A3PE3000-2PQG208I - 3M-Gate Flash FPGA, 147 I/O | Microchip
MPN: A3PE3000-2PQG208I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $132.5 | $132.50 |
| 10 | $121.4 | $1,214.00 |
| 100 | $109.8 | $10,980.00 |
| 500 | $98.6 | $49,300.00 |
| 1,000 | $89.25 | $89,250.00 |
Drop-in alternatives for A3PE3000-2PQG208I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000-PQG208
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View Datasheet →A3PE3000-PQ208I
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$364 / Unit
View Datasheet →A3PE3000-PQG208X3
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$128 / Unit
View Datasheet →M1A3PE3000-2PQG208I
✅ Drop-In📋 Reference alternative (not in catalog)
M1A3PE3000L-PQG208
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE3000L-PQ208I
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$89.75 / Unit
View Datasheet →A3PE3000-2PQG208I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E |
| System Gates | 3000000 (3M) |
| Logic Capacity | 516096 |
| User I/O | 147 |
| Maximum System Frequency | 310 MHz |
| Speed Grade | -2 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Configuration Technology | Flash (non-volatile, reprogrammable) |
| Package | 208-BFQFP (PQG208), gull-wing, square |
| Terminal Form | Gull Wing |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (Industrial) |
| Temperature Grade | Industrial (I suffix) |
| Lead Free | Yes (G suffix, LEAD FREE per Mouser) |
| Packaging | Tray |
| RoHS Status | Compliant (lead free) |
A3PE3000-2PQG208I 208-bfqfp (pqg208), gull-wing, square Pin Configuration Guide
Complete pinout information for A3PE3000-2PQG208I (208-bfqfp (pqg208), gull-wing, square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000-2PQG208I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000-2PQG208I is suitable for 6 applications: Industrial Control and Automation, Networking and Communications Equipment, Avionics and Aerospace Interfaces, ASIC Prototyping and Low-Volume ASIC Replacement, Medical Instrumentation, Computing and Embedded Systems Glue Logic.
Industrial Control and Automation
The A3PE3000-2PQG208I fits industrial control and factory automation systems where the -40C to +85C industrial temperature rating and 3M-gate capacity handle motor sequencing, encoder interfaces, and safety interlock logic. Its non-volatile flash configuration means control cards power up functional immediately after a brownout - critical for equipment that must resume deterministically without reconfiguration downtime. With 147 user I/Os at up to 310 MHz internal performance, one device can absorb glue logic, counters, and communication bridges previously spread across multiple CPLDs and ASICs, cutting BOM cost. The 208-pin PQFP gull-wing package also suits the rework-friendly assembly typical of industrial boards with long service lifetimes.
Recommended
Networking and Communications Equipment
In networking and communications line cards, the A3PE3000-2PQG208I implements interface bridging, packet framing, and control-plane glue logic between PHYs, MACs, and backplane connectors. Microchip explicitly positions ProASIC3E for the networking/communications market, and the -2 speed grade supports internal system clocks up to 310 MHz, adequate for many framing and FIFO-management tasks. Flash storage eliminates the configuration-readback security exposure of SRAM FPGAs at power-up, a benefit for carrier equipment. Designers should note the PQFP-208 lead inductance is higher than BGA packages, so I/O signaling above a few hundred MHz edge rates warrants signal-integrity simulation before committing the footprint.
Recommended
Avionics and Aerospace Interfaces
For avionics subsystems, the A3PE3000-2PQG208I offers flash-based, single-chip programmable logic that Microchip targets at the avionics market. The instant-on flash configuration removes external boot PROMs, reducing component count in flight-hardware designs where every net adds qualification burden. The 3M-gate fabric comfortably implements ARINC-style bus interfaces, discrete-to-digital conditioning, and built-in-test logic, while the industrial -40C to +85C rating covers unpressurized equipment bays for many programs. The ceramic-compatible reflow profile of the PQFP and long Microchip product-longevity commitments support the multi-year production and sustainment schedules typical of aerospace programs. Program-specific screening must be arranged with the manufacturer.
Recommended
ASIC Prototyping and Low-Volume ASIC Replacement
The ProASIC3E family is explicitly marketed as a cost-effective ASIC replacement, and the A3PE3000-2PQG208I serves this role for designs of roughly 3 million gates that would be uneconomical as masked ASICs at low volumes. Because configuration is flash-based, a prototype board behaves identically in the lab and in the field - no JTAG chain configuration at every power cycle. Designers can iterate RTL in Libero SoC and reprogram the same physical device, compressing debug cycles. The 147 I/Os and 310 MHz (-2) performance cover a broad range of ASIC-interface emulations, and the PQFP-208 socket-friendly gull-wing package allows quick device swaps on prototype boards.
Recommended
Medical Instrumentation
Medical diagnostic and monitoring equipment benefits from the A3PE3000-2PQG208I's deterministic, instant-on behavior and secure on-chip flash configuration, which avoids configuration-stream interception concerns in devices handling patient data interfaces. The 3M-gate fabric implements sensor front-end timing, filter accelerators, and USB or UART bridging between analog front-ends and host processors, while the industrial temperature range covers autoclave-adjacent lab equipment and unconditioned portable devices. The PQFP-208 gull-wing package supports the inspection-friendly, reworkable assembly processes favored in medical hardware validation, and Microchip's long-lifecycle commitments align with the multi-year regulatory certification cycles these products require.
Recommended
Computing and Embedded Systems Glue Logic
In computing platforms and embedded single-board computers, the A3PE3000-2PQG208I consolidates bus translation, reset supervision, boot-sequencing, and legacy interface emulation (PCI-style addressing, local buses, legacy serial) into one reprogrammable device. Instant-on flash configuration means the FPGA is ready before the host CPU completes reset, avoiding external configuration controllers in the power-sequencing chain. The 1.5V core on 130nm process keeps static power modest, and the -2 speed grade's 310 MHz ceiling covers typical bridge clock domains. With 147 I/Os, one PQFP-208 device can replace several smaller CPLDs, simplifying spare-parts logistics for long-lived embedded product lines.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000-2PQG208I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000-PQG208 | A3PE3000-PQ208I | M1A3PE3000-2PQG208I | M1A3PE3000L-PQG208 | A3PE3000L-PQ208I |
|---|---|---|---|---|---|---|
| Package | 208-BFQFP (PQG208) | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Brand | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) |
| System Gates | 3M | 3M | 3M | 3M | 3M | 3M |
| User I/O | 147 | 147 | 147 | 147 | 147 | 147 |
| Max System Frequency | 310 MHz (speed -2) | Lower speed grade | 231 MHz | 310 MHz (speed -2) | [DATA_NEEDED] | [DATA_NEEDED] |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V (L low-power variant) | 1.5 V (L low-power variant) |
| Temperature Range | -40C to +85C (Industrial) | [DATA_NEEDED] (no I suffix) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | [DATA_NEEDED] | -40C to +85C (Industrial) |
| Special Features | Flash non-volatile, LAPU, speed -2 | Flash non-volatile, LAPU | Flash non-volatile, LAPU | Adds Cortex-M1 soft-CPU support | Cortex-M1 + low-power L grade | Low-power L grade |
Key Differentiators
- Fastest speed grade in PQFP-208 footprint (vs A3PE3000-PQ208I)
- Soft-CPU upgrade path without respin (vs M1A3PE3000-2PQG208I)
- True single-chip instant-on operation (vs SRAM FPGAs (not pin-compatible))
Design Notes
The PQFP-208 package has gull-wing leads with higher lead inductance than BGA alternatives such as the FGG484. For I/O edges faster than roughly 500 ps or source-synchronous interfaces above ~100 MHz, simulate reflections and ground bounce, and assign switching I/Os across banks with adequate ground returns. If your design needs faster signaling than the PQFP supports, the same 3M-gate fabric is available in FGG324/FGG484 BGAs, but that requires a PCB respin - not a drop-in change.
Core supply is 1.5V on this 130nm flash process, with separate I/O supply rails per bank. Estimate dynamic power using Microchip's Libero SmartPower tool with your actual toggle rates rather than worst-case assumptions - FPGAs frequently over-estimate when designed with peak clocks on all blocks. Because the -2 speed grade supports 310 MHz internal clocks, unintentionally high clock trees can dominate the power budget; use clock-gating resources in the fabric to trim this. Always decouple each VCC bank with local bulk and 0.1uF ceramic capacitors.
Do not confuse ordering codes: the G suffix denotes lead-free, the I suffix denotes industrial temperature, and the -2 digit denotes speed grade. Substituting a non-I part in an industrial design or a slower speed grade where timing closure was achieved at -2 will fail. Also remember flash configuration means the device is live at power-up - input signals must not arrive before supply rails stabilize, or use external reset control. Verify substitution candidates against the FindIC/DigiKey cross-reference tables and the Microchip ProASIC3E datasheet before releasing a BOM change.
The 208-BFQFP footprint needs a 0.5mm-pitch land pattern with the exposed dimensions from the Microchip ProASIC3E datasheet package section; allow a small fanout channel under all four sides for escape routing on two signal layers. Provide a solid ground plane directly beneath the device to reference the 147 I/Os, and stitch VCC/ground pairs at the corner power pins. Because PQFP leads are hand-probeable, keep JTAG (TDI/TMS/TCK/TDO) accessible on test points for production programming and boundary-scan testing.
Compliance Information
Mouser lists A3PE3000-2PQG208I as LEAD FREE; G suffix in Microchip ordering codes denotes lead-free construction. REACH, halogen-free, and conflict-minerals status not stated in provided data.
