A3PE600-2FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
N.º da peça: A3PE600-2FGG256 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $40.7 | $40,70 |
| 10 | $38.66 | $386,60 |
| 100 | $36.73 | $3.673,00 |
| 500 | $34.89 | $17.445,00 |
| 1.000 | $33.15 | $33.150,00 |
A3PE600-2FGG256 Visão geral
A flash-based FPGA is a field programmable gate array whose configuration is stored in on-chip flash memory rather than SRAM. Unlike SRAM FPGAs, flash FPGAs are non-volatile and single-chip: they configure instantly at power-up, require no external boot PROM, and are inherently more secure because the bitstream never needs to be loaded externally. Within the programmable logic hierarchy, the A3PE600 sits at the low-to-mid density tier of the ProASIC3E family, below the A3PE1500 and A3PE3000.
Key differentiating features include live reprogrammability via on-chip flash, low total cost of ownership through single-chip integration, abundant embedded memory, and support for industrial temperature operation in a compact 17 x 17 mm footprint class package. The speed grade -2 suffix denotes a standard performance bin within the family, supporting system clock rates up to 310 MHz for typical designs.
Architecturally, the device is built from a sea of versatile logic elements organized into tiles, with flash switches providing the routing configuration. The ProASIC3E variant adds embedded SRAM blocks, supporting FIFOs and dual-port memories commonly required in data path and interface designs. CMOS flash technology also yields low static power compared to comparable SRAM FPGA architectures.
Typical applications include industrial automation controllers, communications and networking interface bridging, test and measurement instrumentation, medical equipment, and aerospace/defense subsystems requiring secure, instant-on programmable logic.
When designing with this device, plan power sequencing for the 1.5V core and 3.3V I/O banks, and verify I/O standards and bank assignment against the package pinout in the manufacturer datasheet before board layout. Pricing as of 2026-09-02 starts at approximately $40.70 at LCSC (qty 1).
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para A3PE600-2FGG256 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3PE600-2FGG256 (mesmo formato e footprint) — diferindo em Package, Configuration Memory, Process Technology, Operating Temperature, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3PE600-2FGG256I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3PE600-FGG256I
✅ Drop-In✓ Em estoque
$41.8 / unidade
Ver ficha técnica →M1AFS600-2FGG256
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →M1AFS600-1FGG256
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$191.1 / unidade
Ver ficha técnica →M7AFS600-2FGG256
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$274.05 / unidade
Ver ficha técnica →M1AFS1500-2FGG256
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$124.5 / unidade
Ver ficha técnica →M1AFS1500-FGG256
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$172.23 / unidade
Ver ficha técnica →A3PE600-2FGG256 Classificações máximas e características elétricas
| Family | ProASIC3E Flash FPGA |
| System Gates | 600000 |
| Logic Elements (CLBs) | 13824 |
| Maximum System Frequency | 310 MHz |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Number of User I/O | 165 |
| Configuration Memory | On-chip Flash (non-volatile, single-chip) |
| Speed Grade | -2 |
| Encapsulamento | 256-LBGA (FGG256) |
| Tipo de montagem | Surface Mount |
| Reprogrammability | In-system reprogrammable |
| Status RoHS | Compliant |
| Supply Voltage Class | 1.5 V core / 3.3 V I/O class |
Guia de Configuração de Pinos do A3PE600-2FGG256 256-lbga (fgg256)
Configuração de pinos para A3PE600-2FGG256 (pacote 256-lbga (fgg256)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3PE600-2FGG256.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3PE600-2FGG256 é adequado para 6 aplicaçãos: Industrial Automation and Control, Communications and Networking Interfaces, Test and Measurement Instrumentation, Medical Device Electronics, Aerospace and Defense Subsystems, Embedded System Logic Consolidation.
Industrial Automation and Control
In industrial automation, the A3PE600-2FGG256 provides glue logic, motor control interfacing, sensor aggregation, and protocol bridging between field buses and controllers. Its 600K gates and 13824 CLBs absorb encoder decoding, PWM generation, and safety interlock logic, while 165 user I/O connects limit switches, encoders, and communication PHYs. Because configuration resides in on-chip flash, the FPGA is instantly functional at power-up with no boot device - important for machinery that must be ready in milliseconds. The 1.5V core with 3.3V-class I/O banks integrates into standard industrial supply rails, and reprogrammability allows field updates of control logic without board changes, lowering lifetime maintenance cost in factory deployments.
Recomendado
Communications and Networking Interfaces
The A3PE600-2FGG256 fits networking line-card bridging, backplane interfacing, and protocol conversion up to the ProASIC3E family's 310 MHz system performance ceiling. With 165 user I/O, the device terminates parallel data buses, status lines, and management interfaces between MACs, PHYs, and processors. Embedded SRAM blocks in the ProASIC3E variant implement FIFOs and packet buffers needed in data path designs. The flash configuration means the FPGA is live the instant the line card powers up, simplifying hot-swap behavior. Designers should budget I/O banks for the required signaling standards and verify timing in Microchip Libero; at moderate utilization, the -2 speed grade typically closes timing for common interface clock rates without performance tier upgrades.
Recomendado
Test and Measurement Instrumentation
Bench instruments, data acquisition units, and automated test equipment use the A3PE600-2FGG256 for trigger logic, counter/timer functions, and acquisition control. The 310 MHz system frequency supports fine timebase resolution, while the 600K gate capacity implements state machines, memory controllers, and interface logic in one device. Instant-on flash configuration ensures the instrument front-end is functional immediately at power-up, matching user expectations for standby-ready instruments. The 256-ball FGG256 package offers a dense 1.0 mm-pitch ball field that conserves PCB area in portable and rack instruments. Field updates through the on-chip flash let manufacturers ship instrument feature upgrades without recalling hardware, a meaningful service-cost advantage over OTP or mask-based solutions.
Recomendado
Medical Device Electronics
Patient monitoring, diagnostic imaging support electronics, and laboratory analyzers benefit from the A3PE600-2FGG256's deterministic, non-volatile operation. The single-chip flash FPGA eliminates the external configuration chain, reducing the component count subject to design-history documentation and simplifying failure analysis. Its 165 I/O manage sensor arrays, front-end control signals, and communication ports, while 600K gates implement filtering, framing, and interface logic. Instant-on behavior means monitoring channels are active as soon as power is applied - a regulatory and safety advantage. Designers should validate the device's temperature grade against the product's environmental specifications and follow Microchip reliability documentation for medical risk analyses, with Libero-verified timing closure across the intended supply and temperature corners.
Recomendado
Aerospace and Defense Subsystems
Flash FPGAs are favored in aerospace and defense for their instant-on behavior, single-chip integration, and configuration security - the bitstream resides in on-chip flash and is never exposed on an external bus at boot. The A3PE600-2FGG256 supports payload interfacing, telemetry formatting, and redundant-sensor voting logic within its 600K gates and 13824 CLBs. The compact 256-ball FGG256 footprint suits size- and weight-constrained avionics modules. The related M7 security-focused Fusion variants in the same footprint offer additional protection features where design security policy requires them. For flight programs, verify the exact screening and temperature grade options (such as the -I industrial grade) available through Microchip's aerospace channels and plan qualification around the documented family reliability reports.
Recomendado
Embedded System Logic Consolidation
General embedded designs often accumulate several CPLDs, PALs, and discrete glue-logic devices across revisions; the A3PE600-2FGG256 consolidates them into one reprogrammable 600K-gate device, cutting BOM lines and board area. The 165 user I/O absorb address decoding, bus translation, interrupt aggregation, and reset control, while the on-chip flash removes the programming connector complexity of SRAM alternatives. Because ProASIC3E is supported end-to-end in Microchip Libero SoC, existing HDL can be re-targeted quickly, and the 310 MHz performance ceiling comfortably covers typical glue-logic timing. Single-chip instant-on operation removes boot-order dependencies that often complicate multi-FPGA or MCU-plus-FPGA power architectures, simplifying system bring-up and firmware dependency documentation.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3PE600-2FGG256 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3PE600-2FGG256I | A3PE600-FGG256I | M1AFS600-2FGG256 | M7AFS600-2FGG256 |
|---|---|---|---|---|---|
| Package | 256-LBGA (FGG256) | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same | 256-ball FGG256 - same | 256-ball FGG256 - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 (Fusion) | 1500000 |
| Speed Grade | -2 | -2 | -1 | -2 | -2 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Family / Feature Set | ProASIC3E (logic + embedded memory) | ProASIC3E - identical | ProASIC3E - identical | Fusion - adds analog + flash peripherals | Fusion M7 - security-focused |
Principais diferenciais
- True single-chip instant-on operation (vs SRAM FPGAs (e.g., Xilinx Spartan-class))
- Industrial grade drop-in availability (vs A3PE600-2FGG256I)
- Footprint-compatible upgrade path (vs M1AFS1500-2FGG256)
Notas de projeto
Power the A3PE600-2FGG256 core at 1.5V with I/O banks at their required standards (commonly 3.3V-class). Sequence the core rail per the ProASIC3E power-up requirements in the datasheet and add bulk plus 0.1uF/0.01uF decoupling per supply group. Flash-based ProASIC3E devices draw low static power versus SRAM FPGAs, but dynamic power scales with clock frequency and routing activity - use the Microchip power estimator with your Libero netlist before finalizing the regulator budget, and derate for worst-case ambient in enclosed industrial housings.
The 256-ball FGG256 uses a 1.0 mm ball pitch; fan out with via-in-pad or dogbone escape on outer layers and plan at least one dedicated ground plane. Assign I/O banks early in Libero so that bank supply rails match your plane splits, and keep configuration/JTAG (FlashPro) header access routed to a connector for field updates. Avoid routing fast single-ended signals under the package center; use contiguous ground stitching for any clock or strobe exits to control emissions and crosstalk.
Do not assume speed-grade interchangeability: the -1 grade (e.g., A3PE600-FGG256I) may fail timing closure for designs meeting the -2 grade's constraints. Also, Fusion-family same-footprint devices (M1AFS600/M7AFS600) are not guaranteed pin-for-pin with ProASIC3E - always re-verify ball assignments and bank supplies before a no-redesign swap. Finally, designs near 80% utilization of the 600K device often fail place-and-route late; leave routing headroom or plan migration to A3PE1500/A3PE3000 within the same Libero flow.
Informações de conformidade
Distributor listings indicate RoHS-compliant, lead-free 256-LBGA packaging; REACH and conflict minerals status should be confirmed via Microchip's product compliance portal for the exact ordering code.