A3P600L-FG256I - 600K Gate Flash FPGA, 177 I/O | Microchip
MPN: A3P600L-FG256I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64.8 | $6,480.00 |
| 500 | $58.9 | $29,450.00 |
| 1,000 | $53.6 | $53,600.00 |
Drop-in alternatives for A3P600L-FG256I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P600L-FG256
✅ Drop-In📋 Reference alternative (not in catalog)
A3P600-FG256I
✅ Drop-In✓ In Stock
$23.1 / Unit
View Datasheet →A3P1000L-FG256
✅ Drop-In✓ In Stock
$55 / Unit
View Datasheet →A3P400-FG256I
✅ Drop-In✓ In Stock
$46.2 / Unit
View Datasheet →A3P1000-1FGG256
✅ Drop-In✓ In Stock
$48.75 / Unit
View Datasheet →A3P600L-FG256I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L |
| Logic Gates | 600000 gates |
| User I/O | 177 |
| Embedded RAM | 110592 bits |
| Core Voltage | 1.2 V |
| Process Technology | 130 nm flash |
| Configuration Memory | On-chip flash (nonvolatile, single-chip) |
| Package | 256-ball FBGA (LBGA) |
| Temperature Grade | Industrial (-40C to +100C junction) |
| Mounting Type | Surface Mount |
| Programming | In-system reprogrammable flash |
| Speed Grade | Standard (see ordering code) |
A3P600L-FG256I 256-ball fbga (lbga) Pin Configuration Guide
Complete pinout information for A3P600L-FG256I (256-ball fbga (lbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P600L-FG256I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600L-FG256I is suitable for 6 applications: Industrial Automation and Motor Control, Secure Military and Aerospace Subsystems, Communications Line-Card Glue Logic, Medical Instrumentation Control Logic, ASIC Prototyping and Low-Volume Emulation, Battery-Powered Portable and IoT Equipment.
Industrial Automation and Motor Control
The A3P600L-FG256I fits industrial control and motor drive logic because its 600K flash gates absorb state machines, PWM generation, and fieldbus interfaces that would otherwise consume several glue-logic ICs. Its 1.2 V core lowers dynamic power inside sealed drives and cabinets with limited airflow, while 177 user I/O covers encoders, sensors, and isolated communication channels. Because configuration lives in on-chip flash, the controller is active the instant 24 V plant power arrives - no boot delay that could miss a safety handshake. Flash reprogrammability also allows firmware field updates without changing the PCB.
Recommended
Secure Military and Aerospace Subsystems
Defense and aerospace boards select the A3P600L-FG256I for its instant-on flash configuration and inherent resistance to bitstream cloning, since no external configuration PROM exposes the design. The industrial -40C to +100C grade and mature 130 nm flash process suit long-lifecycle programs that need decades of supply continuity. Its 600K gates host interface bridging, telemetry formatting, and soft ARM control, while 110,592 embedded RAM bits buffer sensor streams. For programs requiring radiation tolerance, engineers migrate to Microchip RT-class devices, but for COTS avionics and ground systems this single-chip FPGA reduces component count and security audit surface.
Recommended
Communications Line-Card Glue Logic
In telecom and networking line cards, the A3P600L-FG256I bridges asynchronous interfaces, formats backplane framing, and handles clock-domain crossing with its 110,592 bits of embedded dual-port SRAM. The 1.2 V core keeps per-switch dynamic power low across dense chassis, easing shelf-level thermal budgets that are typically constrained to 15-25 W per slot. Instant-on flash configuration matters where backplane management expects logic alive within milliseconds of -48 V power insertion. The 256-ball FBGA's 1.0 mm pitch fits standard 8-12 layer card processes, and 177 user I/O terminate rear-panel and fabric signals without external level shifters in 3.3 V and 2.5 V banks.
Recommended
Medical Instrumentation Control Logic
Medical diagnostic devices benefit from the A3P600L-FG256I's deterministic instant-on behavior: front-end acquisition logic is live before an operator completes power-on checks, with no configuration-load window that could lose the first sample burst. The 600K gates implement ADC sequencing, filtering datapaths, and USB/Ethernet bridging to the host, while the low 1.2 V core reduces heat inside patient-adjacent enclosures. Flash-based configuration simplifies regulatory documentation of a single-chip, tamper-resistant design. Long product lifecycles typical of medical platforms align with Microchip's continued support of the ProASIC3 family and its mature, well-characterized 130 nm process node.
Recommended
ASIC Prototyping and Low-Volume Emulation
Design teams use the A3P600L-FG256I to prototype ASIC control blocks and bridge logic before committing to masks. The 600K-gate fabric and reprogrammable flash let engineers iterate RTL daily without changing hardware, and the instant-on behavior reproduces ASIC power-up semantics more faithfully than SRAM FPGAs that need a load sequence. Its 177 user I/O and embedded 110,592-bit RAM support representative peripheral sets on a single device. Because the same FG256 footprint spans 400K to 1000K gate family members, a prototype board can be respun to higher density with no PCB change - an economical path from emulation through low-volume production where ASIC unit costs are unjustified.
Recommended
Battery-Powered Portable and IoT Equipment
Portable instruments and battery-backed IoT nodes choose the A3P600L because the L-suffix 1.2 V core directly cuts dynamic power versus the 1.5 V A3P600, extending charge life in duty-cycled acquisition nodes. The single-chip flash architecture removes the external configuration PROM from the BOM - a real area and leakage saving where every square millimeter and microamp counts across a multi-year field deployment. The FPGA handles sensor fusion preprocessing and protocol translation, waking instantly on external triggers with no configuration delay that would drop the first event. The industrial temperature rating also suits outdoor enclosures beyond typical commercial limits.
Recommended
Recommended Products Summary
Engineering reference data for A3P600L-FG256I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600L-FG256 | A3P600-FG256I | A3P1000L-FG256 | A3P400-FG256I | A3P1000-1FGG256 |
|---|---|---|---|---|---|---|
| Package | 256-ball FBGA (FG256) | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FGG256 - same footprint, Pb-free finish |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Gates | 600000 | 600000 | 600000 | 1000000 | 400000 | 1000000 |
| Core Voltage | 1.2 V | 1.2 V | 1.5 V | 1.2 V | 1.5 V | 1.5 V |
| User I/O | 177 | 177 | 177 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Embedded RAM (bits) | 110592 | 110592 | 110592 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Temperature Grade | Industrial (-I) | Commercial | Industrial (-I) | Commercial | Industrial (-I) | [DATA_NEEDED] |
| Configuration | On-chip flash (single-chip, instant-on) | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
Key Differentiators
- Lowest-power core in the 600K-gate class (vs A3P600-FG256I)
- Industrial temperature rating over the commercial twin (vs A3P600L-FG256)
- Balanced density point with same-footprint upgrade path (vs A3P1000L-FG256)
Design Notes
Plan three supply rails: 1.2 V core (A3P600L), 2.5 V for PLL/analog, and bank-selectable I/O voltages (1.5 V to 3.3 V per ProASIC3 datasheet). Do not share the core rail with other 1.2 V switching loads without ferrite isolation; core noise directly degrades timing margins. Estimated: a 600K-gate design toggling at moderate activity typically draws hundreds of mA on the core rail - size the regulator with at least 50% headroom and verify with Microchip's SmartPower estimator in Libero SoC before finalizing the DC-DC design.
The 256-ball 1.0 mm-pitch FBGA requires via-in-pad or dog-bone fanout on at least a 6-layer board; dedicate layer 2 to a solid core-voltage plane and stitch 0.1 uF ceramics to every VCC ball group within 2 mm, plus bulk 22-47 uF per rail. Confirm the FG256 ball map against the datasheet mechanical drawing before routing - dedicated configuration and JTAG balls cannot be reassigned. Use Libero SoC's pin report as the single source of truth to avoid bank-voltage conflicts in the final netlist.
A frequent mistake is treating the L variant as interchangeable with the 1.5 V A3P600 without checking power-on ramp requirements: both flash devices need monotonic supply ramp per datasheet power-sequencing guidance, or the power-on-reset may mis-trigger. Also verify the -I temperature derating applies to your speed grade file - industrial parts ship with timing characterized across the full -40C to +100C range, and using a commercial timing model in an industrial build risks marginal paths. Always re-run static timing at the shipped speed grade.
Compliance Information
Compliance status not stated in the provided web data; verify on Microchip's product page environmental section before procurement.
