AT25DF641A-SH-T - 64Mbit SPI/Quad SPI NOR Flash, SOIC-8 | Renesas
N.º da peça: AT25DF641A-SH-T ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1.42 | $1,42 |
| 10 | $1.27 | $12,70 |
| 100 | $1.1 | $110,00 |
| 500 | $0.95 | $475,00 |
| 1.000 | $0.82 | $820,00 |
AT25DF641A-SH-T Visão geral
A NOR flash memory is a non-volatile storage technology in which the cells are wired in parallel (unlike NAND), giving byte-level random read access at the cost of larger cell area. Within the memory hierarchy, this places NOR above NAND in read granularity and below DRAM/SRAM in write speed. "Serial" NOR further packages that array behind a low-pin-count SPI interface, replacing legacy parallel-NOR footprints on modern boards; families with "Quad SPI" extend the 4-wire bus to 4 data lines for higher read bandwidth at the same clock.
Key features of the AT25DF641A include 64 Mbit density (8 MB), 100 MHz single-I/O SPI clock, Dual-I/O (DIO) read/program, deep power-down mode below 5 µA typical, 4 KB sector erase granularity, JEDEC manufacturer/device-ID read, and a write-protect pin for hardware security. The SOIC-8 (208 mil, "SH") body is the de-facto industry pinout for SPI flash, dropping directly onto 8-SOIC land patterns rated for hand or reflow soldering.
Internally the device uses a sector-erase architecture with 256-byte page program granularity. A typical application pairs the AT25DF641A as a boot/code-shadow store: the host MCU copies a small bootloader from flash into internal SRAM at reset, then DMA-streams the larger application image from the same flash to external SDRAM for XIP-free execution. The same part also serves as a low-power data-logging sink, where 256-byte page writes minimize per-byte energy.
Typical applications include IoT firmware storage, smart-home hub boot devices, consumer-electronics config/asset logging, industrial HMI code storage, automotive infotainment boot (where AEC-Q100 sister parts such as AT25QF641B are used), and Wi-Fi/BLE module co-storage with the radio SoC. Choose the AT25DF641A-SH-T over SPI NAND when byte-level read access is required (e.g. execute-in-place via QSPI on a Cortex-M4); choose SPI NAND when cost-per-bit dominates.
When laying out the PCB, place a 0.1 µF decoupling capacitor within 5 mm of VCC and keep the SCK trace short and length-matched to the host. Respect tVSL (VCC-min to chip-access) of typically 30 ms after power-up before issuing the first command, and assert /WP or /HOLD only while SCK is low to avoid false framing.
This page synthesizes distributor pricing, same-package drop-in alternatives including the AT25QF641B-SHB-T Quad-SPI successor, and practical design notes not consolidated in any single manufacturer document.
Alternativas drop-in para AT25DF641A-SH-T — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com AT25DF641A-SH-T (mesmo formato e footprint) — diferindo em Interface, Memory Type, Operating Temperature, Package, Supply Voltage (VCC).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
AT25QF641B-SHB-T
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
AT25DF641A-SH-B
✅ Drop-In✓ Em estoque
$1.55 / unidade
Ver ficha técnica →AT25DF081A-SH-B
✅ Drop-In✓ Em estoque
$0.58 / unidade
Ver ficha técnica →W25Q64JVSSIQ
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MX25L6406EZNI-10G
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
SST26VF064B-104I/SM
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
AT25DF641A-SH-T Classificações máximas e características elétricas
| Tipo de memória | NOR Flash |
| Density | 64 Mbit (8 MB) |
| Interface | SPI (Single/Dual I/O), Serial Peripheral Interface compatible |
| Clock Frequency (max) | 100 MHz (Single-I/O) |
| Supply Voltage (VCC) | 2.7 V to 3.6 V (single supply) |
| Temperatura de operação | -40 C to +85 C (industrial) |
| Encapsulamento | 8-SOIC (SOIC-W 208 mil, "SH") |
| Tipo de montagem | Surface Mount |
| Page Size (program) | 256 bytes |
| Sector Erase Sizes | 4 KB / 32 KB / 64 KB uniform |
| Sector Architecture | Uniform 4 KB sectors |
| Write-Protect Pin | Yes (/WP) |
| Hold Pin | Yes (/HOLD) |
| JEDEC ID Read | Yes |
| Nível MSL | 3 (per JEDEC J-STD-020, typical for SOIC flash) |
| Status RoHS | Compliant (Green) |
| Lead-Free | Yes |
| Status do ciclo de vida | Not Recommended for New Designs (NRND), see AT25QF641B-SHB-T |
| Packaging | Tape & Reel (suffix -T) |
Configuração de pinos do AT25DF641A-SH-T
| Pino 1 | /CS — Chip Select, active low; enables SPI communication when pulled low |
| Pino 2 | SO / SIO1 — Serial Output (Single-I/O) or Bidirectional I/O Data 1 (Dual/Quad-I/O) |
| Pino 3 | /WP / SIO2 — Write-Protect (active low) or Bidirectional I/O Data 2 (Quad-I/O) |
| Pino 4 | GND — Ground reference |
| Pino 5 | SI / SIO0 — Serial Input (Single-I/O) or Bidirectional I/O Data 0 (Dual/Quad-I/O) |
| Pino 6 | SCK — Serial Clock from host MCU |
| Pino 7 | /HOLD / SIO3 — Hold (active low, pauses SPI when SCK low) or Bidirectional I/O Data 3 (Quad-I/O) |
| Pino 8 | VCC — Power supply, 2.7 V to 3.6 V |
Aplicações típicas
AT25DF641A-SH-T é adequado para 7 aplicaçãos: IoT Firmware Boot Shadowing, Smart-Home Hub Boot and Config Storage, Consumer Electronics Config / Asset Logging, Industrial HMI Code Storage, Wi-Fi / BLE Module Co-Storage, Automotive Infotainment Boot (AEC-Q100 context), Test & Measurement Data Logging.
IoT Firmware Boot Shadowing
The AT25DF641A-SH-T is well suited to IoT firmware boot-shadowing on Cortex-M0/M4 hosts because its 64 Mbit (8 MB) density holds the full firmware image including calibration tables and OTA staging slots, while the 100 MHz SPI clock lets the MCU DMA-stream the entire 8 MB into external SDRAM in roughly 700 ms. Placed on the SPI bus alongside the radio SoC, the flash also serves as a low-overhead log store between network transactions. Its 256-byte page program granularity aligns with 256-byte sensor frames, letting a single page-write commit a complete IoT telemetry packet atomically. Designers should reserve a 4 KB sector for the factory calibration block and a separate 64 KB block for OTA staging, leveraging the AT25DF641A's uniform 4 KB sector erase to update either block without disturbing the rest of the firmware image.
Recomendado
Smart-Home Hub Boot and Config Storage
Smart-home hubs (Zigbee/Wi-Fi gateways) commonly use the AT25DF641A-SH-T as both a boot source and a config/asset store. The 64 Mbit density comfortably holds the gateway firmware plus pairing tables, network keys, and a small on-device web UI; the SOIC-8 208 mil package drops directly onto the hub mainboard without any footprint rework versus competitor parts. The hardware /WP pin lets the factory lock the boot sector against accidental reprogramming while leaving the config sectors writable. Designers should wire /HOLD to the host GPIO so an in-field firmware update can pause SPI transactions during a power glitch. With 100 MHz Single-I/O SPI throughput of roughly 12.5 MB/s and Dual-I/O doubling that, the gateway can refresh its UI assets from flash in well under a second.
Recomendado
Consumer Electronics Config / Asset Logging
The AT25DF641A-SH-T serves consumer electronics as a config-and-asset-logging flash where a removable SD card is undesirable for cost or vibration reasons. The 8 MB capacity easily absorbs UI graphics, language tables, and a rolling usage-log buffer for warranty analysis, while the SPI interface keeps the host MCU pin count low (only 4 wires: SCK, SI, SO, /CS). With 4 KB sector erase granularity, the host can rewrite the language table sector-by-sector as users change settings, never touching the read-only assets. Industrial temperature (-40 to +85 C) operation makes the AT25DF641A-SH-T suitable for white goods, set-top boxes, and printer control panels where thermal cycling is routine. The /WP pin provides hardware protection for the boot image while leaving user-configurable sectors open.
Recomendado
Industrial HMI Code Storage
Industrial human-machine interface (HMI) panels typically pair the AT25DF641A-SH-T with a Cortex-M7 or Cortex-A5 host to hold both the LVGL/Embedded Wizard graphics library and the runtime configuration. The 64 Mbit (8 MB) capacity is enough for multi-language industrial screens plus alarm-history buffers, and the SPI/Quad-SPI Dual-I/O mode (2x bandwidth) keeps screen-refresh latency low even on a slow AHB bus. Industrial-grade temperature (-40 to +85 C) is mandatory for control cabinets, and the SOIC-8 208 mil package withstands hand-soldering rework typical in field-service HMIs. Designers should reserve the first 4 KB sector as a CRC-protected bootloader, the next 64 KB as the primary application image, and the remainder as OTA staging and alarm log. The hardware /WP pin protects the bootloader during OTA updates.
Recomendado
Wi-Fi / BLE Module Co-Storage
Wi-Fi and Bluetooth Low Energy modules (e.g. ESP32-based or nRF52840-based designs) frequently include a companion SPI flash on the module carrier PCB, and the AT25DF641A-SH-T is a strong fit for the 8 MB variant. It stores TLS certificates, provisioning data, OTA staging images, and module firmware when the host radio SoC's internal flash is full. With 100 MHz SPI clock and Dual-I/O read, TLS certificate retrieval adds negligible latency to TLS handshakes. The /HOLD pin lets the radio SoC pause SPI transactions during critical BLE radio events without aborting the bus. SOIC-8 208 mil packaging is standard across module designs, so the part drops in without PCB changes versus W25Q64 or MX25L6406 modules.
Recomendado
Automotive Infotainment Boot (AEC-Q100 context)
While the AT25DF641A-SH-T itself is not AEC-Q100 qualified, the SOIC-8 208 mil footprint is shared by AEC-Q100 automotive SPI flash variants, and the same firmware-driver code can be reused across consumer and automotive infotainment SKUs. The 64 Mbit density holds an Android/Linux boot image plus a redundant A/B partition for fail-safe OTA updates. Designers targeting automotive should select the AEC-Q100 sister part (typically a Renesas AT25QF automotive-grade equivalent) in the same SOIC-8 208 mil package. Industrial temperature (-40 to +85 C) of the AT25DF641A-SH-T is acceptable for cabin-area (non-ECU) automotive applications such as head-unit graphics storage. For under-hood or ECU applications, use the AEC-Q100 qualified equivalent instead.
Recomendado
Test & Measurement Data Logging
Portable test and measurement instruments (handheld oscilloscopes, power-quality analyzers, and bench multimeters with logging) use the AT25DF641A-SH-T as a high-density local store for waveform captures and event logs. With 8 MB of capacity, the instrument can record several minutes of 8-bit ADC samples at 100 kS/s, or thousands of fault events with timestamps. The 256-byte page program granularity matches common sample-block sizes, and the hardware /WP pin can be wired to a "locked" mode for forensic logging where the data must be tamper-evident. Industrial temperature operation ensures reliable field use, and the SOIC-8 208 mil footprint accommodates conformal coating in outdoor deployments. Deep Power-Down (under 5 µA typical) keeps battery idle drain low between captures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para AT25DF641A-SH-T — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | AT25QF641B-SHB-T | AT25DF641A-SH-B | AT25DF081A-SH-B | W25Q64JVSSIQ | MX25L6406EZNI-10G | SST26VF064B-104I/SM |
|---|---|---|---|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Winbond | Macronix | Microchip Technology |
| Package | 8-SOIC (SOIC-W 208 mil, "SH") | 8-SOIC (SOIC-W 208 mil, "SH") - same | 8-SOIC (SOIC-W 208 mil, "SH") - same | 8-SOIC (SOIC-W 208 mil, "SH") - same | 8-SOIC (SOIC-W 208 mil) - same footprint | 8-SOIC (SOIC-W 208 mil) - same footprint | 8-SOIC (SOIC-W 208 mil, "SM") - same footprint |
| Density | 64 Mbit (8 MB) | 64 Mbit (8 MB) | 64 Mbit (8 MB) | 8 Mbit (1 MB) - lower density | 64 Mbit (8 MB) | 64 Mbit (8 MB) | 64 Mbit (8 MB) |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Max SPI Clock | 100 MHz (Single-I/O) | 100 MHz+ (Single-I/O) | 100 MHz (Single-I/O) | 100 MHz (Single-I/O) | 133 MHz (Single-I/O) | 104 MHz (Single-I/O) | 104 MHz (Single-I/O) |
| Quad-SPI Support | No (Dual-I/O only) | Yes | No (Dual-I/O only) | No (Dual-I/O only) | Yes | Yes | Yes |
| Sector Erase (smallest) | 4 KB uniform | 4 KB uniform | 4 KB uniform | 4 KB uniform | 4 KB uniform | 4 KB uniform | 4 KB uniform |
| Operating Temperature | -40 C to +85 C (industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Lifecycle Status | NRND | Active (recommended successor) | NRND | NRND | Active | Active | Active |
| Approx. Unit Price (qty 1k) | $0.82 | Similar (successor at parity) | Similar (tube vs reel) | Lower (smaller density) | $0.55-0.70 | $0.55-0.70 | $0.80-1.00 |
Principais diferenciais
- Identical footprint to the recommended Quad-SPI successor AT25QF641B-SHB-T (vs AT25QF641B-SHB-T)
- Cross-brand pin-compatible with Winbond W25Q64JVSSIQ at lower unit cost (vs W25Q64JVSSIQ)
- Higher density and same package as the lower-cost AT25DF081A-SH-B (vs AT25DF081A-SH-B)
- Industry-standard SOIC-8 208 mil pinout enables direct swap with MX25L6406E (vs MX25L6406EZNI-10G)
Notas de projeto
Place a 0.1 µF X7R ceramic decoupling capacitor within 5 mm of the VCC pin (pin 8) on the AT25DF641A-SH-T, with a wide (>=0.2 mm) trace to GND. SOIC-8 has only one VCC pin so the decoupling is single-point; do not daisy-chain VCC to other devices. Keep SCK trace length under 50 mm and avoid running SCK parallel to noisy switching traces (e.g. boost-converter SW nodes) for more than 10 mm. Series-termination is not normally needed at 100 MHz on short traces, but if your layout forces longer SCK, add a 33 Ω resistor at the host end.
Do not issue the first SPI command to the AT25DF641A-SH-T until at least tVSL (typically 30 ms) after VCC has stabilized in the 2.7-3.6 V range. Premature commands may not be acknowledged and can leave the device in an undefined state. Do not toggle /WP or /HOLD while SCK is high; both control signals must change only when SCK is low, or framing errors will occur. When writing status register bits, ensure the SRWD bit is set if you want hardware /WP to lock the status register; otherwise /WP only protects the array and not the status register.
To minimize battery drain in IoT designs, issue the Deep Power-Down command (0xB9h) before putting the host MCU to sleep. The AT25DF641A-SH-T then drops ICC below 5 µA typical. To wake up, the host must toggle /CS high-low-high (release from DPD, 0xABh) and wait tRES1 (typically 30 µs) before issuing the next read/write. Avoid holding /CS low for extended periods while the radio SoC is doing critical BLE events; instead, deassert /CS between transactions so the flash returns to standby. Bulk erase (0xC7/0x60) takes 40-80 s and draws elevated ICC; do not initiate it from a battery whose capacity margin is below 25%.
The SOIC-8 208 mil ("SH") land pattern is industry standard; pin 1 marker is a small dot on the package and the pin numbering follows the standard counter-clockwise convention viewed from above (pin 1 top-left, pin 4 GND opposite, pin 8 VCC opposite pin 1). Match the land pattern to JEDEC MS-013 or the manufacturer's SOIC-W 208 mil mechanical drawing. Hand-soldering is feasible with a fine tip; for reflow, follow JEDEC J-STD-020 MSL-3 floor-life rules (168 hours before bake-out at 125 C).
Informações de conformidade
RoHS compliant and lead-free per Renesas/Adesto datasheet and product page. Not AEC-Q100 qualified - for automotive applications select an AEC-Q100 qualified equivalent in the same SOIC-8 208 mil footprint. Lifecycle status is NRND (Not Recommended for New Designs) per Renesas product page - new designs should target AT25QF641B-SHB-T.
