains for Ethernet, PCIe, and other standards. The flash-based architecture ensures secure, non-volatile configuration, protecting intellectual property in network equipment. The device's low power consumption is beneficial for densely populated line cards and remote radio heads. Operating from 1.425V to 1.575V, it is compatible with standard communication power supplies. The 144-LBGA package supports high-density PCB layouts, and the 110,592 bits of RAM provide adequate buffering for small packets. For applications requiring extended temperature, the -2FG144I variant is available.
Recomendado
Aerospace and Defense
The A3P600-2FG144 is well-suited for aerospace and defense applications due to its flash-based, non-volatile architecture that provides inherent radiation tolerance and security. With 600K gates and 97 I/Os, it can implement avionics data buses, sensor interfaces, and mission-critical control logic. The instant-on capability is essential for safety-critical systems. The device operates from 1.425V to 1.575V and is available in industrial temperature grades for harsh environments. The 144-LBGA package is compact and rugged, suitable for space-constrained avionics. Its low power consumption is critical for battery-powered or thermally limited systems. The flash-based configuration is immune to bit-flips from radiation, a key advantage over SRAM-based FPGAs. For extended temperature ranges, the -2FG144II variant is recommended.
Recomendado
Consumer Electronics
In consumer electronics, the A3P600-2FG144 provides a cost-effective, low-power FPGA solution for smart home devices, wearables, and multimedia systems. Its 600K gates and 97 I/Os enable sensor fusion, display control, and audio processing. The flash-based architecture allows instant-on operation, ideal for user-facing devices. Operating from 1.425V to 1.575V, it is compatible with battery-powered designs. The 144-LBGA package is compact, enabling slim product form factors. The device's low power consumption extends battery life in portable devices. With 6 PLLs, it can generate multiple clock domains for audio and video processing. The non-volatile configuration eliminates the need for external boot memory, reducing BOM cost and board space. For consumer applications, the standard 0°C to 85°C temperature range is sufficient.
Recomendado
Medical Devices
The A3P600-2FG144 is suitable for medical devices requiring reliable, secure, and low-power programmable logic. Its 600K gates and 97 I/Os support patient monitoring, imaging, and diagnostic equipment. The flash-based architecture provides instant-on operation, critical for life-sustaining devices. Operating from 1.425V to 1.575V, it integrates with medical power systems. The 144-LBGA package is compact for portable medical devices. The device's low power consumption reduces heat generation, important for patient comfort. With 6 PLLs, it can handle multiple timing domains for signal processing. The non-volatile configuration ensures secure, tamper-proof operation, meeting medical data security requirements. For devices requiring extended temperature, the -2FG144I variant is available. The ProASIC3 family's high reliability makes it suitable for long-life medical equipment.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P600-2FG144 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P600-2FGG144 | A3P600-2FG144I | A3P600-FG144 | A3P600L-1FG144I |
|---|---|---|---|---|---|
| Package | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Number of Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| Number of I/O | 97 | 97 | 97 | 97 | 97 |
| Operating Temperature | 0°C ~ 85°C | 0°C ~ 85°C | -40°C ~ 100°C | 0°C ~ 85°C | -40°C ~ 100°C |
| Voltage - Supply | 1.425V ~ 1.575V | 1.425V ~ 1.575V | 1.425V ~ 1.575V | 1.425V ~ 1.575V | 1.425V ~ 1.575V |
| RoHS Status | RoHS non-compliant | RoHS non-compliant | RoHS non-compliant | RoHS non-compliant | RoHS non-compliant |
Principais diferenciais
- Higher speed grade with 350 MHz max clock (vs A3P600-FG144)
- Industrial temperature variant available (vs A3P600-2FGG144)
- Standard LBGA package with 1.00 mm pitch (vs A3P600L-1FG144I)
Notas de projeto
The A3P600-2FG144 requires a 1.425V to 1.575V core supply. Use a low-dropout regulator or DC-DC converter with adequate current capability. Estimated: at 350 MHz, the core current can reach approximately 150 mA, so a regulator with at least 300 mA headroom is recommended. Place 100 nF decoupling capacitors on each VCC pin and a 10 uF bulk capacitor near the power entry point.
The 144-LBGA package has a 1.00 mm ball pitch. Ensure the PCB land pattern matches the 13x13 mm footprint with proper solder mask openings. Use via-in-pad or microvias for the center balls to improve routing. Follow Microchip's layout guidelines for BGA packages to avoid solder bridging and ensure reliable assembly.
The A3P600-2FG144 operates from 0°C to 85°C. Estimated: at 350 MHz with 97 I/Os toggling, power dissipation can reach 1.5W. The 144-LBGA package has a thermal resistance of approximately 20°C/W, resulting in a 30°C temperature rise. Ensure adequate airflow or a thermal via array under the package to keep junction temperature within limits.
Informações de conformidade
RoHS non-compliant per Microchip USA product page. Lead-free status is no. Other compliance data not provided.
