M7AFS600-2FGG256 - 600K Gate Fusion FPGA with ARM | Microchip
MPN: M7AFS600-2FGG256 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $274.05 | $274.05 |
| 10 | $274.05 | $2,740.50 |
| 100 | $274.05 | $27,405.00 |
| 500 | $274.05 | $137,025.00 |
| 1,000 | $274.05 | $274,050.00 |
Drop-in alternatives for M7AFS600-2FGG256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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M7AFS600-FGG256I
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View Datasheet →M7AFS600-FGG256
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$232.4 / Unit
View Datasheet →M7AFS600-1FGG256
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$92 / Unit
View Datasheet →M7AFS600-2FG256
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$135.1 / Unit
View Datasheet →M7AFS600-1FG256I
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$308.6 / Unit
View Datasheet →M7AFS600-2FGG256 Maximum Ratings & Electrical Characteristics
| Family | Fusion Mixed-Signal FPGA |
| System Gates | 600K |
| Processor Core | ARM CoreMP7 |
| User I/O | 119 |
| Dedicated Logic Bits | 110592 bits |
| Speed Grade | -2 |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) |
| Technology | 130 nm flash-based |
| Configuration | Flash-based (nonvolatile, instant-on) |
| Package | 256-LBGA (FBGA-256, 17x17 mm) |
| Mounting Type | Surface Mount (SMD/SMT) |
| Operating Temperature | 0C to +70C |
| Packaging | Tray |
| Manufacturer Standard Lead Time | 16 Weeks (per Mouser, as of 2026-09-02) |
| Programmable Type | In-System Programmable (ISP) |
| Supplier Device Package | 256-FBGA |
M7AFS600-2FGG256 256-fbga Pin Configuration Guide
Complete pinout information for M7AFS600-2FGG256 (256-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M7AFS600-2FGG256.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M7AFS600-2FGG256 is suitable for 6 applications: Industrial Automation Controller, Power Supply Management and Telemetry, Embedded System Prototyping, Medical Instrumentation, Networking and Telecom Line Cards, Test and Measurement Instrumentation.
Industrial Automation Controller
The M7AFS600-2FGG256 fits industrial controller designs because it combines 600K gates of programmable logic with an ARM CoreMP7 processor on one flash-based die, eliminating a separate MCU and boot flash. Its 119 user I/Os drive motor-control PWM, quadrature encoders, and fieldbus interfaces, while the Fusion analog subsystem monitors supply voltages and die temperature for predictive maintenance. In a typical topology the CoreMP7 runs the communication stack and diagnostics at up to 100 MHz, and the fabric implements deterministic motion-control state machines. Flash configuration provides instant-on startup, so the controller is live within milliseconds of power application - a measurable benefit for machines requiring fast line recovery. Industrial 3.3V/2.5V I/O banks interface directly with sensors and actuators without level-shifting glue logic.
Recommended
Power Supply Management and Telemetry
The Fusion family was designed specifically for power-supply management: the M7AFS600-2FGG256 integrates on-chip voltage, current, and temperature monitoring via its analog rack circuits, so a single 600K-gate device can sequence, supervise, and telemetry-log multiple rails. With 119 I/Os it can drive PWM fan controls, gate drivers, I2C/PMBus telemetry to a host, and fault interrupts. Unlike a discrete supervisory solution, the ARM CoreMP7 executes adaptive control firmware while the fabric implements cycle-accurate PWM and protection comparators with microsecond response. The flash-based fabric is live at power-up, meaning sequencing logic is active before any external processor boots - a key requirement for backplanes and high-availability systems. Commercial 0C to +70C rating suits telecom indoor equipment; use the FGG256I variant for outdoor plants.
Recommended
Embedded System Prototyping
For embedded prototyping, the M7AFS600-2FGG256 offers a single-chip SoC: 600K gates of fabric for custom peripherals, an ARM CoreMP7 for firmware, and 110592 bits of embedded resources - enough to model full product logic before committing to a custom board. The 17x17 mm 256-FBGA lands on mainstream 4-6 layer prototyping PCBs, and flash configuration means no configuration PROM on the prototype, reducing BOM and solder steps. Engineers iterate hardware logic in Libero SoC and firmware with ARM toolchains against the same die that production uses, removing emulation risk. The 119 I/Os expose sufficient pins for memory buses, displays, and sensor headers. Note the -2 speed grade is adequate for most peripheral prototyping; timing closure above roughly 100 MHz fabric clocks should be verified in Designer.
Recommended
Medical Instrumentation
Benchtop medical instruments such as analyzers and patient-interface test rigs benefit from the M7AFS600-2FGG256's mixed-signal integration: the analog monitoring blocks track internal supply health and board temperature, supporting the self-test routines required in IEC-governed lab equipment, while the ARM CoreMP7 runs the user-interface state machine and the fabric handles sensor interfaces and filters. Flash configuration removes configuration readout concerns because bitstream data is not stored in an external SRAM-configured device, aiding design-protection goals common in commercial medical products. The 119 I/Os connect ADCs, displays, and communication ports in one device, cutting board area in portable analyzers. The commercial 0C to +70C range matches typical indoor laboratory environments; outdoor or ambulance-mounted units should specify the industrial FGG256I variant.
Recommended
Networking and Telecom Line Cards
Telecom line cards and network interface boards use the M7AFS600-2FGG256 as glue-plus-control logic: the 600K-gate fabric implements framing, polling, and LED/status engines across its 119 I/Os, while the ARM CoreMP7 manages I2C/SMD-PMD management buses and firmware-updatable policies. The flash fabric is active at power-up, so the board can arbitrate power and inventory EEPROM reads before a network processor finishes booting - useful for hot-swap line-card insertion sequencing. The Fusion analog monitors backplane supply voltages and reports telemetry to shelf management per typical ATCA-style architectures. The commercial temperature rating and 1.5 V core (1.425 V to 1.575 V tolerance) match conditioned central-office environments. The 256-FBGA with 0.8 mm fine pitch conserves line-card real estate at high I/O density.
Recommended
Test and Measurement Instrumentation
In test and measurement equipment, the M7AFS600-2FGG256 serves as the real-time control and acquisition sequencer: the 600K-gate fabric triggers, time-stamps, and routes signals across 119 I/Os with deterministic latency, while the ARM CoreMP7 handles SCPI command parsing and LAN/USB communication stacks at up to 100 MHz. The Fusion analog blocks continuously verify internal rail accuracy, which matters for an instrument's self-calibration logging. Flash configuration gives instant-on readiness so the instrument responds to triggers immediately after power-up - important in automated test systems with short dwell windows. The 130 nm flash fabric also avoids configuration-file exposure in shared laboratory environments. For bench instruments, the 0C to +70C rating is sufficient; rack-mounted outdoor cabinets should use the -40C to +100C FGG256I version.
Recommended
Recommended Products Summary
Engineering reference data for M7AFS600-2FGG256 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M7AFS600-FGG256I | M7AFS600-FGG256 | M7AFS600-1FGG256 | M7AFS600-2FG256 |
|---|---|---|---|---|---|
| Package | 256-LBGA (FBGA-256, 17x17 mm) | 256-LBGA (FBGA-256) - same footprint | 256-LBGA (FBGA-256) - same footprint | 256-LBGA (FBGA-256) - same footprint | 256-LBGA (FBGA-256, 1.0 mm pitch) |
| Brand | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) |
| System Gates | 600K | 600K | 600K | 600K | 600K |
| User I/O | 119 | 119 | 119 | 119 | 119 |
| Speed Grade | -2 | -2 class | Standard | -1 | -2 |
| Operating Temperature | 0C to +70C | -40C to +100C | 0C to +70C | 0C to +70C | 0C to +70C |
| Core Supply Voltage | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) |
| Configuration | Flash-based, nonvolatile, instant-on | Flash-based, nonvolatile | Flash-based, nonvolatile | Flash-based, nonvolatile | Flash-based, nonvolatile |
| Reference Unit Price (as of 2026-09-02) | $274.05 (90-qty, Mouser) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Integrated ARM CoreMP7 plus mixed-signal analog on one flash die (vs A3P600-2FG256)
- Industrial temperature option on identical footprint (vs M7AFS600-FGG256I)
- -2 speed grade fabric performance (vs M7AFS600-1FGG256)
- Nonvolatile flash configuration (no boot PROM) (vs SRAM FPGAs (e.g., Xilinx/Altera equivalents))
Design Notes
The M7AFS600-2FGG256 core requires a tightly regulated 1.5 V rail (1.425 V to 1.575 V per Mouser listing). Because this is a flash-based FPGA with instant-on behavior, core power is drawn from the moment supply ramps; include a supervisor or use a sequencing-compliant regulator to guarantee monotonic rise. I/O banks need their own 3.3V/2.5V/1.8V rails depending on bank standard - confirm bank assignment in Libero before fixing regulators. Budget decoupling per the Fusion power application guidance: bulk capacitance near the package plus per-ball high-frequency ceramics on the 17x17 mm FBGA.
The FGG256 suffix denotes the fine-pitch 0.8 mm ball-pitch 256-FBGA; the non-G FG256 uses a 1.0 mm pitch. These land patterns are NOT interchangeable - double-check your footprint before ordering substitutions. For the 17x17 mm 256-ball BGA, use a minimum 6-layer stack with dedicated Via-in-Pad or dog-bone escape routing, and tie the package center/ground balls to a solid ground plane for signal return. Follow the Fusion family PCB layout guidelines in the manufacturer datasheet for BGA escape and power-plane segmentation.
Three recurring pitfalls: (1) The commercial suffix (-2FGG256, no I) is rated only 0C to +70C - industrial deployments must switch to M7AFS600-FGG256I, which is footprint-identical. (2) Flash FPGAs program via JTAG with FlashPro; omitting the programming header or under-sizing the JTAG series resistors causes field-reprogramming failures. (3) Mouser lists a 90-piece minimum order multiple and 16-week lead time - order quantities must respect the 90-piece tray multiple, and DigiKey notes quote-gated orders cannot be canceled or returned, so verify stock and lead time before committing.
Estimated: a 600K-gate Fusion device at moderate utilization typically dissipates on the order of 1-2 W (exact figure depends on toggle rate and I/O loading - confirm with the Microchip power estimator for your design). A 17x17 mm 256-FBGA on a multilayer PCB relies primarily on via arrays under the package thermal balls and ground planes for heat spreading. If your estimated junction temperature approaches the +70C commercial limit (junction rise plus ambient), move to the industrial FGG256I variant, which carries a +100C ceiling and provides thermal margin at no footprint cost.
Compliance Information
Compliance data not explicitly stated in the retrieved web results for this exact MPN. Verify RoHS/lead-free status on the Microchip product page or distributor environmental datasheet before ordering.
