A3PE600-2FG484I - 600K-Gate Flash FPGA 484-BGA | Microchip
N.º da peça: A3PE600-2FG484I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $118 | $118,00 |
| 10 | $106.2 | $1.062,00 |
| 100 | $94.4 | $9.440,00 |
| 500 | $86.5 | $43.250,00 |
| 1.000 | $79.9 | $79.900,00 |
A3PE600-2FG484I Visão geral
A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks and programmable interconnects that the designer wires together after manufacturing. Unlike SRAM-based FPGAs, the ProASIC3E family uses nonvolatile flash cells to store the configuration, so it powers up instantly as a single-chip solution with no external boot PROM and no configuration bitstream to load.
Key features include flash-based, live-at-power-up operation, reprogrammability in-system, 1.5V core operation on a 130nm flash process, system performance up to 310 MHz, and low total cost of ownership thanks to the single-chip architecture. The -2 speed grade offers the fastest timing grades available in the ProASIC3E family, supporting high-throughput datapath and interface designs.
Technically, the ProASIC3E fabric combines VersaTiles (fine-grained logic tiles) with embedded block SRAM, supporting synchronous FIFOs and dual-port memories. The flash switch architecture also gives inherently lower static power and better SEU robustness than SRAM FPGAs, which matters in industrial and communications equipment.
Typical applications include industrial automation control, communications and networking line cards, medical instrumentation, aerospace/defense subsystems, and test equipment glue logic consolidation, where instant-on and high I/O count matter.
A key design consideration is power delivery: the 1.5V core rail must be well decoupled, and I/O bank voltages (1.5V to 3.3V) must be planned per bank before pin assignment.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para A3PE600-2FG484I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3PE600-2FG484I (mesmo formato e footprint) — diferindo em Package, Configuration Memory, Operating Temperature, Family, System Gates.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3PE600-2FGG484I
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →A3PE600-FG484I
✅ Drop-In✓ Em estoque
$86.1 / unidade
Ver ficha técnica →A3PE600-FGG484I
✅ Drop-In✓ Em estoque
$44.03 / unidade
Ver ficha técnica →A3PE600-FG484
✅ Drop-In✓ Em estoque
$59 / unidade
Ver ficha técnica →A3PE600L-FGG484M
✅ Drop-In✓ Em estoque
$79.9 / unidade
Ver ficha técnica →A3PE600-2FGG484I
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →A3PE600-2FG484I Classificações máximas e características elétricas
| Family | ProASIC3E |
| System Gates | 600000 |
| Configurable Logic Blocks (CLBs) | 13824 |
| Total User I/O | 270 |
| Maximum System Frequency | 310 MHz |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS flash |
| Configuration Memory | Nonvolatile Flash (single chip, live at power-up) |
| Speed Grade | -2 (fastest standard grade) |
| Encapsulamento | 484-ball FBGA (FG484) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +100C (Industrial, I suffix) |
| Status RoHS | Compliant (RoHS: Yes) |
| HTS Code | 8542310060 |
| ECCN | 3A991.d |
| Country of Origin | PH (Philippines) |
| Supplier Standard Pack | 60 |
Guia de Configuração de Pinos do A3PE600-2FG484I 484-ball fbga (fg484)
Configuração de pinos para A3PE600-2FG484I (pacote 484-ball fbga (fg484)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3PE600-2FG484I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3PE600-2FG484I é adequado para 6 aplicaçãos: Industrial Automation and Control, Communications and Networking Line Cards, Medical Instrumentation, Aerospace and Defense Subsystems, Test and Measurement Equipment, Power Sequencing and System Supervision.
Industrial Automation and Control
The A3PE600-2FG484I fits industrial automation controllers because its flash fabric is live at power-up, so safety interlocks, I/O scanning, and motor enable logic are active the instant 1.5V and I/O rails settle - no boot delay from an external configuration device. With 270 user I/Os and 13,824 CLBs, one device consolidates PLC backplane interfaces, encoder counters, and fieldbus glue logic that would otherwise need multiple ASSPs. Its industrial -40C to +100C rating covers factory-floor cabinets, and the nonvolatile flash configuration improves robustness against configuration upsets relative to SRAM FPGAs. Designers typically pair it with a discrete 1.5V regulator and 3.3V I/O banks for LVTTL field signals, using the -2 speed grade headroom for deterministic scan cycles in the tens of megahertz range.
Recomendado
Communications and Networking Line Cards
In networking equipment, the A3PE600-2FG484I serves as line-card glue: PHY-to-MAC bridging, framing, statistics gathering, and backplane handshaking. The -2 speed grade supports the ~310 MHz-class internal performance needed for parallel datapath processing at gigabit-class aggregate rates, while 270 I/Os cover wide parallel buses to multiple PHY devices. Flash configuration means a line card is operational within the chassis power-good window, simplifying hot-swap bring-up sequencing. The 1.5V core keeps fabric power modest, and per-bank I/O voltages from 1.5V to 3.3V map cleanly onto mixed PHY and backplane voltage domains. For redundant-card designs, the single-chip flash architecture removes the configuration PROM, which is a common field-failure item in high-vibration telecom racks.
Recomendado
Medical Instrumentation
Medical diagnostic devices benefit from the A3PE600-2FG484I's deterministic instant-on behavior: patient-interface supervisory logic and analog front-end sequencing are guaranteed active at first power, which supports safety architecture requirements in devices such as blood analyzers and imaging consoles. The 13,824-CLB fabric implements filter pipelines, trigger engines, and timing generators that offload the host processor, while LVDS-capable I/O banks move high-rate samples from ADCs across isolation boundaries. Because the configuration is stored in on-chip flash, there is no bitstream in external memory to corrupt during electrostatic or power-fault events common in clinical environments. The industrial temperature rating and RoHS-compliant 484-FBGA package suit both benchtop and portable instrument enclosures with conduction-cooled layouts.
Recomendado
Aerospace and Defense Subsystems
ProASIC3E flash FPGAs are widely used in aerospace and defense equipment because the nonvolatile flash switch architecture is inherently more resistant to configuration upset than SRAM-based fabrics, reducing or eliminating the need for external scrubbing hardware. The A3PE600-2FG484I's 600K-gate density and 270 I/Os suit payload interface adapters, telemetry formatting, and bus bridging in space-constrained avionics boxes. Instant-on configuration enables ballistic and flight-critical sequencing logic to be active from the first millisecond of power. The FG484 ball-grid package offers good solder-joint reliability under vibration and thermal cycling when properly mitigated on the PCB. Designers should follow Microchip's military/aerospace application guidance for derating and use Libero SoC timing sign-off at worst-case corners.
Recomendado
Test and Measurement Equipment
Bench and automated test instruments use the A3PE600-2FG484I as a pattern generator, timing sequencer, and protocol engine. The -2 speed grade provides the fastest standard ProASIC3E timing for high-rate stimulus paths, while the abundant I/O drives relays, multiplexers, and level shifters directly from 3.3V LVTTL banks. Because the design loads from internal flash, an instrument powers to a known, safe default state immediately - important for protecting devices under test during brownout events. The 13,824-CLB capacity comfortably hosts serial protocol engines (SPI, I2C, UART expansion) alongside timing-counter arrays. In rack systems, the single-chip architecture simplifies firmware-update logistics: a field update reprograms flash in-system, no socketed configuration device required, cutting service cost over the instrument lifecycle.
Recomendado
Power Sequencing and System Supervision
Multi-rail systems such as servers and baseband cards need sequencing logic active before the main CPU emerges from reset - exactly what the A3PE600-2FG484I delivers with its live-at-power-up flash fabric. The device monitors power-good signals, sequences enable pins across up to a dozen rails, and manages reset distribution and margining interfaces, replacing a chain of supervisor ICs and discrete gates with one programmable part. Its 1.5V core draws low static power, acceptable for always-on housekeeping duty, and the -2 grade leaves ample timing margin at the microsecond-scale sequencing clock rates involved. On-chip flash means the sequence policy survives brownouts and field updates load in-system over a maintenance bus, so rail-order changes do not require a board spin.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3PE600-2FG484I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3PE600-2FGG484I | A3PE600-FG484I | A3PE600-FGG484I | A3PE600L-FGG484M |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (FG484) | 484-ball FBGA (FGG484) - same footprint | 484-ball FBGA (FG484) - same footprint | 484-ball FBGA (FGG484) - same footprint | 484-ball FBGA (FGG484) - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| Speed Grade | -2 (fastest) | -2 (fastest) | Standard | Standard | Standard / L-grade |
| User I/O | 270 | 270 | 270 | 270 | 270 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V (L-grade optimized) |
| Configuration | On-chip flash, live at power-up | On-chip flash, live at power-up | On-chip flash, live at power-up | On-chip flash, live at power-up | On-chip flash, live at power-up |
| Green / Halogen-Free Package | No (standard FG484) | Yes (G option) | No | Yes (G option) | Yes (G option) |
Principais diferenciais
- Fastest standard speed grade in the A3PE600 484-pin family (vs A3PE600-FG484I)
- Single-chip instant-on flash configuration (vs SRAM-based FPGAs in similar density)
- Industrial-grade 270-I/O count in one footprint (vs A3PE600-2PQ208I (PQ208 option))
- Green-package alternative with zero layout change (vs A3PE600-2FGG484I)
Notas de projeto
Plan power rails before pin assignment: the 1.5V core rail, I/O bank rails (per-bank 1.5V-3.3V), and any auxiliary rails must each be budgeted. Estimated: core static current for a 600K-gate flash FPGA is typically modest compared to SRAM FPGAs (no configuration current and lower leakage), but dynamic power scales with toggle rate - use Microchip's power calculator with your post-place-and-route netlist for accurate numbers. Decouple each rail with bulk capacitance at the regulator plus 0.1uF ceramics at ball-level feed points around the 484-BGA perimeter.
The 484-BGA requires a defined fanout strategy: approximately 1.0 mm ball pitch means via-in-pad or dog-bone escape is typical. Signal-integrity-critical and high-fanout nets should escape on inner layers with controlled impedance. Follow Microchip/Actel land-pattern guidance in the family datasheet package chapter, and provide the ball A1 corner datum clearly on the fabrication drawing to prevent 180-degree mounting errors. For vibration-prone environments, consider corner stitching and underfill evaluation.
Do not mix different I/O voltages within one bank - ProASIC3E I/O banks take a per-bank VCCI, and violations stress the device or corrupt signaling. Assign pin locations in Libero SoC before routing so bank voltages and referenced standards (LVDS pairs need matched-pair pins) are consistent. Also, the -2 speed grade is only the fastest standard grade; do not assume timing closure at 310 MHz for arbitrary logic - run static timing at worst-case corners. Finally, verify the exact suffix (FG vs FGG, I vs commercial) on incoming stock: they are footprint-identical but not interchangeable for temperature or green-assembly requirements.
For LVDS and other differential standards, keep intra-pair skew minimal on the PCB and respect the datasheet AC-coupling/termination topologies. Because the FG484 flyover escape often uses inner-layer routing, define impedance-controlled geometry early (estimated: ~50-ohm single-ended / 100-ohm differential on standard stackups) and cross-check against IBIS models available from Microchip for the ProASIC3E I/O structures.
Informações de conformidade
RoHS: Yes per OnlineComponents.com distributor data. HTS 8542310060, ECCN 3A991.d, COO PH. REACH and conflict-minerals status not stated in provided data.