A3PE3000L-PQ208I - 3M-Gate Low-Power Flash FPGA | Microchip
N.º da peça: A3PE3000L-PQ208I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $128.5 | $128,50 |
| 10 | $118.2 | $1.182,00 |
| 100 | $105.9 | $10.590,00 |
| 500 | $96.4 | $48.200,00 |
| 1.000 | $89.75 | $89.750,00 |
A3PE3000L-PQ208I Visão geral
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device. Within the programmable logic hierarchy - FPGA -> programmable logic device -> logic IC -> semiconductor - flash FPGAs occupy the single-chip, Instant-On niche: unlike SRAM FPGAs, they require no external boot flash and are live at power-up (Level 0 support).
Key features include 3,000,000 system gates (75,264 logic cells/CLBs), 504 kbits of true dual-port SRAM, the Flash*Freeze low-power mode that dramatically cuts dynamic power, and a 1.2V core with 1.2V to 1.5V core voltage options. The 130-nm, 7-layer-metal (6 copper) flash-based CMOS process delivers a secure, reprogrammable, single-chip solution with a low total cost of ownership.
Architecturally, the ProASIC3L fabric combines fine-grained Versatile logic elements with embedded true dual-port SRAM blocks, supporting clock rates into the hundreds of MHz range per family data. Because configuration is flash-based, the bitstream is inherently more resistant to cloning than SRAM FPGAs, supporting secure ASIC-replacement designs.
Typical applications include industrial control and automation, networking and communications line cards, avionics and defense systems requiring single-chip instant-on logic, and portable or power-sensitive equipment exploiting Flash*Freeze dynamic power savings.
Design consideration: budget I/O bank assignments early - the PQ208 package exposes 147 of the device's user I/Os, so confirm pin availability against your full I/O list before layout.
This page synthesizes distributor pricing, drop-in PQ208 alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para A3PE3000L-PQ208I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3PE3000L-PQ208I (mesmo formato e footprint) — diferindo em Package, System Gates, Family, RoHS Status, Configuration Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3PE3000L-PQG208I
✅ Drop-In✓ Em estoque
$48.9 / unidade
Ver ficha técnica →A3PE3000L-1PQG208I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3PE3000L-1PQG208
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$162.9 / unidade
Ver ficha técnica →A3PE1500-1PQG208
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →A3PE1500-2PQG208
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$48 / unidade
Ver ficha técnica →A3PE3000L-PQ208I Classificações máximas e características elétricas
| Family | ProASIC3L |
| System Gates | 3,000,000 |
| Logic Cells (CLBs) | 75,264 |
| Total RAM Bits | 516,096 |
| Embedded Memory | 504 kbits True Dual-Port SRAM |
| User I/Os | 147 |
| Tensão de alimentação | 1.14 V to 1.575 V |
| Core Voltage Range | 1.2 V to 1.5 V |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration Memory | Nonvolatile Flash (Live at Power-Up, Level 0) |
| Logic Family | CMOS |
| Encapsulamento | 208-BFQFP (PQ208) |
| Tipo de montagem | Surface Mount |
| Low Power Feature | Flash*Freeze Technology |
| Max I/Os (Device Family) | 616 |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do A3PE3000L-PQ208I 208-bfqfp (pq208)
Configuração de pinos para A3PE3000L-PQ208I (pacote 208-bfqfp (pq208)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3PE3000L-PQ208I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3PE3000L-PQ208I é adequado para 6 aplicaçãos: Industrial Control and Automation, Networking and Communications, Avionics and Defense Electronics, Portable and Battery-Powered Instruments, ASIC Prototyping and Emulation, Medical and Diagnostic Equipment.
Industrial Control and Automation
The A3PE3000L-PQ208I fits factory automation controllers where deterministic, instant-on logic and long product life matter. Its 3M gates and 75,264 logic cells absorb protocol bridging (e.g., fieldbus-to-Ethernet glue), encoder interpolation, and safety interlock logic in one chip, while the 504 kbits of true dual-port SRAM buffer sensor data streams. The industrial 'I' grade and 1.14V to 1.575V supply tolerance ride through brownout-prone factory power. Because configuration is on-chip flash, a power glitch does not force a multi-hundred-millisecond reload like SRAM FPGAs - the design is live at power-up Level 0, so a PLC backplane sees valid I/O behavior within microseconds of power application.
Recomendado
Networking and Communications
Line cards and aggregation equipment use the A3PE3000L-PQ208I to implement framing, deserialization glue, and board-level housekeeping logic. The 516,096-bit embedded true dual-port SRAM implements FIFOs and descriptor rings for packet buffering, while 147 user I/Os cover the modest I/O counts of 1G and below PHY interfaces in the compact PQ208 footprint. Flash-based security helps operators meet supply-chain-integrity requirements since the bitstream never appears on an external configuration bus. Flash*Freeze mode lets dormant ports shut off dynamic power during low-traffic periods, an estimated 10x-to-100x dynamic power reduction in that state per family marketing data, easing chassis thermal budgets.
Recomendado
Avionics and Defense Electronics
Avionics subsystems value the A3PE3000L's single-chip, Instant-On behavior: there is no configuration device to fail in vibration-prone environments and no boot latency in critical power-up sequences. The 3M-gate fabric implements sensor interfaces, ARINC-style glue logic, and built-in-test engines, while the 130-nm flash process and Secure-provisioned bitstream resist cloning. Microchip's long-life FPGA programs and the PQ208's 1.0 mm-pitch gull-wing package suit high-reliability assembly and inspection. FPGAX and Microchip USA specifically support aerospace and defense sourcing with traceability for this MPN, simplifying DMSMS management across program lifetimes.
Recomendado
Portable and Battery-Powered Instruments
Handheld instruments, dataloggers, and unmanned-system payloads exploit the Flash*Freeze technology of the A3PE3000L-PQ208I. In Flash*Freeze the device retains SRAM contents and I/O states while cutting dynamic power dramatically, letting a design sleep between measurement cycles without losing state or paying SRAM FPGA reconfiguration energy. The 1.14V core operation minimizes static consumption, and the single-chip flash configuration removes boot energy and external flash BOM cost. With 3M gates on tap, one device can integrate the acquisition sequencer, display interface glue, and USB/UART bridging that would otherwise need several ASSPs.
Recomendado
ASIC Prototyping and Emulation
As an ASIC replacement, the A3PE3000L-PQ208I gives design teams reprogrammable fabric with an ASIC-like single-chip profile. The 75,264 logic cells accommodate mid-size RTL blocks for FPGA prototyping, while the 504 kbits dual-port SRAM stands in for embedded memories. Because the device is live at power-up, prototypes boot like the final ASIC would, exposing real power-up behavior rather than configuration-delay artifacts. For cost-sensitive consumer or networking ASIC-replacement programs - markets Microchip explicitly targets with the ProASIC3E/3L datasheet - the low total cost of ownership and no external configuration flash reduce system BOM versus SRAM FPGA alternatives.
Recomendado
Medical and Diagnostic Equipment
Benchtop diagnostics, patient-interface boards, and imaging front-end controllers use the A3PE3000L-PQ208I for its deterministic instant-on logic, secure flash bitstream, and quiet 1.14V to 1.575V low-voltage operation that suits mixed-signal boards. The 147 I/Os interface sensor arrays, motor drives, and host links over USB or Ethernet; true dual-port SRAM buffers sample streams for host DMA. Flash*Freeze keeps standby draw low for equipment that idles between patient sessions, and the sealed single-chip flash configuration avoids the wear-out and security concerns of external boot flashes in long-service-life medical capital equipment.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3PE3000L-PQ208I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3PE3000L-PQG208I | A3PE3000L-1PQG208I | A3PE1500-1PQG208 |
|---|---|---|---|---|
| Package | 208-BFQFP (PQ208) | 208-BFQFP (PQ208) - same | 208-BFQFP (PQ208) - same | 208-BFQFP (PQ208) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 1,500,000 |
| Supply Voltage | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.5 V nominal (ProASIC3E) |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | No (standard ProASIC3E) |
| Speed Grade | Standard | Standard | -1 (slower) | -1 (slower) |
| Configuration | On-chip flash, Instant-On | On-chip flash, Instant-On | On-chip flash, Instant-On | On-chip flash, Instant-On |
Principais diferenciais
- Flash*Freeze ultra-low dynamic power (vs A3PE1500-1PQG208)
- Double the logic density in the same footprint (vs A3PE1500-1PQG208)
- Identical die at green-package option (vs A3PE3000L-PQG208I)
Notas de projeto
Provide independent, filtered rails per I/O bank: the ProASIC3L supports mixed-voltage I/O, and PQ208 banks can run at different VCCI levels. Estimate dynamic power with Microchip's Libero power calculator early - a 3M-gate design at full toggle can draw substantially more than the static floor at 1.2V core, and PQ208 thermal dissipation is limited compared to FGG packages with thermal pads. Budget 10-20% rail margin over the calculated worst case.
The PQ208 gull-wing package has 1.0 mm pitch - design land patterns per the Microchip package drawing in DS50003268 and verify with your assembly house for reflow profile. Place 0.1 uF ceramic decoupling at each VCC/VCCI pin pair plus bulk 10 uF per rail; keep core VCC planes solid on layer 2 for lowest impedance. Avoid routing fast signals under the die center where crosstalk couples into many pins.
Flash*Freeze entry requires specific I/O state conditions - review the Flash*Freeze chapter of DS50003268 before wiring the FF pin, or the device may refuse to enter the low-power state. Also remember the PQ208 exposes 147 of up to 616 family I/Os: lock your pin constraints in Libero before PCB route signoff, since re-assigning I/O after layout forces a respin. Do not exceed the 1.575 V absolute supply maximum during bring-up with lab supplies.
Informações de conformidade
RoHS-compliant per Microchip product listing; green-package PQG208I variants available for enhanced environmental requirements.
