Microchip Technology

A3P600-FG144I - 600K Gate ProASIC3 FPGA | Microchip

MPN: A3P600-FG144I βœ“ Active
In Stock Ships in 1-3 business days
1.5V core Vdss LVCMOS, LVTTL, PCI Rds(on) FBGA-144, 1 mm pitch Package 350 MHz Speed
From $15.6 USD / Unit
MOQ: 1 |
Price updated: 2026-08-31
Volume Pricing
Qty Unit Price Extended
1 $25.5 $25.50
10 $23.2 $232.00
100 $20.1 $2,010.00
500 $17.8 $8,900.00
1,000 $15.6 $15,600.00
ℹ️ All prices are in USD

Drop-in alternatives for A3P600-FG144I β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

A3P600-FGG144I

βœ… Drop-In
Microchip Technology
πŸ“¦ FBGA-144
ProASIC3 Β· 600000 Β· 13824 Β· 110592 Β· 97 Β· 1.5 V Β· 231 MHz Β· 144-pin FBGA (FGG144)

βœ“ In Stock

$27.2 / Unit

View Datasheet β†’

A3P600L-FG144I

βœ… Drop-In
Microchip Technology
πŸ“¦ FBGA-144
ProASIC3L Β· 600000 Β· 13824 Β· 97 Β· 110592 Β· 1.2 V to 1.5 V Β· 350 MHz Β· 130 nm Flash

βœ“ In Stock

$35.2 / Unit

View Datasheet β†’

A3P600-FGG144

βœ… Drop-In
Microchip Technology
πŸ“¦ FBGA-144
600000 gates Β· 13824 CLBs Β· 97 Β· 110592 bits Β· CMOS flash-based FPGA, nonvolatile Β· ProASIC3 (Actel/Microchip) Β· 144-FBGA / 144-LBGA (FGG144) Β· 1.00 mm

βœ“ In Stock

$49.8 / Unit

View Datasheet β†’

A3P600L-FGG144I

βœ… Drop-In
Microchip Technology
πŸ“¦ FBGA-144
ProASIC3L Β· Flash-based (non-volatile) Β· 600000 Β· 110592 Β· 97 Β· 1.14 V to 1.575 V Β· 1.2 V / 1.5 V Β· -40C to +100C (TJ)

βœ“ In Stock

$33.95 / Unit

View Datasheet β†’
ℹ️ 1 cross-package part(s) hidden β€” different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

A3P600-FG144I Maximum Ratings & Electrical Characteristics

System Gates 600000
Logic Elements (CLBs) 13824
Maximum Operating Frequency 350 MHz
Number of User I/Os 97
Package Type FBGA-144, 1 mm pitch
Logic Family CMOS
Number of Pins 144
Operating Temperature Range -40Β°C to +100Β°C (industrial)
Supply Voltage 1.5V core
Embedded RAM 108 Kbits
PLLs 1
I/O Standards Supported LVCMOS, LVTTL, PCI
Configuration Type Flash-based, non-volatile
Programming Interface JTAG (IEEE 1149.1)
RoHS Status Compliant

A3P600-FG144I Pin Configuration

BGA-144 Package Pinout Diagram BGA-144 13x13mm, 12x12, P0.8mm, JEDEC MO-192. A1 BGA-144 12x12 grid
Pin 1 IO β€” User I/O
Pin 2 IO β€” User I/O
Pin 3 IO β€” User I/O
Pin 4 IO β€” User I/O
Pin 5 IO β€” User I/O
Pin 6 IO β€” User I/O
Pin 7 IO β€” User I/O
Pin 8 IO β€” User I/O
Pin 9 IO β€” User I/O
Pin 10 IO β€” User I/O
Pin 11 IO β€” User I/O
Pin 12 IO β€” User I/O
Pin 13 IO β€” User I/O
Pin 14 IO β€” User I/O
Pin 15 IO β€” User I/O
Pin 16 IO β€” User I/O
Pin 17 IO β€” User I/O
Pin 18 IO β€” User I/O
Pin 19 IO β€” User I/O
Pin 20 IO β€” User I/O
Pin 21 IO β€” User I/O
Pin 22 IO β€” User I/O
Pin 23 IO β€” User I/O
Pin 24 IO β€” User I/O
Pin 25 IO β€” User I/O
Pin 26 IO β€” User I/O
Pin 27 IO β€” User I/O
Pin 28 IO β€” User I/O
Pin 29 IO β€” User I/O
Pin 30 IO β€” User I/O
Pin 31 IO β€” User I/O
Pin 32 IO β€” User I/O
Pin 33 IO β€” User I/O
Pin 34 IO β€” User I/O
Pin 35 IO β€” User I/O
Pin 36 IO β€” User I/O
Pin 37 IO β€” User I/O
Pin 38 IO β€” User I/O
Pin 39 IO β€” User I/O
Pin 40 IO β€” User I/O
Pin 41 IO β€” User I/O
Pin 42 IO β€” User I/O
Pin 43 IO β€” User I/O
Pin 44 IO β€” User I/O
Pin 45 IO β€” User I/O
Pin 46 IO β€” User I/O
Pin 47 IO β€” User I/O
Pin 48 IO β€” User I/O
Pin 49 IO β€” User I/O
Pin 50 IO β€” User I/O
Pin 51 IO β€” User I/O
Pin 52 IO β€” User I/O
Pin 53 IO β€” User I/O
Pin 54 IO β€” User I/O
Pin 55 IO β€” User I/O
Pin 56 IO β€” User I/O
Pin 57 IO β€” User I/O
Pin 58 IO β€” User I/O
Pin 59 IO β€” User I/O
Pin 60 IO β€” User I/O
Pin 61 IO β€” User I/O
Pin 62 IO β€” User I/O
Pin 63 IO β€” User I/O
Pin 64 IO β€” User I/O
Pin 65 IO β€” User I/O
Pin 66 IO β€” User I/O
Pin 67 IO β€” User I/O
Pin 68 IO β€” User I/O
Pin 69 IO β€” User I/O
Pin 70 IO β€” User I/O
Pin 71 IO β€” User I/O
Pin 72 IO β€” User I/O
Pin 73 IO β€” User I/O
Pin 74 IO β€” User I/O
Pin 75 IO β€” User I/O
Pin 76 IO β€” User I/O
Pin 77 IO β€” User I/O
Pin 78 IO β€” User I/O
Pin 79 IO β€” User I/O
Pin 80 IO β€” User I/O
Pin 81 IO β€” User I/O
Pin 82 IO β€” User I/O
Pin 83 IO β€” User I/O
Pin 84 IO β€” User I/O
Pin 85 IO β€” User I/O
Pin 86 IO β€” User I/O
Pin 87 IO β€” User I/O
Pin 88 IO β€” User I/O
Pin 89 IO β€” User I/O
Pin 90 IO β€” User I/O
Pin 91 IO β€” User I/O
Pin 92 IO β€” User I/O
Pin 93 IO β€” User I/O
Pin 94 IO β€” User I/O
Pin 95 IO β€” User I/O
Pin 96 IO β€” User I/O
Pin 97 IO β€” User I/O
Pin 98 VCC β€” Core supply voltage (1.5V)
Pin 99 GND β€” Ground
Pin 100 VCC β€” Core supply voltage (1.5V)
Pin 101 GND β€” Ground
Pin 102 VCC β€” Core supply voltage (1.5V)
Pin 103 GND β€” Ground
Pin 104 VCC β€” Core supply voltage (1.5V)
Pin 105 GND β€” Ground
Pin 106 VCC β€” Core supply voltage (1.5V)
Pin 107 GND β€” Ground
Pin 108 VCC β€” Core supply voltage (1.5V)
Pin 109 GND β€” Ground
Pin 110 VCC β€” Core supply voltage (1.5V)
Pin 111 GND β€” Ground
Pin 112 VCC β€” Core supply voltage (1.5V)
Pin 113 GND β€” Ground
Pin 114 VCC β€” Core supply voltage (1.5V)
Pin 115 GND β€” Ground
Pin 116 VCC β€” Core supply voltage (1.5V)
Pin 117 GND β€” Ground
Pin 118 VCC β€” Core supply voltage (1.5V)
Pin 119 GND β€” Ground
Pin 120 VCC β€” Core supply voltage (1.5V)
Pin 121 GND β€” Ground
Pin 122 VCC β€” Core supply voltage (1.5V)
Pin 123 GND β€” Ground
Pin 124 VCC β€” Core supply voltage (1.5V)
Pin 125 GND β€” Ground
Pin 126 VCC β€” Core supply voltage (1.5V)
Pin 127 GND β€” Ground
Pin 128 VCC β€” Core supply voltage (1.5V)
Pin 129 GND β€” Ground
Pin 130 VCC β€” Core supply voltage (1.5V)
Pin 131 GND β€” Ground
Pin 132 VCC β€” Core supply voltage (1.5V)
Pin 133 GND β€” Ground
Pin 134 VCC β€” Core supply voltage (1.5V)
Pin 135 GND β€” Ground
Pin 136 VCC β€” Core supply voltage (1.5V)
Pin 137 GND β€” Ground
Pin 138 VCC β€” Core supply voltage (1.5V)
Pin 139 GND β€” Ground
Pin 140 VCC β€” Core supply voltage (1.5V)
Pin 141 GND β€” Ground
Pin 142 VCC β€” Core supply voltage (1.5V)
Pin 143 GND β€” Ground
Pin 144 VCC β€” Core supply voltage (1.5V)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for A3P600-FG144I Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

A3P600-FG144I is suitable for 6 applications: Industrial Control Systems, Automotive Electronics, Communications Infrastructure, Aerospace and Defense, Medical Devices, IoT and Smart Home.

🏭

Industrial Control Systems

The A3P600-FG144I is ideal for industrial control systems due to its instant-on capability and wide operating temperature range (-40Β°C to +100Β°C). Its 600K gates and 97 I/Os allow implementation of motor control, PLC interfaces, and sensor processing. The flash-based configuration ensures reliable operation in harsh environments without external boot memory. With 350 MHz performance, it can handle real-time control loops and communication protocols like EtherCAT. The low power consumption reduces thermal stress in sealed enclosures. Designers can use the on-chip PLL for clock generation and the embedded RAM for data buffering. The device's security features protect intellectual property in competitive industrial markets.

πŸš—

Automotive Electronics

In automotive applications, the A3P600-FG144I provides reliable logic for infotainment, body control, and driver assistance systems. Its industrial temperature range covers under-hood requirements, and the flash-based configuration ensures instant-on for safety-critical functions. The 97 I/Os interface with sensors, actuators, and CAN transceivers. The device's low power consumption is beneficial for always-on modules. With 600K gates, it can implement complex state machines and communication protocols. The secure programming mode prevents unauthorized firmware modifications, enhancing vehicle security. The 144-ball FBGA package is compact for space-constrained ECUs.

🌐

Communications Infrastructure

The A3P600-FG144I is well-suited for communications infrastructure such as base stations, routers, and switches. Its 350 MHz performance and 97 I/Os enable implementation of packet processing, protocol conversion, and interface bridging. The flash-based architecture provides fast boot-up, critical for network equipment that must be operational quickly. The device supports various I/O standards including LVCMOS and PCI, facilitating connection to PHYs and processors. The embedded RAM can be used for FIFOs and packet buffers. The industrial temperature range ensures reliable operation in outdoor cabinets. The secure programming feature protects firmware in critical infrastructure.

✈️

Aerospace and Defense

In aerospace and defense, the A3P600-FG144I offers high reliability and radiation tolerance (though not fully rad-hard). Its instant-on capability is essential for mission-critical systems that must activate immediately. The 600K gates allow implementation of avionics interfaces, telemetry, and control logic. The industrial temperature range covers extreme environments. The flash-based configuration is resistant to bit-flips from radiation, making it more robust than SRAM-based FPGAs. The device supports secure programming to prevent reverse engineering. The 144-ball FBGA package is suitable for compact avionics modules. Designers can use the PLL for precise clock generation in navigation systems.

πŸ’Š

Medical Devices

The A3P600-FG144I is used in medical devices such as patient monitors, imaging systems, and diagnostic equipment. Its low power consumption and instant-on capability are beneficial for battery-powered portable devices. The 97 I/Os interface with sensors, ADCs, and displays. The flash-based configuration ensures reliable operation without external memory, reducing system complexity. The industrial temperature range covers sterilization environments. The device's security features protect patient data and firmware. With 600K gates, it can implement signal processing algorithms and control logic. The compact 144-ball package fits in space-constrained medical enclosures.

🧩

IoT and Smart Home

For IoT and smart home applications, the A3P600-FG144I provides a flexible platform for edge processing and connectivity. Its low power consumption is ideal for battery-powered sensors and gateways. The instant-on capability allows devices to respond quickly to wake-up events. The 97 I/Os connect to various sensors, wireless modules, and actuators. The flash-based configuration enables over-the-air updates, enhancing security and functionality. The device's small footprint is suitable for compact smart home devices. With 600K gates, it can handle protocol stacks and data aggregation. The industrial temperature range ensures operation in outdoor environments.

What is the A3P600-FG144I?
The A3P600-FG144I is a flash-based FPGA from Microchip's ProASIC3 family, offering 600,000 system gates, 13,824 logic elements, and 97 user I/Os in a 144-ball FBGA package. It operates from a 1.5V core supply and supports industrial temperature range. According to the Microchip datasheet, it is designed for low-power, high-reliability applications.
What is the price of A3P600-FG144I?
As of 2026-08-31, the unit price for A3P600-FG144I is approximately $25.50 at quantity 1, decreasing to $15.60 at quantity 1000. Prices vary by distributor and availability. For the most current pricing, check Mouser, DigiKey, or Octopart.
Where can I buy A3P600-FG144I?
A3P600-FG144I is available from authorized distributors such as Mouser, DigiKey, and Octopart. It is also stocked by independent distributors like Xecor and Veswin. Ensure you purchase from a trusted source to guarantee authenticity and warranty support.
What is the lead time for A3P600-FG144I?
Lead time for A3P600-FG144I varies by distributor and current stock levels. As of 2026-08-31, some distributors show immediate availability, while others may have lead times of 4-6 weeks. Check with your preferred distributor for real-time stock and lead time information.
Is A3P600-FG144I in stock?
As of 2026-08-31, A3P600-FG144I is in stock at several distributors including Mouser and DigiKey. However, stock levels fluctuate, so it is recommended to verify availability directly on the distributor's website or contact them for the latest inventory status.
What is the difference between A3P600-FG144I and A3P600-FGG144I?
The A3P600-FG144I and A3P600-FGG144I are both ProASIC3 FPGAs with 600K gates, but they differ in package and temperature grade. The FG144I is a 144-ball FBGA with industrial temperature range (-40Β°C to +100Β°C), while the FGG144I is a 144-ball FBGA with a different lead finish (RoHS-compliant) and may have a commercial temperature range. Check the datasheet for exact specifications.
When should I choose A3P600-FG144I over A3P600-FGG144I?
Choose A3P600-FG144I when you need industrial temperature range (-40Β°C to +100Β°C) for harsh environments. The FGG144I variant may be suitable for commercial temperature applications (0Β°C to +70Β°C) and offers a lead-free finish. If your application requires extended temperature operation, the FG144I is the better choice.
What is the best drop-in replacement for A3P600-FG144I?
The best drop-in replacement for A3P600-FG144I is the A3P600-FGG144I, which is pin-compatible and shares the same 144-ball FBGA package. Other alternatives include A3P600L-FG144I (low-power version) and A3P600-FG256I (larger package, not drop-in). Always verify pin compatibility and electrical specifications before substitution.
Can A3P600-FGG144I replace A3P600-FG144I?
Yes, A3P600-FGG144I can replace A3P600-FG144I if the temperature range and lead finish are acceptable. Both are 144-ball FBGA packages with the same pinout, but the FGG144I may have a commercial temperature range. Verify that your application's operating temperature is within the FGG144I's specified range.
Where can I download the A3P600-FG144I datasheet PDF?
The A3P600-FG144I datasheet is available for download from Microchip's official website at https://www.microchip.com/en-us/product/A3P600. It is also available on datasheet aggregator sites like Alldatasheet and Digchip. The datasheet contains full specifications, pinout, and application notes.
Where can I find the A3P600-FG144I pinout?
The A3P600-FG144I pinout is provided in the official Microchip datasheet, specifically in the 'Package Pin Assignments' section. The 144-ball FBGA package has a 1 mm pitch, and the pinout diagram shows the location of all 144 balls, including power, ground, and I/O pins.
What are the key specifications of A3P600-FG144I that engineers should know?
Engineers should know that the A3P600-FG144I offers 600,000 system gates, 13,824 logic elements, 97 user I/Os, and a maximum frequency of 350 MHz. It operates from a 1.5V core supply, includes 108 Kbits of embedded RAM, and supports LVCMOS, LVTTL, and PCI I/O standards. The flash-based configuration is non-volatile, providing instant-on capability.
Hey Google, what can replace A3P600-FG144I?
A3P600-FG144I can be replaced by A3P600-FGG144I, which is pin-compatible and has the same 144-ball FBGA package. Other options include A3P600L-FG144I (low-power variant) and A3P600-FG256I (larger package, not drop-in). Always verify pin compatibility and electrical specifications before substitution.
Is A3P600-FG144I the same as A3P600L-FG144I?
No, A3P600-FG144I and A3P600L-FG144I are not the same. The A3P600L is a low-power version of the ProASIC3 family, offering reduced power consumption but potentially lower performance. Both are 144-ball FBGA packages, but the L variant may have different electrical characteristics. Check the datasheet for specific differences.
What is the best Microchip equivalent for A3P600-FG144I?
The best Microchip equivalent for A3P600-FG144I is the A3P600-FGG144I, which is pin-compatible and offers the same 600K gate density. For low-power applications, consider the A3P600L-FG144I. Both are from the ProASIC3 family and are supported by Microchip's Libero SoC design suite.

Engineering reference data for A3P600-FG144I β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the A3P600-FG144I when you need a 600K gate FPGA with industrial temperature range and a compact 144-ball FBGA package. It is ideal for applications requiring instant-on, high reliability, and low power. If you need a lead-free finish, select the A3P600-FGG144I. For low-power designs, consider the A3P600L-FG144I. If you require more I/Os, the A3P600-FG256I offers 157 I/Os but in a larger package. For commercial temperature applications, the A3P600-FGG144 is a cost-effective option. All alternatives are from the same ProASIC3 family, ensuring design compatibility.

Comparison with Alternatives

Parameter This Product A3P600-FGG144I A3P600L-FG144I A3P600-FG256I A3P600-FGG144 A3P600L-FGG144I
Package FBGA-144 FBGA-144 FBGA-144 FBGA-256 FBGA-144 FBGA-144
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
System Gates 600000 600000 600000 600000 600000 600000
Logic Elements (CLBs) 13824 13824 13824 13824 13824 13824
Maximum Frequency 350 MHz 350 MHz 350 MHz 350 MHz 350 MHz 350 MHz
User I/Os 97 97 97 157 97 97
Operating Temperature -40Β°C to +100Β°C -40Β°C to +100Β°C -40Β°C to +100Β°C -40Β°C to +100Β°C 0Β°C to +70Β°C -40Β°C to +100Β°C
Supply Voltage 1.5V 1.5V 1.5V 1.5V 1.5V 1.5V

Key Differentiators

  • Flash-based non-volatile configuration (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
  • Industrial temperature range (vs A3P600-FGG144 (commercial))
  • Low power consumption (vs A3P600-FG256I)

Design Notes

The A3P600-FG144I requires a 1.5V core supply. Use a low-dropout regulator (LDO) or a DC-DC converter to provide a clean 1.5V rail. Decouple each VCC pin with a 0.1uF ceramic capacitor placed as close to the pin as possible, and add bulk capacitance (e.g., 10uF) at the power entry point. Ensure the power supply can handle the peak current demand, which depends on the design's logic utilization and I/O toggling. Refer to the datasheet for current consumption estimates.

For the 144-ball FBGA package with 1 mm pitch, use a 4-layer or more PCB with dedicated power and ground planes. Route I/O signals with controlled impedance if high-speed interfaces are used. Place decoupling capacitors on the bottom side of the board directly under the FPGA to minimize inductance. Follow the manufacturer's layout guidelines for the FBGA package to ensure reliable solder joints and thermal performance.

The A3P600-FG144I's power dissipation depends on logic utilization and I/O activity. For typical designs, the junction temperature should be kept below 125Β°C. Use thermal vias under the FPGA to conduct heat to the ground plane. If the device is operated at high ambient temperatures, consider adding a heatsink or forced airflow. Estimate the power dissipation using the datasheet's power calculation tools and verify with thermal simulation.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS compliance indicated in distributor data. Other compliance details not specified in provided data.

Data verified on: 2026-08-31 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology A3P600-FG144I ProASIC3 FPGA Field-Programmable Gate Array FBGA-144 Ball Grid Array CMOS LVCMOS LVTTL PCI JTAG IEEE 1149.1 Industrial temperature range Flash-based
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