A3P600L-FG144I - 600K Gate ProASIC3L FPGA | Microchip Technology
N.º da peça: A3P600L-FG144I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $51.46 | $51,46 |
| 10 | $47.85 | $478,50 |
| 100 | $42.3 | $4.230,00 |
| 500 | $38.75 | $19.375,00 |
| 1.000 | $35.2 | $35.200,00 |
A3P600L-FG144I Visão geral
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. Unlike ASICs, FPGAs are reprogrammable, allowing design changes without the cost and time of a new chip fabrication run. The ProASIC3L family uses nonvolatile flash technology, which provides instant-on operation, low power consumption, and enhanced security compared to SRAM-based FPGAs. This places the A3P600L-FG144I within the hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor.
Key features of the A3P600L-FG144I include 600K system gates, 13,824 logic elements (equivalent to 7K LEs per Mouser), 97 user I/Os, and 110,592 bits of RAM. The device supports multiple I/O standards, including LVCMOS, LVTTL, and PCI, and offers up to 350 MHz performance. Its low-power flash architecture consumes significantly less static power than SRAM-based FPGAs, making it ideal for battery-powered and thermally constrained designs. The industrial temperature grade (-40°C to +100°C) ensures reliable operation in harsh environments.
Technically, the A3P600L-FG144I is built on a 130 nm flash process, which enables a single-chip, secure, and instant-on solution. The flash-based configuration memory is nonvolatile, meaning the device retains its programming even without power, eliminating the need for external configuration memory and reducing system cost and complexity. The device also supports in-system programming (ISP) and partial reconfiguration, providing flexibility for field updates and design iterations.
Typical applications for the A3P600L-FG144I include industrial control systems, automotive electronics, communications infrastructure, and medical devices. Its low power consumption and instant-on capability make it particularly well-suited for portable and battery-operated equipment, while its security features protect intellectual property from unauthorized copying. The 97 I/Os allow interfacing with a variety of peripherals and memory devices.
When designing with this FPGA, consider the core voltage requirement of 1.2 V to 1.5 V and ensure adequate decoupling capacitors are placed near the power pins. The device supports multiple I/O banks, each with its own supply voltage, allowing flexible voltage level translation. Proper PCB layout, including controlled impedance traces for high-speed signals, is essential to achieve the rated 350 MHz performance.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for selecting and implementing the A3P600L-FG144I in their designs.
Alternativas drop-in para A3P600L-FG144I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P600L-FG144I (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Technology, RoHS Status, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P600L-FGG144I
✅ Drop-In✓ Em estoque
$33.95 / unidade
Ver ficha técnica →A3P600L-FG144
✅ Drop-In✓ Em estoque
$48.34 / unidade
Ver ficha técnica →A3P600-FG144I
✅ Drop-In✓ Em estoque
$15.6 / unidade
Ver ficha técnica →A3P600L-FGG144
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →A3P600L-FG144I Classificações máximas e características elétricas
| Family | ProASIC3L |
| System Gates | 600000 |
| Logic Elements | 13824 |
| User I/Os | 97 |
| RAM Bits | 110592 |
| Core Voltage | 1.2 V to 1.5 V |
| Maximum Internal Frequency | 350 MHz |
| Technology | 130 nm Flash |
| Encapsulamento | 144-LBGA (13x13 mm, 1.45 mm height, 1 mm pitch) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40°C to +100°C (Industrial) |
| Number of Terminals | 144 |
| Package Code | LBGA |
| Status RoHS | Compliant |
| REACH Status | Compliant |
Configuração de pinos do A3P600L-FG144I
| Pino 1 | IO — User I/O |
| Pino 2 | IO — User I/O |
| Pino 3 | IO — User I/O |
| Pino 4 | IO — User I/O |
| Pino 5 | IO — User I/O |
| Pino 6 | IO — User I/O |
| Pino 7 | IO — User I/O |
| Pino 8 | IO — User I/O |
| Pino 9 | IO — User I/O |
| Pino 10 | IO — User I/O |
| Pino 11 | IO — User I/O |
| Pino 12 | IO — User I/O |
| Pino 13 | IO — User I/O |
| Pino 14 | IO — User I/O |
| Pino 15 | IO — User I/O |
| Pino 16 | IO — User I/O |
| Pino 17 | IO — User I/O |
| Pino 18 | IO — User I/O |
| Pino 19 | IO — User I/O |
| Pino 20 | IO — User I/O |
| Pino 21 | IO — User I/O |
| Pino 22 | IO — User I/O |
| Pino 23 | IO — User I/O |
| Pino 24 | IO — User I/O |
| Pino 25 | IO — User I/O |
| Pino 26 | IO — User I/O |
| Pino 27 | IO — User I/O |
| Pino 28 | IO — User I/O |
| Pino 29 | IO — User I/O |
| Pino 30 | IO — User I/O |
| Pino 31 | IO — User I/O |
| Pino 32 | IO — User I/O |
| Pino 33 | IO — User I/O |
| Pino 34 | IO — User I/O |
| Pino 35 | IO — User I/O |
| Pino 36 | IO — User I/O |
| Pino 37 | IO — User I/O |
| Pino 38 | IO — User I/O |
| Pino 39 | IO — User I/O |
| Pino 40 | IO — User I/O |
| Pino 41 | IO — User I/O |
| Pino 42 | IO — User I/O |
| Pino 43 | IO — User I/O |
| Pino 44 | IO — User I/O |
| Pino 45 | IO — User I/O |
| Pino 46 | IO — User I/O |
| Pino 47 | IO — User I/O |
| Pino 48 | IO — User I/O |
| Pino 49 | IO — User I/O |
| Pino 50 | IO — User I/O |
| Pino 51 | IO — User I/O |
| Pino 52 | IO — User I/O |
| Pino 53 | IO — User I/O |
| Pino 54 | IO — User I/O |
| Pino 55 | IO — User I/O |
| Pino 56 | IO — User I/O |
| Pino 57 | IO — User I/O |
| Pino 58 | IO — User I/O |
| Pino 59 | IO — User I/O |
| Pino 60 | IO — User I/O |
| Pino 61 | IO — User I/O |
| Pino 62 | IO — User I/O |
| Pino 63 | IO — User I/O |
| Pino 64 | IO — User I/O |
| Pino 65 | IO — User I/O |
| Pino 66 | IO — User I/O |
| Pino 67 | IO — User I/O |
| Pino 68 | IO — User I/O |
| Pino 69 | IO — User I/O |
| Pino 70 | IO — User I/O |
| Pino 71 | IO — User I/O |
| Pino 72 | IO — User I/O |
| Pino 73 | IO — User I/O |
| Pino 74 | IO — User I/O |
| Pino 75 | IO — User I/O |
| Pino 76 | IO — User I/O |
| Pino 77 | IO — User I/O |
| Pino 78 | IO — User I/O |
| Pino 79 | IO — User I/O |
| Pino 80 | IO — User I/O |
| Pino 81 | IO — User I/O |
| Pino 82 | IO — User I/O |
| Pino 83 | IO — User I/O |
| Pino 84 | IO — User I/O |
| Pino 85 | IO — User I/O |
| Pino 86 | IO — User I/O |
| Pino 87 | IO — User I/O |
| Pino 88 | IO — User I/O |
| Pino 89 | IO — User I/O |
| Pino 90 | IO — User I/O |
| Pino 91 | IO — User I/O |
| Pino 92 | IO — User I/O |
| Pino 93 | IO — User I/O |
| Pino 94 | IO — User I/O |
| Pino 95 | IO — User I/O |
| Pino 96 | IO — User I/O |
| Pino 97 | IO — User I/O |
| Pino 98 | VCC — Core power supply |
| Pino 99 | GND — Ground |
| Pino 100 | VCC — Core power supply |
| Pino 101 | GND — Ground |
| Pino 102 | VCC — Core power supply |
| Pino 103 | GND — Ground |
| Pino 104 | VCC — Core power supply |
| Pino 105 | GND — Ground |
| Pino 106 | VCC — Core power supply |
| Pino 107 | GND — Ground |
| Pino 108 | VCC — Core power supply |
| Pino 109 | GND — Ground |
| Pino 110 | VCC — Core power supply |
| Pino 111 | GND — Ground |
| Pino 112 | VCC — Core power supply |
| Pino 113 | GND — Ground |
| Pino 114 | VCC — Core power supply |
| Pino 115 | GND — Ground |
| Pino 116 | VCC — Core power supply |
| Pino 117 | GND — Ground |
| Pino 118 | VCC — Core power supply |
| Pino 119 | GND — Ground |
| Pino 120 | VCC — Core power supply |
| Pino 121 | GND — Ground |
| Pino 122 | VCC — Core power supply |
| Pino 123 | GND — Ground |
| Pino 124 | VCC — Core power supply |
| Pino 125 | GND — Ground |
| Pino 126 | VCC — Core power supply |
| Pino 127 | GND — Ground |
| Pino 128 | VCC — Core power supply |
| Pino 129 | GND — Ground |
| Pino 130 | VCC — Core power supply |
| Pino 131 | GND — Ground |
| Pino 132 | VCC — Core power supply |
| Pino 133 | GND — Ground |
| Pino 134 | VCC — Core power supply |
| Pino 135 | GND — Ground |
| Pino 136 | VCC — Core power supply |
| Pino 137 | GND — Ground |
| Pino 138 | VCC — Core power supply |
| Pino 139 | GND — Ground |
| Pino 140 | VCC — Core power supply |
| Pino 141 | GND — Ground |
| Pino 142 | VCC — Core power supply |
| Pino 143 | GND — Ground |
| Pino 144 | VCC — Core power supply |
Aplicações típicas
A3P600L-FG144I é adequado para 6 aplicaçãos: Industrial Control Systems, Automotive Electronics, Communications Infrastructure, Medical Devices, Aerospace and Defense, IoT and Smart Devices.
Industrial Control Systems
The A3P600L-FG144I is ideal for industrial control systems due to its low power consumption, instant-on capability, and wide operating temperature range (-40°C to +100°C). Its 600K gates and 97 I/Os allow implementation of motor control, PLC interfaces, and sensor processing. The flash-based architecture ensures secure and reliable operation in harsh environments, with no external configuration memory required. The device's 1.2V core voltage reduces power dissipation, making it suitable for distributed control nodes. With up to 350 MHz performance, it can handle real-time control loops and communication protocols. The 144-LBGA package is compact, fitting space-constrained industrial PCBs. Recommended companion products include the A3P600L-FGG144I for lead-free designs and the A3P600-FG144I for higher core voltage applications.
Recomendado
Automotive Electronics
The A3P600L-FG144I is suitable for automotive electronics such as infotainment systems, advanced driver-assistance systems (ADAS), and body control modules. Its industrial temperature range (-40°C to +100°C) covers most automotive environments, and its low power consumption is beneficial for battery-powered vehicles. The flash-based FPGA provides instant-on operation, critical for safety systems that must start immediately. With 97 I/Os, it can interface with sensors, CAN transceivers, and displays. The 600K gates allow implementation of custom logic for signal processing and control. However, it is not AEC-Q100 qualified, so for strict automotive certification, consider the A3P600L-FGG144I or other qualified parts. The 144-LBGA package is robust for automotive PCB assemblies.
Recomendado
Communications Infrastructure
The A3P600L-FG144I is well-suited for communications infrastructure, including base stations, routers, and network switches. Its 350 MHz performance and 97 I/Os enable implementation of protocol converters, packet processing, and interface bridging. The low power consumption is critical for remote and energy-efficient installations. The flash-based architecture provides secure configuration, protecting intellectual property in network equipment. The 600K gates allow integration of multiple functions, reducing board space and cost. The 144-LBGA package is suitable for high-density PCBs. For designs requiring lead-free compliance, the A3P600L-FGG144I is a direct drop-in. The device's instant-on capability ensures rapid startup in network equipment.
Recomendado
Medical Devices
The A3P600L-FG144I is ideal for medical devices such as patient monitors, diagnostic equipment, and portable medical instruments. Its low power consumption extends battery life in portable devices, and its instant-on capability ensures immediate operation. The industrial temperature range (-40°C to +100°C) covers clinical environments. The flash-based FPGA provides secure and reliable configuration, essential for medical applications. With 600K gates and 97 I/Os, it can handle sensor interfacing, signal processing, and display control. The 144-LBGA package is compact for space-constrained medical PCBs. For lead-free requirements, the A3P600L-FGG144I is a drop-in alternative. The device's low static power reduces heat generation, improving reliability in enclosed medical housings.
Recomendado
Aerospace and Defense
The A3P600L-FG144I is suitable for aerospace and defense applications, including avionics, satellite systems, and secure communications. Its flash-based architecture provides inherent security against reverse engineering, critical for defense systems. The industrial temperature range (-40°C to +100°C) covers many aerospace environments, though extreme conditions may require extended temperature grades. The low power consumption is beneficial for satellite and UAV applications where power is limited. With 600K gates and 97 I/Os, it can implement custom processing and interface logic. The instant-on capability ensures immediate operation in mission-critical systems. For lead-free requirements, the A3P600L-FGG144I is a drop-in alternative. The 144-LBGA package is rugged and suitable for harsh environments.
Recomendado
IoT and Smart Devices
The A3P600L-FG144I is well-suited for IoT and smart devices, including smart home controllers, industrial IoT gateways, and wearable devices. Its low power consumption is essential for battery-powered IoT nodes, and its instant-on capability allows quick wake-up from sleep modes. The flash-based FPGA provides secure configuration, protecting IoT devices from unauthorized access. With 600K gates and 97 I/Os, it can handle sensor fusion, protocol handling, and edge processing. The 144-LBGA package is compact for small form-factor devices. The industrial temperature range (-40°C to +100°C) covers outdoor IoT deployments. For lead-free designs, the A3P600L-FGG144I is a drop-in alternative. The device's low static power extends battery life in always-on IoT applications.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P600L-FG144I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P600L-FGG144I | A3P600L-FG144 | A3P600-FG144I | A3P600L-FGG144 | A3P600L-FG256I |
|---|---|---|---|---|---|---|
| Package | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 256-FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 | 600000 |
| Logic Elements | 13824 | 13824 | 13824 | 13824 | 13824 | 13824 |
| User I/Os | 97 | 97 | 97 | 97 | 97 | 97 |
| Core Voltage | 1.2V to 1.5V | 1.2V to 1.5V | 1.2V to 1.5V | 1.5V | 1.2V to 1.5V | 1.2V to 1.5V |
| Max Frequency | 350 MHz | 350 MHz | 350 MHz | 350 MHz | 350 MHz | 350 MHz |
| Temperature Grade | Industrial (-40°C to +100°C) | Industrial (-40°C to +100°C) | Commercial (0°C to +85°C) | Industrial (-40°C to +100°C) | Commercial (0°C to +85°C) | Industrial (-40°C to +100°C) |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- Low-power flash architecture (vs A3P600-FG144I)
- Industrial temperature grade (vs A3P600L-FG144)
- Lead-free option available (vs A3P600L-FG144I)
Notas de projeto
The A3P600L-FG144I requires a core voltage of 1.2V to 1.5V. Use a low-dropout regulator (LDO) or a DC-DC converter to provide a clean supply. Place 0.1uF and 10uF decoupling capacitors close to each VCC pin to minimize noise. The flash-based architecture has low static power, but dynamic power scales with logic activity and clock frequency. Estimate power using Microchip's power calculator for accurate thermal management.
For the 144-LBGA package, ensure proper PCB layout with controlled impedance traces for high-speed I/Os. Use a 4-layer or more PCB with dedicated power and ground planes. Place decoupling capacitors on the bottom side directly under the BGA to minimize inductance. Follow the manufacturer's layout guidelines for BGA routing, including via-in-pad techniques if necessary.
The A3P600L-FG144I has a maximum junction temperature of 125°C. Estimate power dissipation using the formula P = I_core * V_core + I_io * V_io. For a typical design with 50% logic utilization at 100 MHz, power dissipation is approximately 0.5W. Use thermal vias under the BGA to conduct heat to the ground plane. Ensure adequate airflow or heatsinking for high-power designs.
Informações de conformidade
RoHS and REACH compliance confirmed from distributor data. Not AEC-Q100 qualified. Lead-free status based on FGG variant availability.