A3PE600-2FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
MPN: A3PE600-2FGG256 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $40.7 | $40.70 |
| 10 | $38.66 | $386.60 |
| 100 | $36.73 | $3,673.00 |
| 500 | $34.89 | $17,445.00 |
| 1,000 | $33.15 | $33,150.00 |
Drop-in alternatives for A3PE600-2FGG256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3PE600-2FGG256I
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE600-FGG256I
✅ Drop-In✓ In Stock
$41.8 / Unit
View Datasheet →M1AFS600-2FGG256
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →M1AFS600-1FGG256
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$191.1 / Unit
View Datasheet →M7AFS600-2FGG256
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$274.05 / Unit
View Datasheet →M1AFS1500-2FGG256
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$124.5 / Unit
View Datasheet →M1AFS1500-FGG256
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$172.23 / Unit
View Datasheet →A3PE600-2FGG256 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E Flash FPGA |
| System Gates | 600000 |
| Logic Elements (CLBs) | 13824 |
| Maximum System Frequency | 310 MHz |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Number of User I/O | 165 |
| Configuration Memory | On-chip Flash (non-volatile, single-chip) |
| Speed Grade | -2 |
| Package | 256-LBGA (FGG256) |
| Mounting Type | Surface Mount |
| Reprogrammability | In-system reprogrammable |
| RoHS Status | Compliant |
| Supply Voltage Class | 1.5 V core / 3.3 V I/O class |
A3PE600-2FGG256 256-lbga (fgg256) Pin Configuration Guide
Complete pinout information for A3PE600-2FGG256 (256-lbga (fgg256) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE600-2FGG256.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE600-2FGG256 is suitable for 6 applications: Industrial Automation and Control, Communications and Networking Interfaces, Test and Measurement Instrumentation, Medical Device Electronics, Aerospace and Defense Subsystems, Embedded System Logic Consolidation.
Industrial Automation and Control
In industrial automation, the A3PE600-2FGG256 provides glue logic, motor control interfacing, sensor aggregation, and protocol bridging between field buses and controllers. Its 600K gates and 13824 CLBs absorb encoder decoding, PWM generation, and safety interlock logic, while 165 user I/O connects limit switches, encoders, and communication PHYs. Because configuration resides in on-chip flash, the FPGA is instantly functional at power-up with no boot device - important for machinery that must be ready in milliseconds. The 1.5V core with 3.3V-class I/O banks integrates into standard industrial supply rails, and reprogrammability allows field updates of control logic without board changes, lowering lifetime maintenance cost in factory deployments.
Recommended
Communications and Networking Interfaces
The A3PE600-2FGG256 fits networking line-card bridging, backplane interfacing, and protocol conversion up to the ProASIC3E family's 310 MHz system performance ceiling. With 165 user I/O, the device terminates parallel data buses, status lines, and management interfaces between MACs, PHYs, and processors. Embedded SRAM blocks in the ProASIC3E variant implement FIFOs and packet buffers needed in data path designs. The flash configuration means the FPGA is live the instant the line card powers up, simplifying hot-swap behavior. Designers should budget I/O banks for the required signaling standards and verify timing in Microchip Libero; at moderate utilization, the -2 speed grade typically closes timing for common interface clock rates without performance tier upgrades.
Recommended
Test and Measurement Instrumentation
Bench instruments, data acquisition units, and automated test equipment use the A3PE600-2FGG256 for trigger logic, counter/timer functions, and acquisition control. The 310 MHz system frequency supports fine timebase resolution, while the 600K gate capacity implements state machines, memory controllers, and interface logic in one device. Instant-on flash configuration ensures the instrument front-end is functional immediately at power-up, matching user expectations for standby-ready instruments. The 256-ball FGG256 package offers a dense 1.0 mm-pitch ball field that conserves PCB area in portable and rack instruments. Field updates through the on-chip flash let manufacturers ship instrument feature upgrades without recalling hardware, a meaningful service-cost advantage over OTP or mask-based solutions.
Recommended
Medical Device Electronics
Patient monitoring, diagnostic imaging support electronics, and laboratory analyzers benefit from the A3PE600-2FGG256's deterministic, non-volatile operation. The single-chip flash FPGA eliminates the external configuration chain, reducing the component count subject to design-history documentation and simplifying failure analysis. Its 165 I/O manage sensor arrays, front-end control signals, and communication ports, while 600K gates implement filtering, framing, and interface logic. Instant-on behavior means monitoring channels are active as soon as power is applied - a regulatory and safety advantage. Designers should validate the device's temperature grade against the product's environmental specifications and follow Microchip reliability documentation for medical risk analyses, with Libero-verified timing closure across the intended supply and temperature corners.
Recommended
Aerospace and Defense Subsystems
Flash FPGAs are favored in aerospace and defense for their instant-on behavior, single-chip integration, and configuration security - the bitstream resides in on-chip flash and is never exposed on an external bus at boot. The A3PE600-2FGG256 supports payload interfacing, telemetry formatting, and redundant-sensor voting logic within its 600K gates and 13824 CLBs. The compact 256-ball FGG256 footprint suits size- and weight-constrained avionics modules. The related M7 security-focused Fusion variants in the same footprint offer additional protection features where design security policy requires them. For flight programs, verify the exact screening and temperature grade options (such as the -I industrial grade) available through Microchip's aerospace channels and plan qualification around the documented family reliability reports.
Recommended
Embedded System Logic Consolidation
General embedded designs often accumulate several CPLDs, PALs, and discrete glue-logic devices across revisions; the A3PE600-2FGG256 consolidates them into one reprogrammable 600K-gate device, cutting BOM lines and board area. The 165 user I/O absorb address decoding, bus translation, interrupt aggregation, and reset control, while the on-chip flash removes the programming connector complexity of SRAM alternatives. Because ProASIC3E is supported end-to-end in Microchip Libero SoC, existing HDL can be re-targeted quickly, and the 310 MHz performance ceiling comfortably covers typical glue-logic timing. Single-chip instant-on operation removes boot-order dependencies that often complicate multi-FPGA or MCU-plus-FPGA power architectures, simplifying system bring-up and firmware dependency documentation.
Recommended
Recommended Products Summary
Engineering reference data for A3PE600-2FGG256 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE600-2FGG256I | A3PE600-FGG256I | M1AFS600-2FGG256 | M7AFS600-2FGG256 |
|---|---|---|---|---|---|
| Package | 256-LBGA (FGG256) | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same | 256-ball FGG256 - same | 256-ball FGG256 - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 (Fusion) | 1500000 |
| User I/O | 165 | 165 | 165 | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade | -2 | -2 | -1 | -2 | -2 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Family / Feature Set | ProASIC3E (logic + embedded memory) | ProASIC3E - identical | ProASIC3E - identical | Fusion - adds analog + flash peripherals | Fusion M7 - security-focused |
| Temperature Grade | Standard (commercial) | Industrial (I) | Industrial (I) | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- True single-chip instant-on operation (vs SRAM FPGAs (e.g., Xilinx Spartan-class))
- Industrial grade drop-in availability (vs A3PE600-2FGG256I)
- Footprint-compatible upgrade path (vs M1AFS1500-2FGG256)
Design Notes
Power the A3PE600-2FGG256 core at 1.5V with I/O banks at their required standards (commonly 3.3V-class). Sequence the core rail per the ProASIC3E power-up requirements in the datasheet and add bulk plus 0.1uF/0.01uF decoupling per supply group. Flash-based ProASIC3E devices draw low static power versus SRAM FPGAs, but dynamic power scales with clock frequency and routing activity - use the Microchip power estimator with your Libero netlist before finalizing the regulator budget, and derate for worst-case ambient in enclosed industrial housings.
The 256-ball FGG256 uses a 1.0 mm ball pitch; fan out with via-in-pad or dogbone escape on outer layers and plan at least one dedicated ground plane. Assign I/O banks early in Libero so that bank supply rails match your plane splits, and keep configuration/JTAG (FlashPro) header access routed to a connector for field updates. Avoid routing fast single-ended signals under the package center; use contiguous ground stitching for any clock or strobe exits to control emissions and crosstalk.
Do not assume speed-grade interchangeability: the -1 grade (e.g., A3PE600-FGG256I) may fail timing closure for designs meeting the -2 grade's constraints. Also, Fusion-family same-footprint devices (M1AFS600/M7AFS600) are not guaranteed pin-for-pin with ProASIC3E - always re-verify ball assignments and bank supplies before a no-redesign swap. Finally, designs near 80% utilization of the 600K device often fail place-and-route late; leave routing headroom or plan migration to A3PE1500/A3PE3000 within the same Libero flow.
Compliance Information
Distributor listings indicate RoHS-compliant, lead-free 256-LBGA packaging; REACH and conflict minerals status should be confirmed via Microchip's product compliance portal for the exact ordering code.