A3PE3000-PQ208I - 3M-Gate Flash FPGA 147 I/O | Microchip
N.º da peça: A3PE3000-PQ208I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $377.48 | $377,48 |
| 10 | $375 | $3.750,00 |
| 100 | $371 | $37.100,00 |
| 500 | $367.5 | $183.750,00 |
| 1.000 | $364 | $364.000,00 |
A3PE3000-PQ208I Visão geral
A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and programmable I/O that designers configure after manufacturing. Within the programmable logic hierarchy, the FPGA sits at the top as a full system-level fabric, above CPLDs and simple programmable devices. The ProASIC3E family is distinguished by its flash-based configuration memory: unlike SRAM FPGAs, it is a single-chip solution that retains its configuration through power cycles and needs no external boot PROM, reducing bill-of-materials cost and improving board-level security.
Key features of the A3PE3000 include 3 million gates for substantial logic capacity, 147 user I/O on the PQ208 package, low total cost of ownership (TOC) highlighted by Microchip, and reprogrammability supporting in-field firmware updates. The flash cell technology is inherently non-volatile and low power at standby, and the fabric supports common FPGA design flows using Microchip Libero SoC tools.
Technical depth: the device is fabricated on a 130nm CMOS process with a 1.5V core supply. ProASIC3E embeds PLLs and block RAM suitable for bus interfacing, glue logic consolidation, and control-plane designs. The 231 MHz figure represents the family's achievable system performance for typical pipelined designs. Clock management, I/O banking, and flash security features make the part a cost-effective ASIC replacement, particularly where NRE cost and long ASIC lead times are unacceptable.
Typical applications include industrial automation control and motor-interface glue logic, networking and communications line-card control logic, and avionics/defense systems that value non-volatile, single-chip, secure configuration without external configuration devices.
Design consideration: this PQ208I variant is RoHS non-compliant and contains lead, so it is targeted at legacy, defense, and exemption-qualified industrial programs; for new lead-free designs, select the PQG208 green-package variants instead.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with pricing verified as of 2026-09-02.
Alternativas drop-in para A3PE3000-PQ208I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3PE3000-PQ208I (mesmo formato e footprint) — diferindo em Package, Family, System Gates, Process Technology, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3PE3000L-PQ208I
✅ Drop-In✓ Em estoque
$89.75 / unidade
Ver ficha técnica →A3PE3000-2PQG208I
✅ Drop-In✓ Em estoque
$89.25 / unidade
Ver ficha técnica →A3PE3000-1PQG208I
✅ Drop-In✓ Em estoque
$59.9 / unidade
Ver ficha técnica →A3PE3000-PQG208
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →A3PE3000-PQ208
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3PE3000-PQ208I Classificações máximas e características elétricas
| Family | ProASIC3E (flash-based FPGA) |
| System Gates | 3000000 gates |
| Logic Cells (CLBs) | 75264 |
| Maximum System Performance | 231 MHz |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Configuration Memory | Flash (non-volatile, single chip) |
| User I/O | 147 |
| Encapsulamento | 208-Pin PQFP (QFP-208) |
| Package Dimensions | 28 x 28 mm, 3.4 mm height |
| Lead Pitch | 0.5 mm |
| Temperatura de operação | Industrial (-40C to +85C, I suffix) |
| Tipo de montagem | Surface Mount |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| Status RoHS | RoHS Non-Compliant |
Guia de Configuração de Pinos do A3PE3000-PQ208I 28 x 28 mm, 3.4 mm height
Configuração de pinos para A3PE3000-PQ208I (pacote 28 x 28 mm, 3.4 mm height). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3PE3000-PQ208I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3PE3000-PQ208I é adequado para 6 aplicaçãos: Industrial Automation Control, Networking and Communications Control Plane, Avionics and Defense Systems, ASIC Prototyping and Replacement, Test and Measurement Instrumentation, Legacy Board Redesign and EOL Mitigation.
Industrial Automation Control
The A3PE3000-PQ208I fits industrial control and automation line cards because its industrial temperature rating (-40C to +85C) and non-volatile flash configuration allow immediate logic availability at power-up with no configuration delay. With 3 million gates and 147 user I/O in a 0.5 mm-pitch PQFP, it consolidates PLC I/O sequencing, encoder interfaces, and multi-CPLD glue logic into a single reprogrammable chip. Placed between backplane connectors and processors, its flash fabric also avoids the configuration PROM common to SRAM FPGAs, cutting BOM cost and improving uptime; the trade-off is verifying power budget against the 1.5V core supply in always-on installations.
Recomendado
Networking and Communications Control Plane
In networking and communications equipment, the ProASIC3E family is explicitly positioned by Microchip as a cost-effective ASIC replacement for control-plane logic. The A3PE3000-PQ208I provides 231 MHz of achievable system performance, enough for line-card supervision, backplane bus bridging, and hot-swap control, while 147 user I/O covers status, LED, and management interfaces. Its flash-based fabric keeps configuration on-chip for faster field turn-up than SRAM FPGAs that boot from external PROMs. Designers typically implement these functions in Libero SoC with standard Verilog; the PQFP package simplifies rework during bring-up compared with fine-pitch BGAs.
Recomendado
Avionics and Defense Systems
The ProASIC3E datasheet names the avionics market as a target because flash FPGAs offer a single-chip, non-volatile solution with design security, which matters in defense and aerospace programs. The leaded PQ208I package supports programs using lead-based solder under exemption, and the industrial temperature rating covers many airborne equipment envelopes. With 3 million gates, the device hosts mission control logic, built-in-test controllers, and bus interface glue logic. Because configuration is stored in flash rather than SRAM, the design is resistant to bitstream interception and survives power interruption without reconfiguration, a practical reliability benefit in flight-critical power sequencing.
Recomendado
ASIC Prototyping and Replacement
Microchip positions ProASIC3E as a cost-effective ASIC replacement, and the A3PE3000-PQ208I is well suited to bridge gate-array and structured-ASIC obsolescence. Its 3 million gates approximate mid-size gate-array capacity, and the reprogrammable flash fabric lets teams iterate RTL without NRE charges or mask turnaround. In legacy ASIC replacements, the 147-I/O PQFP mirrors the perimeter-bonded I/O counts typical of older QFP-packaged ASICs, easing board-level migration. The design flow from synthesis through JTAG programming completes in days, allowing functional verification on real system hardware far earlier than an ASIC respin would permit.
Recomendado
Test and Measurement Instrumentation
Bench and automated test instruments benefit from the A3PE3000-PQ208I's reprogrammability and 147 user I/O, which handle fixture control, relay matrix addressing, and trigger distribution. The 231 MHz fabric performance supports time-tagging and pattern-generation state machines, while flash configuration means the instrument is logic-ready the instant power is applied - useful in rack systems with rapid power cycling. The PQFP package's 0.5 mm leads simplify rework when instrument designs are updated across product generations, and the same Libero design files port across speed grades, letting one board SKU span standard and performance instrument variants with only a programming change.
Recomendado
Legacy Board Redesign and EOL Mitigation
For programs maintaining discontinued CPLD, gate-array, or SRAM-FPGA boards, the A3PE3000-PQ208I offers a reprogrammable consolidation target in a package style familiar to legacy designs. Verified drop-in alternatives within the same PQ208 footprint (A3PE3000L-PQ208I, A3PE3000-2PQG208I) provide second sources and green-package migration paths, and FindIC marks the 2PQG208I as completely replaceable without circuit modification. Engineers typically recompile existing HDL in Libero SoC, re-verify timing at the target speed grade, and retain the original 208-pin land pattern - avoiding PCB respin while restoring long-term supply for end-of-life programmable logic.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3PE3000-PQ208I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3PE3000L-PQ208I | A3PE3000-2PQG208I | A3PE3000-1PQG208I | A3PE3000-PQ208 |
|---|---|---|---|---|---|
| Package | 208-Pin PQFP (28 x 28 mm, 0.5 mm pitch) | 208-Pin PQFP - same footprint | 208-Pin PQFP (green) - same footprint | 208-Pin PQFP (green) - same footprint | 208-Pin PQFP - same footprint |
| Brand | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) |
| System Gates | 3 M gates | 3 M gates | 3 M gates | 3 M gates | 3 M gates |
| Logic Cells | 75264 | 75264 | 75264 | 75264 | 75264 |
| User I/O | 147 | 147 | 147 | 147 | 147 |
| Core Voltage | 1.5 V | 1.5 V (low-power optimized) | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) | Commercial |
| RoHS Status | Non-Compliant (contains lead) | Non-Compliant (leaded PQFP) | Compliant (green package) | Compliant (green package) | Non-Compliant (contains lead) |
Principais diferenciais
- Non-volatile single-chip flash configuration (vs SRAM-based competitor FPGAs)
- Low-power sibling available on identical footprint (vs A3PE3000L-PQ208I)
- Leaded package for exemption programs (vs A3PE3000-2PQG208I)
Notas de projeto
The A3PE3000 uses a 1.5V core supply with separate I/O supply (VCCI) and flash programming supply (VPP) rails per the ProASIC3E datasheet. Provide independent regulated rails with decoupling at each bank, and sequence I/O voltage per the datasheet power-up requirements to avoid latch-up. For battery or always-on systems, evaluate the A3PE3000L-PQ208I low-power variant: same footprint, reduced standby current. Run Microchip's power calculator in Libero SoC with your actual utilization, toggle rates, and I/O loading rather than relying on worst-case family numbers, since ProASIC3E static power is utilization-dependent.
The 208-pin PQFP has a 0.5 mm lead pitch, so specify solder-mask-defined pads per Microchip/Microsemi PQFP layout guidance and verify paste aperture design to prevent bridging on adjacent leads. Fan out on at least two signal layers with dedicated ground plane; keep VCC/VCCI decoupling (100 nF per supply pin cluster plus bulk) within 2 mm of device perimeters. The 28 x 28 mm body with 3.4 mm height needs clearance for inspection fixtures - a benefit over BGAs that simplifies rework during prototyping. Maintain JTAG header access for in-system flash programming.
Do not specify this part for new RoHS-constrained builds: the PQ208I contains lead and is RoHS non-compliant per distributor part records - use A3PE3000-2PQG208I (green, industrial) instead, which is pin-compatible per FindIC. Also, the I suffix denotes industrial range; substituting the commercial-only A3PE3000-PQ208 into an industrial board violates the -40C to +85C requirement. When migrating speed grades (-1/-2), re-run timing analysis in Libero SoC because worst-case delays differ even though the footprint is identical.
Informações de conformidade
Per digichip and datasheets.com records: Lead Free Status Contains Lead, RoHS Status RoHS Non-Compliant. Cross-reference data shows the Xecor entry for the FGG484 sibling as RoHS Yes / REACH compliant, but that compliance does not transfer to this leaded PQ208I package.
